LG G7100 Service Manual
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1. INTRODUCTION...................................5
1.1 Purpose ................................................
1.2 Regulatory Information ..........................
1.3 Abbreviations .........................................
2. PERFORMANCE ..................................9
2.1 H/W Feature ..........................................
2.2 Technical Specification ..........................
3. TECHNICAL BRIEF ............................16
3.2 Receiver Part .......................................
3.3 Synthesizer Part ..............................
3.4 Transmitter Part ....................................
3.5 13 MHz Clock .......................................
3.7 Digital Main Processor ..........................
3.8 Analog Main Processor .........................
3.9 Power Management IC .........................
3.10 Memories ........................................... .
3.11 Display and Interface ......................... .
3.13 Microphone ........................................ .
3.14 Earpiece ..........................................
3.15 Hands-free Interface .......................
3.16 Headset Jack Interface .......................
3.19 Speaker & MIDI IC ..............................
3.20 CAMERA IC ..................................

Table Of Contents

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4. TROUBLE SHOOTING ................... 53
4.1 RF Components .................................
4.2 Rx Trouble ..........................................
4.3 Tx Trouble ..........................................
4.4 Power On Trouble ..............................
4.5 Charging Trouble ...............................
4.6 LCD Trouble .......................................
4.7 Receiver Trouble ................................
4.8 Speaker Trouble .................................
4.9 MIC Trouble .......................................
4.10 Vibrator Trouble ...............................
4.12 Folder on/off Trouble ....................
4.13 SIM Detect Trouble ..........................
4.14 Earphone Trouble ............................
4.15 HFK Trouble .....................................
4.16 CAMERA Trouble ........................
5.1 Disassembly .......................................
CALIBRATION ................................ 118
6.1 Download ...........................................
6.2 Calibration ..........................................
7. BLOCK DIAGRAM ........................... 128
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Table of Contents
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Summary of Contents for LG G7100

  • Page 1: Table Of Contents

    Table Of Contents 1. INTRODUCTION........…5 4. TROUBLE SHOOTING ....… 53 1.1 Purpose ..........…. 4.1 RF Components ......…. 1.2 Regulatory Information ......4.2 Rx Trouble .......... 1.3 Abbreviations ......... 4.3 Tx Trouble .......... 4.4 Power On Trouble ......…. 4.5 Charging Trouble ......…. 2.
  • Page 2 8. CIRCUIT DIAGRAM ......129 13. EXPLODED VIEW & REPLACEMENT PART LIST ...…. 149 8.1 MAIN ..........….. 13.1 Exploded View ......…… 8.2 Memory & MMI & PMIC ..………. 13.2 Accessory .......…….. 8.3 MMI …..........…. 13.3 Replacement Parts 8.4 Audio ………........….. <...
  • Page 3: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
  • Page 4 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.
  • Page 5: Abbreviations

    1. INTRODUCTION 1.3 Abbreviations For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current – Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milli watt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory Electrostatic Discharge...
  • Page 6 1. INTRODUCTION Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Surface Acoustic Wave Subscriber Identity Module Sending Loudness Rating SRAM Static Random Access Memory PSRAM Pseudo SRAM...
  • Page 7: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Features Item Feature Comment Li-ion, 770 mAh Standard Battery Size: 35 × 62 × 3.8mm Weight: 16g Under the minimum current consumption environment Stand by Current (such as paging period 9), the level of standby current is below 4mA.
  • Page 8 2. PERFORMANCE Item Feature Comment Receiver Travel Adapter MIDI 32 Poly Camera VGA 640 × 320 pixel Options Hands-free kit, CLA, Data Kit - 10 -...
  • Page 9: Technical Specification

    2. PERFORMANCE 2.2 Technical Specification Item Description Specification TX: 890 + n × 0.2 MHz RX: 935 + n × 0.2 MHz (n=1~124) EGSM Frequency Band TX: 890 + (n-1024) × 0.2 MHz RX: 935 + (n-1024) × 0.2 MHz (n=975~1024) TX: 1710 + (n-512) ×...
  • Page 10 2. PERFORMANCE Item Description Specification GSM, EGSM Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 6,000 Output RF Spectrum (due to modulation) Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 6,000...
  • Page 11 2. PERFORMANCE Item Description Specification Offset from Carrier (kHz). Max. dBm Output RF Spectrum (due to switching transient) 1,200 1,800 Spurious Emissions Conduction, Emission Status GSM, EGSM BER (Class II) < 2.439% @-102 dBm Bit Error Ratio BER (Class II) < 2.439% @-100 dBm RX Level Report Accuracy ±3 dB 8±3 dB...
  • Page 12 2. PERFORMANCE Item Description Specification Frequency (Hz) Max.(dB) Min.(dB) 1,000 Receiving Response 3,000 3,400 4,000 * Mean that Adopt a straight line in between 300 Hz and 1,000 Hz to be Max. level in the range. STMR 13±5 dB Stability Margin >...
  • Page 13 2. PERFORMANCE Item Description Specification Fast Charge : < 500 mA Charge Current Slow Charge : < 60 mA Antenna Bar Number Power -85 dBm ~ -90 dBm ~ -86 dBm -95 dBm ~ -91 dBm Antenna Display -100 dBm ~ -96 dBm -105 dBm ~ -101 dBm ~ -105 dBm Battery Bar Number...
  • Page 14: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 General Description of RF parts The RF parts consists of a transmitter part,a receiver part,a synthesizer part,a voltage supply part,a VCTCXO part. And the main RF Chipset CX74017[U603]is a single-chip dual-band transceiver for the extended global system for mobile communication[E-GSM900MHz]/ Digital communication system[DCS1800MHz] voice and data transfer applications.
  • Page 15 3. TECHNICAL BRIEF A. RF Front End RF front end consists of Antenna Switch(FL405), an integrated two saw filters,(FL601),dual band LNAs integrated in transceiver. The Received RF signals(GSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz) are fed into the antenna or Mobile switch. An antenna matching circuit is between the antenna and the mobile switch.
  • Page 16 3. TECHNICAL BRIEF B. Demodulator and baseband processing In direct conversion receiver there is only one mixer down-converting received RF signal to BB signal directly. The gain down converting mixer is 40dB at high gain mode and 22dB at low gain mode. The Rx gain setting is done in the AGC algorithm.
  • Page 17: Synthesizer Part

