Msp-Ts430Pn80Usb; B-20. Msp-Ts430Pn80A Bill Of Materials - Texas Instruments MSP430 User Manual

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Position
Ref Des
1
C1, C2
2
C3, C4
C6, C7,
3
C10, C12
C5, C11,
4
C13, C14,
C15
5
C8
6
C9
7
C16
8
C17
9
D1
J1, J2, J3,
10
J4
11
J5 , J6
JP3, JP5,
JP6, JP7,
12
JP8, JP9,
JP10
JP1, JP2,
13
JP4
14
15
JTAG
16
BOOTST
17
Q1
18
Q2
Insulating
19
disk to Q2
20
D3,D4
21
R3, R7
R1, R2,
R4, R6,
22
R8,
R9,R10,
R11, R12
23
R5
24
U1
25
PCB
Adhesive
26
plastic feet
27
MSP430
B.20 MSP-TS430PN80USB
Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately
0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for
example, to run the MCU at 3.0 V, set it to 3.3 V.
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Table B-20. MSP-TS430PN80A Bill of Materials
No. per
Description
Board
0
12pF, SMD0805
0
47pF, SMD0805
3
10uF/6.3V, SMD0805
5
100nF, SMD0805
1
2.2nF, SMD0805
1
470nF, SMD0805
1
4.7uF, SMD0805
1
220nF, SMD0805
1
green LED, SMD0805
0
20-pin header, TH
2
3-pin header, male, TH
7
3-pin header, male, TH
3
2-pin header, male, TH
10
Jumper
14-pin connector, male,
1
TH
10-pin connector, male,
0
TH
0
Crystal
0
Crystal
0
Insulating disk to Q2
2
LL103A
2
330 Ω, SMD0805
3
0 Ohm, SMD0805
47k Ω, SMD0805
1
1
Socket:IC201-0804-014
1
77 x 91 mm
about 6mm width, 2mm
4
height
2
MSP430F5329IPN
© 2009–2010, Texas Instruments Incorporated
DigiKey Part No.
DNP
DNP
DNP C10
311-1245-2-ND
478-1403-2-ND
P516TR-ND
SAM1029-20-ND
DNP: Headers and receptacles
(Header)
enclosed with kit. Keep vias free of
SAM1213-20-ND
solder:
(Receptacle)
place jumpers on pins 2-3 on JP5,
SAM1035-03-ND
JP6, JP7, JP8, JP9, JP10 place
jumpers on pins 1-2 on JP3,
SAM1035-02-ND
Place jumper on header
15-38-1024-ND
See Pos. 12 and Pos. 13
HRP14H-ND
"DNP Keep vias free of solder"
Micro Crystal MS3V-T1R
32.768kHz, C(Load) =
DNP: Q1 Keep vias free of solder
12.5pF
Q2: 4MHz Buerklin:
DNP: Q2 Keep vias free of solder
78D134
http://www.ettinger.de/Ar
t_Detail.cfm?ART_ART
NUM=70.08.121
Buerklin: 24S3406
541-330ATR-ND
541-000ATR-ND
DNP: R6, R8, R9, R10, R11,R12
541-47000ATR-ND
Manuf.: Yamaichi
2 layers
e.g., 3M Bumpons Part
Apply to corners at bottom side
No. SJ-5302
DNP: enclosed with kit, supplied by TI

MSP-TS430PN80USB

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