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µÑ Ç Âè Í µè Ò §æ
A. . . . . . . . . . . . . .áÍÁá»Ãì
AC . . . . . . . . . . . .ä¿¿é Ò ¡ÃÐáÊÊÅÑ º
ACPI. . . . . . . . . . .Advanced Configuration and Power management Interface
APM . . . . . . . . . . .Advanced Power Management
ATA . . . . . . . . . . .AT attachment (Íé Ò §¶Ö § ÍÔ ¹ àµÍÃì à ¿«¢Í§ÎÒÃì ´ ´Ô Ê ¡ì ã ¹à¤Ã× è Í §¤ÍÁ¾Ô Ç àµÍÃì á ºº AT-compatible)
ATAPI . . . . . . . . .AT attachment packet interface
BBS . . . . . . . . . . .Bulletin board system
BIOS. . . . . . . . . . .Basic input/output system
C. . . . . . . . . . . . . .à«Åà«Õ Â Ê
CD . . . . . . . . . . . .Compact disc
CD-ROM . . . . . . .Compact disc read-only memory
cm. . . . . . . . . . . . .ૹµÔ à ÁµÃ
COM. . . . . . . . . . .Communication (ã¹¾ÍÃì µ Ê× è Í ÊÒÃ)
CMOS. . . . . . . . . .Complementary metal-oxide semiconductor
DC . . . . . . . . . . . .ä¿¿é Ò ¡ÃÐáʵç
DMA. . . . . . . . . . .Direct memory access
DPMS . . . . . . . . . .Display power-management signaling
DRAM . . . . . . . . .Dynamic random access memory
DSTN . . . . . . . . . .Double layer super twist nematic
ECP . . . . . . . . . . .Extended capabilities port
EPP . . . . . . . . . . .Enhanced parallel port
g . . . . . . . . . . . . . .¡ÃÑ Á
G . . . . . . . . . . . . .áçâ¹é Á ¶è Ç §
GB . . . . . . . . . . . .¡Ô ¡ Ð亵ì
hr . . . . . . . . . . . . .ªÑ è Ç âÁ§
Hz. . . . . . . . . . . . .àÎÔ Ã ì µ «ì
IDE. . . . . . . . . . . .Integrated drive electronics
I/O . . . . . . . . . . . .Input/output
IRQ . . . . . . . . . . .Interrupt request line
ISA . . . . . . . . . . . .Industry Standard Architecture
144 ¤Ù è Á × Í ¼Ù é ã ªé
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