    3. TECHNICAL BRIEF 3.3 Synthesizer Part CX74017 2V7_VTCXO 13MHz vco = (N+3.5+FN/2^22) ref/R 13MHz Fractional-N REFCLK Base Band Block Figure.3-2 Synthesizer Block diagram The CX74017 includes a fully integrated UHF VCO with an on-chip LC tank. A single sigma-delta fractional-N synthesizer can phase lock the local osillator used in both transmit and receive path to a precision frequency reference input.
  • Page 18: Transmitter Part

    3. TECHNICAL BRIEF 3.4 Transmitter Part The Transmitter part contains CX74017 active parts, PAM and Antenna Switch. The CX74017 active part consists of a vector modulator and offset phase-locked loop block(OPLL) including down-converter, phase detector, loop filter and dual band transmit VCO which can operate at either final RF output frequency.
  • Page 19 3. TECHNICAL BRIEF A. IF Modulator The baseband converter(BBC) within the GSM chipset generates I and Q baseband signals for the transmit vector modulator. The modulator provides more than 40dBc of carrier and unwanted side- band rejection and produces a GMSK modulated signal. The baseband software is able to cancel out differential DC offsets in the I/Q baseband signals caused by imperfections in the D/A converters.
  • Page 20 3. TECHNICAL BRIEF Figure 3-4. Power Amplifier Block Diagram - 22 -...
  • Page 21: 13 Mhz Clock

    3. TECHNICAL BRIEF 3.5 13 MHz Clock The 13 MHz clock(X600) consists of a TCXO(Temperature Compensated Crystal Oscillator) which oscillates at a frequency of 13 MHz. It is used within the CX74017 RF Main Chip,BB Analog chip-set(U100 AD6521), Digital(U101 AD6525), CAMERA IC(U501 CLC344E) and MIDI(U200) Chipset.
  • Page 22: Power Supplies And Control Signals

    3. TECHNICAL BRIEF 3.6 Power Supplies and Control Signals There are two regulators used in the phone to provide RF power. One is contained inside of ADP3522(U203), Power management IC to provide the power for the VCTCXO(X600). The other is used to provide the power for remaining RF circuits.
  • Page 23: Digital Main Processor

    3. TECHNICAL BRIEF 3.7 Digital Main Processor AD6525 Figure 3-7. Example of System interconnection of AD6525 External Interface - 25 -...
  • Page 24 3. TECHNICAL BRIEF • AD6525 is an ADI designed processor. • AD6522 consists of 1. BUS arbitration Subsystem • EBUS, RBUS, PBUS, SBUS, DMABUS, IOBUS 2. DSP Subsystem • ADI DSP, Viterbi coprocessor, Ciphering unit, Cache memory/controller system 3. MCU Subsystem •...
  • Page 25 3. TECHNICAL BRIEF 3.7.1 Interconnection with external devices A. RTC block interface Countered by external X-TAL The X-TAL oscillates 32.768KHz B. LCD module interface The LCD module is controlled by CAMERA IC, CLC344E. If CLC344E is in the state of by-pass mode, the LCD control signals from AD6525 are by-passed through CLC344E.
  • Page 26 3. TECHNICAL BRIEF C. RF interface The AD6522 control RF parts through TX_EN, RX_EN, BAMDSEL1, DCSSEL, GSMSEL, VSYNTHEN, TXPA, PLL_LE, PLL_DATA, PLL_CLK, PLL_PD Table 3-4. Signal Name Description Reset TX_EN Transmitter Enable/Disable RX_EN Receiver Enable/Disable BANDSEL1 PAM Band Select DCSSEL Antenna switch Band Select(DCS Band) GSMSEL Antenna switch Band Select(GSM Band)
  • Page 27 3. TECHNICAL BRIEF Figure 3-8. SIM Interface of AD6525 E. Key interface Include 5 column and 5 row. The AD6522 detect key press by interrupt. F. ADP3522 interrupt There are two interrupts, EOC and CHRDET EOC: End of Charge. AD6525 makes charging operation stop when high signal is inputted. CHRDET: This pin is activated when the charger is inserted.
  • Page 28: Analog Main Processor

    3. TECHNICAL BRIEF 3.8 Analog Main Processor AD6521 Figure 3-9. AD6521 - 30 -...
  • Page 29 3. TECHNICAL BRIEF • AD6521 is an ADI designed processor. • AD6521 consists of 1. BB Transmit section • This section generates in-phase and quadrature BB modulated GMSK signals. • Digital GMSK modulator, 10-bit DACs, Reconstruction Filter 2. BB Receive section •...
  • Page 30 3. TECHNICAL BRIEF A. BB Transmit section This section generates in-phase and quadrature BB modulated GMSK signals (BT = 0.3) in accordance with GSM 05.05 Phase 2 specifications. The transmit channel consists of a digital GMSK modulator, a matched pair of 10-bit DACs and a matched pair of reconstruction filter.
  • Page 31 3. TECHNICAL BRIEF Figure 3-10a. Voice band circuit Diagram - 33 -...
  • Page 32 3. TECHNICAL BRIEF Figure 3-10b. Voice band circuit Diagram - 34 -...
  • Page 33 3. TECHNICAL BRIEF - 35 -...
  • Page 34: Power Management Ic

    3. TECHNICAL BRIEF 3.9 Power Management IC Figure 3-11. ADP3522 inner block diagram Table 3-6 Description VSIM 2.85V(is provided to SIM card) VCORE 1.8V(is provided to the AD6525 & AD6521’s digital core) VRTC 2.0V(is provided to the RTC and Backup Battery) 2.55V(is provided to the AD6521 I/O and used as microphone bias) VTCXO 2.75V(is provided to VCTCXO)
  • Page 35 3. TECHNICAL BRIEF A. Power up sequence logic The ADP3522 controls power on sequence. B. Power on sequence If a battery is inserted, the battery powers the 6 LDOs. Then if PWRONKEY is detected, the LDOs output turn on. REFOUT is also enabled, Reset is generated and send to the AD6525. C.
  • Page 36 3. TECHNICAL BRIEF G. TA (Travel Adaptor) Input voltage : AC 85V ~ 264V, 47~63Hz Output voltage : DC 5.2V(±0.2 V) Output current : Max 750mA(±50mA ) H. Battery Li-ion battery : Max 4.2V, Nom 4.0V Standard battery : Capacity - 740mAh, Li-ion - 38 -...
  • Page 37: Memories

