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HP-00007-01, Appendix 3
Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Marketing Name / Model
HP Compaq Business Desktop dx2000 uT Series
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0
Items Requiring Selective Treatment
1.1
Items listed below are classified as requiring selective treatment.
1.2
Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA)
Batteries
Mercury containing components
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing
PCB / PCT)
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in
diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame
Retardants
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Components and waste containing
asbestos
Components, parts and materials
containing refractory ceramic fibers
Components, parts and materials
containing radioactive substances
Description
Microtower, ATX board
Notes
With a surface greater than 10
square cm
All types including standard
alkaline and lithium coin or button
style batteries
For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
Includes background illuminated
displays with gas discharge lamps
PSU, IDE, SATA cables.
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
HP Restricted
30-June-2005
Qty items in
product.
3 (sys board,
modem card &
power supply bd
1
Page 1
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Summary of Contents for HP Compaq Business Desktop dx2000 uT Series
- Page 1 HP Compaq Business Desktop dx2000 uT Series Microtower, ATX board Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment. Items Requiring Selective Treatment Items listed below are classified as requiring selective treatment.
-
Page 2: Modem Card
HP-00007-01, Appendix 3 30-June-2005 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) - Page 3 HP-00007-01, Appendix 3 30-June-2005 To remove the heatsink and processor from the system board (see Figure 8 below): a) Unplug the fan cable from the system board. b) Use a long, slender screwdriver to unscrew the four processor retaining screws that secure the heatsink to the system board tray.
- Page 4 HP-00007-01, Appendix 3 30-June-2005 ILLUSTRATIONS FIGURE 1: Removing the access panel FIGURE 2: Modem card FIGURE 3: Removing a PCI expansion card FIGURE 4: Removing the front bezel FIGURE 5: Removing a diskette drive FIGURE 6: Drive cage HP Restricted...
- Page 5 HP-00007-01, Appendix 3 30-June-2005 FIGURE 7: Removing the lower drive cage FIGURE 8: Removing the heatsink and processor FIGURE 9: System board FIGURE 10: Removing the system board FIGURE 11: Power supply FIGURE 12: Removing the power supply HP Restricted...
- Page 6 HP-00007-01, Appendix 3 30-June-2005 FIGURE 13: Tie wrap to cut FIGURE 14: Power supply PCA screws FIGURE 15: Inlet and Switch screws FIGURE 16: Tie wraps to cut FIGURE 17: Grounding screw FIGURE 18: PFC cables – cut location HP Restricted...
- Page 7 HP-00007-01, Appendix 3 30-June-2005 FIGURE 19: Battery location on system FIGURE 20: Removing the battery board HP Restricted Page 7...