General Specification - Toshiba nv Series Instruction Manual

Appendix A Specification
A.1 General Specification
Item
Operating ambient
temperature
Storage temperature
Operating ambient relative
humidity
Dust
Pollution level
Corrosive gas
Operating altitude
Resistance to vibration
(vibration immunity)
Impact resistance
(impact immunity)
Insulation resistance
Dielectric strength
Free fall
Noise immunity
Fast transient
Electrostatic discharge
Radiated electromagnetic
field
Impulse noise
EMC zone
Ground
Structure
Installation site
Cooling system
Weight
Outside dimensions
Standard satisfied
84
6F8C1220
Table A.1-1 General specification (1 of 2)
Specification
0 o C to 55 o C; 40 o C or less on average over 24 hours
-40 to 70C
10% to 95%RH, Level RH2 (no condensation)
Dust 0.3 mg/m 3
(no conductive dust permitted)
2 (usually no conductive pollution) or less
No corrosive gas permitted.
No silicone-containing material permitted.
2,000 m or less
IEC 60068-2-6, test Fc compatible, X, Y, Z
10 cycles each
IEC 60068-2-27, test Ea compatible 147 m /s
(3 orthogonal axes, 3 times each)
500 VDC Mega 10 MΩ or more
2,000 VAC 1 min
Shipping package: 1,000 mm
For product package: 300 mm
AC power: 2 kV
DC power: 2 kV (section of 10 m or less is unnecessary)
I/O power DC: 1kV (section of 10 m or less is unnecessary)
AC-I/O: 2 kV (unshielded cable)
DC-I/O: 1 kV (unshielded cable)
Analog I/O: 1 kV (unshielded cable)
4 kV (contact discharge) Level ESD-3
10 V/m
Power wire Noise voltage: 1,500 V
Pulse width: 1μs/100 ns
Zone B (including Zone A)
Category D Ground
Open type
In indoor control board
Standard: Forced air cooling
Approx. 16 kg BU825 (duplexed chassis, full slot installed)
Primary block 431.8 (W),
482.6 (W1) x 265.9 (H) x 238 (D)
IEC61131-2, JIS B 3502
CE marking
UL508
Remarks
(Note 1)
(Note 2)
IEC 61131-2
(Note 3)
(Note 4)
2
Between Power and GND
terminals
I/O: Refer to the Individual
Specification.
Between Power and GND
terminals
I/O: Refer to the Individual
Specification.
(Note 5)
W1 dimensions include the
support bracket.