    3. TECHNICAL BRIEF 3.10 Memories Figure 3-12. Memory block Diagram • 128Mbit flash memory + 32Mbit PSRAM • 16 bit parallel data bus • ADD01 ~ ADD22. • 2 Chip enables for Flash memory select. • RF Calibration data, Audio parameters and battery calibration data etc are stored in Flash memory area.
  • Page 38: Display And Interface

    Sub LCD Display Format 96 X 64 dots Sub LCD Backlight G7100 Main LCD supports one 65536 color LCD module. There are the control signals : L_MAIN_LCD_CS (which is derived from CLC344E, this acts as the chip select enable for the LCD), L_WR, L_ADD1(LCD_RS) and LCD_RES.
  • Page 39 3. TECHNICAL BRIEF Figure 3-13. Keypad Switches and Scanning - 41 -...
  • Page 40: Microphone

    3. TECHNICAL BRIEF 3.13 Microphone The microphone is placed to the front cover and contacted to main PCB. The audio signal is passed to VINNORP (#J10) and VINNORN (#K10) pins of AD6525. The voltage supply 2V55_VAN is output from ADP3522, and is a bias voltage for the VINNORP. The VINNOR or VINAUX signal is then A/D converted by the Voiceband ADC part of AD6521.
  • Page 41: Earpiece

    3. TECHNICAL BRIEF 3.14 Earpiece The earpiece is driven directly from AD6521 VOUTNORP (#K8) and VOUTNORN (#K7) pins and the gain is controlled by the PGA in an AD6521. The earpiece is placed in the folder cover and contacted to LCD PCB. Figure 3-15.
  • Page 42 3. TECHNICAL BRIEF Figure 3-16a. Hands-free & Headset Jack Interface - 44 -...
  • Page 43 3. TECHNICAL BRIEF - 45 -...
  • Page 44: Key Back-Light Illumination

    3. TECHNICAL BRIEF 3.17 Key Back-light Illumination In key back-light illumination, there are 12 Blue LEDs in Main Board, which are driven by KEY_BACKLIGHT line from AD6525. Figure 3-17. Key Back-Light Illumination - 46 -...
  • Page 45: Lcd Back-Light Illumination

    3. TECHNICAL BRIEF 3.18 LCD Back-light Illumination In LCD Back-light illumination, there is an driver in LCD Board, which is driven by LCD_backlight line from AD6525. The sub-LCD, organic light emitting diode (OLED), doesn’t need back-light illumination. Figure 3-18. Main LCD Backlight Illumination - 47 -...
  • Page 46: Speaker & Midi Ic

    3. TECHNICAL BRIEF 3.19 Speaker & MIDI IC LG-G7100 don’t use buzzer. but uses the loud speaker and Melody IC which makes the robust joyful melody sounds. • Melody IC control 2GPIO are assigned to control melody IC. Melody data is transferred to melody IC.
  • Page 47: Camera Ic

    3. TECHNICAL BRIEF 3.20 CAMERA IC Figure 3-20. CLC344E block diagram • External Clock Source Up to 27 MHz • Internal Clock Divider 1/2, 1/3, 1/4 for Sensor Clock Output • Support Standard SRAM Interface (6bit Address & 16bit Data) for CPU Interface •...
  • Page 48 3. TECHNICAL BRIEF The camera IC, CLC344E, is controlled through _RD, _WR, CAM_INT, CAM_HOLD, CAM_RST, ADD[1-6], DATA[0-15] by AD6525. In by-pass mode, CLC344E bypasses all LCD control signal from AD6525 to LCD module. In operating mode, CLC344E samples the image data from camera sensor connected on CN501 through C_CD[0-7], C_MCLK, C_PCLK, C_HS, C_VS, C_SDA, C_SCK, C_RST signals and controls the LCD module.
  • Page 49 3. TECHNICAL BRIEF Figure 3-21a. CLC344E - 51 -...
  • Page 50 3. TECHNICAL BRIEF - 52 -...
  • Page 51: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RF Components SW600 FL600 FL601 U601 U603 X600 U602 Figure 4-1 Table 4-1. RF COMPONENTS Reference Description Reference Description U603 RF Main Chipset FL601 Dual SAW Filter SW600 Mobile S/W X600 VCTCXO FL600 Ant.
  • Page 52: Rx Trouble

    4. TROUBLE SHOOTING 4.2 RX Trouble Checking Flow Checking Points START HP8922 : Test mode (PCS band) 62 CH, 7 level setting (TCH) 62 CH, -60dBm setting (BCCH) ④ ⑤ 1. Check Regulator Circuit ① 2. Check ② VCTCXO Circuit ⑥...
  • Page 53 4. TROUBLE SHOOTING 4.2.1 Checking Regulator Circuit Test Points Checking Flow U600 вывод 1 Check Pin 6 Pin 6 High? Change the board RF 2.85V OK? Check Pin 1 Regulator Circuit is OK Replace U600 See next page to check VCTCXO U600 вывод...
  • Page 54 4. TROUBLE SHOOTING 4.2.2 Checking VCTCXO Circuit Test Points Checking Flow VCTCXO Circuit OK Check Pin 3 See next page to check 13MHz OK? Refer to graph 4-2 ANT SW & Mobile SW Check Pin 4 Refer to graph 4-2 2.75V OK? Change X600 Check U203,ADP3522...
  • Page 55 4. TROUBLE SHOOTING 4.2.3 Checking PLL Control Signal Test Points Checking Flow Check PLL_PD Level is High? Download the SW PLL_CLK Check PLL_CLK, PLL_LE PLL_DATA, PLL_LE PLL_DATA Similar? Download the SW Check if there is any PLL_PD major difference * Refer or Graph 4-3 Control Signal is OK See next page to check Figure 4-5...
  • Page 56 4. TROUBLE SHOOTING 4.2.4 Checking Ant SW & Mobile SW Checking Flow For these 2 test case, No call Connection is Check SW600 Pin 1,2 with needed Open Changing SW600 RF Cable connected Check SW600 Pin 1,2 with Short Changing SW600 No RF Cable connected Check C608.2,C607.2 Check whether Ant SW set...
  • Page 57 4. TROUBLE SHOOTING Test Points Ant sw& Mobile sw part Circuit Diagram SW600 Pin 1 SW600 Pin 2 FL600 L601 C608 Pin 2 C607 Pin 2 L604 Figure 4-6 Table 4-2. ANT SW Control Logic ANT SW EGSM TX DCS TX EGSM,DCS RX - 59 -...
  • Page 58 4. TROUBLE SHOOTING 4.2.5 Checking SAW Filter Circuit Checking Flow Changing L604 for GSM Pin1 : ~ -61dBm Check RF Level of Saw Changing L601 for DCS Pin3 : ~ -61dBm Filter Input For GSM : FL601.1 Check the parts are For DCS : FL601.3 well soldered Check RF Level of Saw...
  • Page 59 4. TROUBLE SHOOTING Test Points FL601 Pin 1 FL601 Pin 3 FL601 Pin 5 FL601 Pin 7 Figure 4-7 SAW filter part Circuit Diagram - 61 -...
  • Page 60 4. TROUBLE SHOOTING 4.2.5 Checking RX IQ Test Points Checking Flow C658 C659 Check C658,C659. Replace U603 Similar? Check if there is any Major Difference * Refer to graph 4-4 Redownload the Software and calibrate Figure 4-8 Waveform ZOOM Graph 4-4 - 62 -...
  • Page 61: Tx Trouble

    4. TROUBLE SHOOTING 4.3 TX Trouble Test Points Checking Flow START HP8922 : Test mode (PCS band) 62 CH, 7 level setting (TCH) 62 CH, -60dBm setting (BCCH) ④ Spectrum analyzer setting ⑤ Oscilloscope setting 1. Check ① Regulator Circuit ②...
  • Page 62 4. TROUBLE SHOOTING 4.3.1 Checking Regulator Circuit Test Points Checking Flow U600 Pin 1 Check Pin 6 Pin 6 High? Change the board RF 2.85V OK? Check Pin 1 Regulator Circuit is OK Replace U600 See next page to check VCTCXO U600 Pin 6 Figure 4-10...
  • Page 63 4. TROUBLE SHOOTING 4.3.2 Checking VCTCXO Circuit Test Points Checking Flow VCTCXO Circuit OK Check Pin 3 13MHz OK? See next page to check Refer to graph 4-2 ANT SW & Mobile SW Check Pin 4 Refer to graph 4-2 2.75V OK? Change X600 Check U203,ADP3522...
  • Page 64 4. TROUBLE SHOOTING 4.3.3 Checking PLL Control Signal Test Points Checking Flow Check PLL_PD Level is High? Download the SW PLL_CLK Check PLL_CLK, PLL_LE PLL_DATA, PLL_LE Similar? Download the SW PLL_DATA Check if there is any major difference PLL_PD * Refer or Graph 4-3 Control Signal is OK See next page to check Figure 4-12...
  • Page 65 4. TROUBLE SHOOTING 4.3.4 Checking Ant SW & Mobile SW Checking Flow For these 2 test case, No call Connection is needed Check SW600 Pin 1,2 with Open Changing SW600 RF Cable connected Check SW600 Pin 1,2 with Short Changing SW600 No RF Cable connected Check C608.2,C607.2 Check whether Ant SW set...
  • Page 66 4. TROUBLE SHOOTING Test Points SW600 Pin 1 SW600 Pin 2 FL600 L601 C608 Pin 2 C607 Pin 2 L604 Figure 4-13 Waveform DCSSEL DCSSEL GSMSEL GSMSEL Graph 4-5a DCS TX mode Graph 4-5b GSM TX mode - 68 -...
  • Page 67 4. TROUBLE SHOOTING 4.3.5 Checking PAM Control Signal Test Points Checking Flow BANDSEL1 Check TXRAMP, TXPA, Similar? Download the SW BANDSEL1. Check if there is any major difference Refer to Graph 4-6 Control Signal is OK See next page to check TX IQ TXRAMP TXPA...
  • Page 68 4. TROUBLE SHOOTING 4.3.6 Checking TX IQ Test Points Checking Flow C660 C661 Check C660,C661. Similar? Download the SW Check if there is any major difference Refer to Graph 4-7 TX IQ signal is OK See next page to check RF TX Level Figure 4-11 Waveform...
  • Page 69 4. TROUBLE SHOOTING 4.3.7 Receiver and Transmitter RF Level CX74017 FAR-G6CS-1G8425-L250 ② ④ -63 dBm -65 dBm DCS : 1805 ~ 1880MHz GSM : 925 ~ 960MHz RXIP RXIN ① -62 dBm -64 dBm RXQP ③ RXQN 2V7_VTCXO 13MHz f vco = (N+3.5+FN/2^22 ) f ref/R 13MHz Fractional-N REFCLK...
  • Page 70 4. TROUBLE SHOOTING Test Points ① ⑥ ② ④ ③ ⑦ ⑧ ⑤ Figure 4-12 - 72 -...
  • Page 71: Power On Trouble

    4. TROUBLE SHOOTING 4.4 Power On Trouble SETTING : Connect PIF, and set remote switch off at PIF Checking Flow START Check Battery voltage Charge or Change Battery >3.35V ? Push power-on key Check the contact of and check the level change power-key or dome of U203 pin 30 switch...
  • Page 72 4. TROUBLE SHOOTING Power On part Circuit Diagram This signal should go HIGH when the power-on procedure These powers is completed should be necessary to power Power-On Key Signal Input - 74 -...
  • Page 73 4. TROUBLE SHOOTING Test Points P21 : 1V8_VCORE P25 : 2V75_VTCTO P20 : 2V8_VMEM P3 :2V0_VRTC P29 : RPWRON P30 : POWRKEY Figure 4-13 - 75 -...
  • Page 74: Charging Trouble

    4. TROUBLE SHOOTING 4.5 Charging Trouble SETTING : Connect the battery and the charging adaptor(TA) to the phone Checking Flow START Charging Connector(CN300) Resolder CN300 well-soldered? Voltage at Pin 7 of U203 The charging adaptor(TA) is out of order. = 5.2V? Change the charging adaptor Are R218,Q200,D200 Resolder R218,Q200,D200...
  • Page 75 4. TROUBLE SHOOTING Test Points Q200 D200 R218 Figure 4-14 Charging part Circuit Diagram The charging current will flow into this direction. - 77 -...
  • Page 76: Lcd Trouble

    4. TROUBLE SHOOTING 4.6 LCD Trouble. Checking Flow START Is the connection of LCD module Reassemble LCD module with FPCB with connector on FPCB OK? connector Is the connection of FPCB Reassemble FPCB with LCD connector with LCD connector on PCB OK? on PCB Check the soldering of CN500 on Resolder CN500...
  • Page 77 4. TROUBLE SHOOTING Test Points Figure 4-15a Figure 4-15b LCD Connector on PCB LCD Module PIN 1 Connection of Pin1 on LCD mudule Connection of CN500 on PCB Figure 4-15c Figure 4-15d LCD Connector on LCD PCB FPCB Ass’y - 79 -...
  • Page 78: Receiver Trouble

    4. TROUBLE SHOOTING 4.7 Receiver Trouble SETTING : After initialize Agilent 8960, Test EGSM, DCS mode Checking Flow START Check pin 33, Replace the Main board. pin 35 of CN500. Are these Check the soldering ABB is out of order. CN500 voltage almost 1.23V? Resoldering CN500...
  • Page 79 4. TROUBLE SHOOTING Test Points Receiver part Circuit Diagram PIN 35,33 Figure 4-16 - 81 -...
  • Page 80: Speaker Trouble

    4. TROUBLE SHOOTING 4.8 Speaker Trouble SETTING : Connect PIF to the phone, and Power on. Enter the engineering mode, and set "Melodyon" at Buzzer of BB test menu. Checking Flow START Check the Check the soldering C201,C211. Are these Replace the U203 of U203 voltage = 2.8V?
  • Page 81 4. TROUBLE SHOOTING Test Points U200 C201 U201 R200 Figure 4-17 R201 R202 R203 C209 C208 Speaker part Circuit Diagram - 83 -...
  • Page 82: Mic Trouble

    4. TROUBLE SHOOTING 4.9 MIC Trouble SETTING : After initialize Agilent 8960, Test EGSM, DCS mode Checking Flow START Check the C121 Check the voltage at Voltage is almost Replace the U203 Pin23 of U203 is 2.2V DC 2.55V DC Resoldering R115 Check the C147 voltage almost 1.9V,...
  • Page 83 4. TROUBLE SHOOTING Test Points R112 R111 R113 C121 R115 C145 C147 Figure 4-18 - 85 -...
  • Page 84 4. TROUBLE SHOOTING MIC part Circuit Diagram VINNORP VINNORN - 86 -...
  • Page 85: Vibrator Trouble

    4. TROUBLE SHOOTING 4.10 Vibrator Trouble SETTING : After Initialize Agilent 8960, Test in EGSM, Connect PIF to the phone, and Power on. Enter The engineering mode, and set ’Vibrator on’ at Vibration of BB test menu. Checking Flow When the vibrator works, START the signal at this point goes to 2.8V Is the Voltage at pin 3...
  • Page 86 4. TROUBLE SHOOTING Test Points D300 R303 Q300 R301 Figure 4-19a Figure 4-19b VIB on LCD module Vibrator part Circuit Diagram When the vibrator works, the signal at this point goes to 0V When the vibrator works, the signal at this point goes to 2.8V When the vibrator works, the current flow...
  • Page 87: Key Backlight Led Trouble

    4. TROUBLE SHOOTING 4.11 Key Backlight LED Trouble SETTING : Connect PIF to the phone, and power on, Enter engineering mode, and set ‘Backlight on’ at Backlight of BB test menu Checking Flow START PIF Power On Is the Voltage at pin 2 at Q301 Check the soldering R329,R331 about 1.3 V ? Are all LEDs LD300-LD303,...
  • Page 88 4. TROUBLE SHOOTING Test Points LD301, R306 LD300, R305 LD303, R309 LD302, R307 LD309, R311 Q301 LD306, R317 LD308, R321 Figure 4-20b LD307, R318 LD311, R320 LD310, R319 LD313, R326 LD312, R324 Figure 4-20a Key backlight part Circuit Diagram - 90 -...
  • Page 89: Folder On/Off Trouble

    4. TROUBLE SHOOTING 4.12 Folder on/off Trouble Checking Flow START Check magnet in the Place the magnet properly folder side Voltage at Pin 1 of Voltage at Pin 20 of Go to the Power On U300/U301 = 2.8 V? U203 = 2.8 V? trouble Resolder U300/U301 Open Folder.
  • Page 90 4. TROUBLE SHOOTING Test Points Figure 4-21 R300 U301 R304 U300 Folder on/off part Circuit Diagram - 92 -...
  • Page 91: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.13 SIM Detect Trouble SETTING : Insert the SIM into J100, Connect PIF to the phone, and power on Checking Flow START Does the SIM Change the SIM. Our phone not supports 5V SIM only supports 3V? Voltage at Pin 1 of Voltage at Pin 18 of Replace U203...
  • Page 92 4. TROUBLE SHOOTING Test Points J100 Figure 4-22 SIM part Circuit Diagram - 94 -...
  • Page 93: Earphone Trouble

    4. TROUBLE SHOOTING 4.14 Earphone Trouble SETTING : After initialize Agilent 8960, Test EGSM,DCS mode Checking Flow START Insert earphone to the phone Earphone detect problem Does the audio profile of the phone ① change to the earphone mode? Audio path problem Set audio part of the test equipment to echo mode ④...
  • Page 94 4. TROUBLE SHOOTING Earphone detect problem ① Check voltage Check the Check the Replace U403 at pin 1 at U403 2.8V? soldering U403 soldering J400 Resoldering U403 Resoldering J400 ④ Earphone receiving path problem ② Check the voltage Check the voltage Replace the Main of pin 5 of U400.
  • Page 95 4. TROUBLE SHOOTING Earphone sending path problem ③ Check the voltage Check the C412 voltage of Pin20 of U203. Replace U203 is almost 1.6V DC? Is it 2.8V DC? Resoldering R417,R422 Check the voltage Check the soldering of Pin9 of U401. Replace U401 U401 Is it almost 1.67?
  • Page 96 4. TROUBLE SHOOTING Earphone part Circuit Diagram - 98 -...
  • Page 97 4. TROUBLE SHOOTING Test Points U403 U400 C412 R417 R422 C409 U401 Figure 4-23a J400 Figure 4-23b - 99 -...
  • Page 98: Hfk Trouble

    4. TROUBLE SHOOTING 4.15 HFK Trouble SETTING : After initializing GSM test equipment, connect PIF to the phone, and Power on Checking Flow START Connect HFK to the phone HFK detect problem Does the audio Resolder RA300 & Voltage at pin 3 of profile of the phone CN300 RA300 is 0 V?
  • Page 99 4. TROUBLE SHOOTING HFK Receiving path problem ① Is the signal level at Is the signal level at PIN9 & 10 of CN300 a few tens Pin3 & Pin9 of U400 a few tens Redownload SW of hundred mV(AC)? of hundred mV(AC)? Does it work well? Resolder or Replace Check the HFK again...
  • Page 100 4. TROUBLE SHOOTING HFK Sending path problem ② Is the signal level at PIN1 of CN300 a few tens Resolder CN300 of hundred mV(AC)? Is the signal level at PIN11 of U401 a few tens Replace the U401 of hundred mV(AC)? Does it work well? Redownload SW Change the main board...
  • Page 101 4. TROUBLE SHOOTING HFK part Circuit Diagram - 103 -...
  • Page 102 4. TROUBLE SHOOTING - 104 -...
  • Page 103 4. TROUBLE SHOOTING Test Points CN300 U400 U401 Figure 4-24a Figure 4-24b CN300 - 105 -...
  • Page 104: Camera Trouble

    4. TROUBLE SHOOTING 4.16 CAMERA Trouble SETTING : Connect PIF, and set remote switch ON at PIF Checking Flow START Does the LCD itself Go to the LCD trouble has No trouble? Set the camera button ON Change the Check the voltage Check the voltage main board Of Pin3 of Q500...
  • Page 105 4. TROUBLE SHOOTING ① Check the soldering of Resolder CN501 CN501 on PCB Check the soldering of Resolder the resisters serial resisters of CN501 Does the image appears Change the camera module on LCD? Camera will work properly - 107 -...
  • Page 106 4. TROUBLE SHOOTING - 108 -...
  • Page 107 4. TROUBLE SHOOTING Test Points R537 CN501 R518 R523 R522 R521 R539 R538 Q500 R534 R541 R524 R525 R519 R545 R533 R536 Figure 4-25a Figure 4-25b - 109 -...
  • Page 108: Disassembly Instruction

    5. DISASSEMBLY INSTRUCTION 5. DISASSEMBLY INSTRUCTION 5.1 Disassembly - 110 -...
  • Page 109 5. DISASSEMBLY INSTRUCTION - 111 -...
  • Page 110 5. DISASSEMBLY INSTRUCTION - 112 -...
  • Page 111 5. DISASSEMBLY INSTRUCTION - 113 -...
  • Page 112 5. DISASSEMBLY INSTRUCTION - 114 -...
  • Page 113 5. DISASSEMBLY INSTRUCTION - 115 -...
  • Page 114 5. DISASSEMBLY INSTRUCTION - 116 -...
  • Page 115 5. DISASSEMBLY INSTRUCTION - 117 -...
  • Page 116: Download And Calibration

    6. DOWNLOAD AND CALIBRATION 6. DOWNLOAD AND CALIBRATION 6.1 Download A. Download Setup Figure 6-1 describes Download setup UART (If you have battery, no TA is needed) Figure 6-1. Download Setup - 118 -...
  • Page 117 6. DOWNLOAD AND CALIBRATION B. Download Procedure 1. Access Flash loader program in PC and select Erase.(Don’t check OWCD) 1. Select Erase 2. Check 3. Don’t Check OWCD 2. Press Start and Wait until Erase is completed. 1. Press Start and Wait - 119 -...
  • Page 118 6. DOWNLOAD AND CALIBRATION 3. Change Address and Size(Address : 18000000, Size : 0x800000), and Press Start and Wait until Erase is completed again. 1. Change Address and Size 3. Press Start and 2. Don’t Check Wait OWCD 4. Press Write to start Download and press Key to choose software (AlchemyData.mot) 1.
  • Page 119 6. DOWNLOAD AND CALIBRATION 5. Choose software 1. Select File 2. Press Open 6. Wait until converting from MOT to BIF is completed(Don’t check OWCD) 2. Wait until completion 1. Don’t Check OWCD - 121 -...
  • Page 120 6. DOWNLOAD AND CALIBRATION 7. Press Start and Power on the phone using JIG remote Power on(Switch 1) 1. Press Start 2. Turn on Switch VBAT 8. Wait until Sending Block is completed 1. Wait Until Sending Block is completed - 122 -...
  • Page 121 6. DOWNLOAD AND CALIBRATION 9. Press Write to start Download and press Key to choose software(CodeData.mot) 1. Press 2. Press 10. Choose software 1. Press Start 2. Turn on Switch VBAT - 123 -...
  • Page 122 6. DOWNLOAD AND CALIBRATION 11. Wait until Sending Block is completed 1. Wait Until Sending Block is completed - 124 -...
  • Page 123: Calibration

    6. DOWNLOAD AND CALIBRATION 6.2 Calibration A. Equipment List Equipment for Calibration Type / Model Band Wireless Communication Test Set HP-8960 Agilent RS-232 Cable and Test JIG RF Cable Power Supply HP-66311B Agilent GPIO interface card HP-GPIB Agilent Calibration & Final test software Test SIM Card PC (for Software Installation) Pentium Ⅱ...
  • Page 124 6. DOWNLOAD AND CALIBRATION JTAG2 JTAG1 Status ADI-REMOTE TI-REMOTE POWER VBAT UART Status POWER Figure 6-3 The top view of Test JIG C. Test Jig Operation Power Source Description Power Supply Usually 4.0V Travel Adaptor Use TA, name is TA-20G(24pin) Table 6-2 Jig Power Switch Number Name...
  • Page 125 6. DOWNLOAD AND CALIBRATION 1. Connect as Fig 6-2(RS232 serial cable is connected between COM port of PC and MON port of TEST JIG, in general) 2. Set the Power Supply 4.0V 3. Set the 3 of DIP SW ON state always 4.
  • Page 126: Block Diagram

    7. BLOCK DIAGRAM 7. BLOCK DIAGRAM LCD module L_ADD1 L_DATA[15:0] CAMERA Vibrator RF Block 2.85V ADP3330 Digital Baseband Processor PMIC Charging DBB(AD6525) Battery (ADP3522) block Charging ADD Bus[22:1] ADD0 DATA[15:0] DATA[8:15] Voiceband Flash memory MIDI Block Baseband Codec SRAM (ML2870+LM4890) Connector Connector ABB(AD6521)
  • Page 127: Circuit Diagram

    Sheet/ J100 Sheets MODEL G7100 GND1 Designer SIM_RST SIM_DATAOP SIM_CLK GND5 GND2 GND4 GND3 Checked DRAWING MAIN C130 NAME C144 C143 1000p Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. V1.1 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 129 -...
  • Page 128: Memory & Mmi & Pmic

    AGND 12 DRVGND DGND1 45 DGND2 Section Date Sign & Name Sheet/ Sheets MODEL G7100 Designer Checked DRAWING MEMORY & MIDI&PMIC NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. V1.1 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 130 -...
  • Page 129: Mmi

    R331 C315 IMX9T110 0.01u 100K R327 R325 Section Date Sign & Name Sheet/ Sheets MODEL G7100 KEY BACKLIGHT Designer Checked DRAWING NAME Approved DRAWING Iss. Notice No. Date Name V1.1 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 131 -...
  • Page 130: Audio

    RPWRON MAX4684EUB HFK_AUXON HFK_AUXOP COM2 AUXON AUXOP COM1 HEAD_SPK_P Section Date Sign & Name Sheet/ Sheets MODEL G7100 C413 Designer HFK_EAR 0.1u Checked DRAWING Audio NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. V1.1 - 132 -...
  • Page 131: Camera

    2V85_CAM G7100 Sheets MODEL Designer C527 ADP3330 U500 Checked 470p TP612 TP613 TP614 TP615 DRAWING ONNOFF CAMERA _ERR NAME Approved C547 C548 1608 1608 DRAWING Iss. Notice No. Date Name LG Electronics Inc. V1.1 LG Electronics Inc. - 133 -...
  • Page 132: Rf Circuit

    Sign & Name G7100 Sheets MODEL RF2.85V VBAT Designer U600 VSYNTHEN Checked TEMPSENSE _ERR DRAWING RF Circuit NAME C662 ADP3330 Approved 1608 C623 470p DRAWING Iss. Notice No. Date Name LG Electronics Inc. V1.1 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 134 -...
  • Page 133: Pcb Layout

    9. PCB LAYOUT - 135 -...
  • Page 134 9. PCB LAYOUT - 136 -...
  • Page 135: Engineering Mode

    10. ENGINEERING MODE 10. ENGINEERING MODE A. About Engineering Mode Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. B. Access Codes The key sequence for switching the engineering mode on is 2945#*#. Pressing END will switch back to non-engineering mode operation.
  • Page 136: Bb Test [Menu 1]

    10. ENGINEERING MODE 10.1 BB Test [MENU 1] Baseband Test 10.1.1 LCD 1) Contrast value : This menu is to test Main LCD contrast. - Contrast Value [10-50] : Change this value by up and down key. 2) Sub LCD Contrast : This menu is to test Sub LCD contrast. - Contrast Value [0-50] : Change this value by up and down key.
  • Page 137 10. ENGINEERING MODE 10.1.5 Vibrator This menu is to test the vibration mode. 1) Vibrator on : Vibration mode is on. 2) Vibrator off : Vibration mode is off. 10.1.6 ADC (Analog to Digital Converter) This displays the value of each ADC. 1) MVBAT ADC : Main Voltage Battery ADC 2) AUX ADC : Auxiliary ADC 3) TEMPER ADC : Temperature ADC...
  • Page 138: Rf Test [Menu 2]

    10. ENGINEERING MODE 10.1.8 Audio This is a menu for setting the control register of Voiceband Baseband Codec chip. Although the actual value can be written over, it returns to default value after switching off and on the phone. 1) VbControl1 : VbControl1 bit Register Value Setting 2) VbControl2 : VbControl2 bit Register Value Setting 3) VbControl3 : VbControl3 bit Register Value Setting 4) VbControl4 : VbControl4 bit Register Value Setting...
  • Page 139: Mf Mode [Menu 3]

    10. ENGINEERING MODE 10.3 MF mode [MENU 3] This manufacturing mode is designed to do the baseband test automatically. Selecting this menu will process the test automatically, and phone displays the previous menu after completing the test. 10.3.1 All auto test LCD, Backlight, Vibrator, Buzzer, Key Pad, Mic&Speaker, Camera are tested in order for a certain time.
  • Page 140: Trace Option [Menu 4]

    10. ENGINEERING MODE 10.3.8 MicSpkTest The sound from MIC is recorded for about 3 seconds, then it is replayed on the speaker automatically 10.3.9 Camera The scene from camera sensor is shown on the main LCD. 10.4 Trace option [MENU 4] This is NOT a necessary menu to be used by neither engineers nor users.
  • Page 141: Stand Alone Test

    11. STAND ALONE TEST 11. STAND ALONE TEST 11.1 Introduction This manual explains how to examine the status of RX and TX of the model. A. Tx Test TX test - this is to see if the transmitter of the phones is activating normally. B.
  • Page 142: Means Of Test

    11. STAND ALONE TEST 11.3 Means of Test a. Select a COM port b. Set the values in Tx or Rx c. Select band and channel d. After setting them all above, press connect button. e. Press the start button Figure 11-1.
  • Page 143 11. STAND ALONE TEST Figure 11-2. HW test setting Figure 11-3. Ramping profile - 145 -...
  • Page 144: Auto Calibration

    12.AUTO CALIBRATION 12.AUTO CALIBRATION 12.1 Overview Autocal (Auto Calibration) is the PC side Calibration tool that perform Tx ,Rx and Battery Calibration with Agilent 8960(GSM call setting instrument) and Tektronix PS2521G(Programmable power supply). Autocal generate calibration data by communicating with phone and measuring equipment then write it into calibration data block of flash memory in GSM phone.
  • Page 145 12.AUTO CALIBRATION Figure 12-1. Auto Calibration Program Screen → Cable loss : Enter the RF cable loss GSM and DCS Screen → GPIB(Primary address) : Enter the SS(Ag8960) and PS(Tektronix PS2521G) GPIB address Screen → ADC Channel : Default ADC Calibration Channel Screen →...
  • Page 146: Agc

    12.AUTO CALIBRATION 12.4 AGC This procedure is for Rx calibration. In this procedure, We can get RSSI correction value. Set band EGSM and press Start button the result window will show correction values per every power level and gain code and the same measure is performed per every frequency.
  • Page 147: Exploded View & Replacement Part List

    13. EXPLODED VIEW & REPLACEMENT PART LIST 13.1 Exploded View - 149 -...
  • Page 148: Accessory

    13.2 Accessory Description Part No Specification Color Level Location No 3.7 V,750 mAh,1 CELL,PRISMATIC ,G7100 STD SBPL00 BATTERY PACK,LI-ION SBPL0065880 BATTERY(SV) SGDY00 DATA CABLE SGDY0003003 LG-510W/G510 ,CABLE W/O POWER BULK EAR PHONE/EAR MIKE SGEY00 SGEY0003401 W3000 ,3Pole Necklace type(CDMA Design)
  • Page 149: Replacement Parts

    METALIC APEY00 PHONE APEY0092201 SILVER METALIC APEY00 PHONE APEY0092401 SILVER METALIC APEY00 PHONE APEY0092301 SILVER ACGG00 COVER ASSY, FOLDER ACGG0029301 G7100 Two tone Color COVER ASSY, DARK ACGH00 ACGH0015101 7100 BLUE FOLDER(LOWER) COVER,FOLDER DARK MCJH00 MCJH0010601 7100 FOLDER LOWER (LOWER)
  • Page 150 MCJK0015801 7100 main front BLUE MIAA00 INDICATOR,LED MIAA0008801 7100 indicator White MICA00 INSERT,FRONT MICA0001201 LG-G510,511,512 common use, DIA = 1.7mm+2.3t MTAZ00 TAPE MTAZ0014501 7100 flash window tape MWAD00 WINDOW,LED MWAD0001701 7100 flash window Silver MWAG00 WINDOW,IRDA MWAG0002701 7100 IrDA window...
  • Page 151 GMZZ0010101 3.5 mm,3.5 mm,MSWR3(FN) ,N ,STR ,- , M1.7x3.5 dia3.5 Silver METALIC MCJN00 COVER,REAR MCJN0013101 7100 main rear SILVER MGAD00 GASKET,SHIELD FORM MGAD0031701 G7100 rear case use(5x7x0.5t) Gold MGAD01 GASKET,SHIELD FORM MGAD0033501 3.5x8.5x2.5 Gold METALIC MLEA00 LOCKER,BATTERY MLEA0010101 7100 battery locker...
  • Page 152: Replacement Parts

    13.3 Replacement Parts < Main component > Location Level Description Part No Specification Remark PCB ASSY,MAIN SAFY0076801 G7100 Product/6060 RCC PCB SAFY00 LABEL,A/S MLAB0000601 HUMIDITY STICKER MLAB00 PCB ASSY,MAIN,AUTO SAFA0027901 G7100 Product/6060 RCC PCB SAFA00 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C100...
  • Page 153 Location Level Description Part No Specification Remark CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C145 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C146 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C147 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP C199 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C200 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C201 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP...
  • Page 154 Location Level Description Part No Specification Remark CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C320 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C396 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C398 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C399 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C402 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C403 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C404 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP...
  • Page 155 Location Level Description Part No Specification Remark CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C519 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C520 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C521 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C522 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C523 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C524 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C525 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP...
  • Page 156 Location Level Description Part No Specification Remark CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C561 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C562 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C563 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C564 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C565 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP...
  • Page 157 Location Level Description Part No Specification Remark CAP,CERAMIC,CHIP ECCH0000139 470 pF,50V,K,X7R,HD,1005,R/TP C626 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C627 CAP,CERAMIC,CHIP ECCH0000139 470 pF,50V,K,X7R,HD,1005,R/TP C628 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C629 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C630 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C631 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP...
  • Page 158 Location Level Description Part No Specification Remark CONNECTOR,BOARD ENBY0013406 40 PIN,0.4 mm,STRAIGHT ,Au ,B to B CNT BOSS CN500 TO BOARD CONNECTOR,BOARD ENBY0013409 20 PIN,0.4 mm,ETC ,AU , CN501 TO BOARD DIODE,SWITCHING EDSY0005701 EMT3 ,80 V,4 A,R/TP , D100 DIODE,SWITCHING EDSY0012101 US-FLAT ,30 V,1 A,R/TP ,2.5*1.25*0.6(t) D200 DIODE,SWITCHING...
  • Page 159 Location Level Description Part No Specification Remark 2.9*1.9*0.8(t) ,0.7 W,20 V,-6.0 A,R/TP ,NDC652P TR,FET,P-CHANNEL EQFP0004201 Q200 upgrade(substitution) item TR,BJT,NPN EQBN0007101 EMT3 ,0.15 W,R/TP ,LOW FREQUENCY Q300 TR,BJT,NPN EQBN0004801 SMT6 ,0.2 W,R/TP , Q301 TR,BJT,NPN EQBN0004801 SMT6 ,0.2 W,R/TP , Q400 TR,BJT,NPN EQBN0007101 EMT3 ,0.15 W,R/TP ,LOW FREQUENCY Q401...
  • Page 160 Location Level Description Part No Specification Remark RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R216 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R217 RES,CHIP ERHY0001103 0.33 ohm,1/4W ,F ,2012 ,R/TP R218 RES,CHIP ERHY0000274 51K ohm,1/16W,J,1005,R/TP R300 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R301 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R302 RES,CHIP ERHY0000205 15 ohm,1/16W,J,1005,R/TP R303...
  • Page 161 Location Level Description Part No Specification Remark RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R354 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R355 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R356 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R357 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R358 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R359 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R360 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP...
  • Page 162 Location Level Description Part No Specification Remark FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead R506 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead R507 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead R508 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead R509 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R510 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead R511...
  • Page 163 ERHY0000280 100K ohm,1/16W,J,1005,R/TP R630 RES,ARRAY,R ERNR0000401 47 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP RA300 PCB,MAIN SPFY0044501 FR-4 ,0.95 mm,MULTI-8 ,G7100 Ver0.4 SPFY00 SWITCH,TACT ESCY0002501 12 V,0.05 A,HORIZONTAL ,220 G,G5200 TACK S/W SW300 SWITCH,TACT ESCY0002501 12 V,0.05 A,HORIZONTAL ,220 G,G5200 TACK S/W...
  • Page 164 ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR VA401 VARISTOR SEVY0000702 14 V,10% ,SMD , VA402 X-TAL EXXY0015601 32.768 KHz,20 PPM,6 pF,65 Kohm,SMD ,6.9*1.4*1.3 , X100 VCTCXO EXSK0004101 13 MHz,3 PPM,10 pF,SMD ,3.2*2.5*1.0 , X600 MICROPHONE SUMY0006401 UNIT ,-44 dB,6*1.3 ,G7100 SUMY00 -167-...

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