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HP 280 G1 ST Business Product End-Of-Life Disassembly Instructions
HP 280 G1 ST Business Product End-Of-Life Disassembly Instructions

HP 280 G1 ST Business Product End-Of-Life Disassembly Instructions

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Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP 280 G1 ST Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Notes
With a surface greater than 10 sq cm
All types including standard alkaline and lithium coin
or button style batteries
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Quantity
of items
included
in product
1
1
0
NA
NA
0
0
0
0
2
0
0
0
0

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Summary of Contents for HP 280 G1 ST Business

  • Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 Tool Description Tool Size (if applicable) Description #1 Torx screw driver Description #2 Cross screw driver Description #3 Description #4 Description #5 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: Unfix system side cover screw*1 then remove side cover.
  • Page 3 1. Remove side cover 1. Release thumb screw on the access panel 2. Griping the tab at the end of access panel, pull towards the rear and remove from unit. EL-MF877-00 Page 3 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 4 2. Remove main bezel 1. Release 3 main bezel hooks. 2. Take out main bezel. EL-MF877-00 Page 4 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 5 3. Unplug all cable 1. Power cable (24 pin) 2. Heat sink cable 3. 12V power cable (4 pin) 4. Audio cable 5. Front USB and card reader 6. HDD SATA and power cable 7. ODD SATA and power cable 8.
  • Page 6 4. Remove Front I/O 1. Unfix 1 screw from chassis 2. Remove Front I/O EL-MF877-00 Page 6 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 7 5. Remove PSU 1. Unfix 4 screw front chassis. 2. Remove PSU from chassis 3. Remove O/P Cable tie. 4. Unscrew from cover. 5. Slide cover to the left. 6. Slide cover to the down. 7. Remove L/N from PCB. 8.
  • Page 8 EL-MF877-00 Page 8 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 9 EL-MF877-00 Page 9 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 10 EL-MF877-00 Page 10 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 11 EL-MF877-00 Page 11 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 12 6. Remove Mother board 1. Unfix 4 screws from chassis 2. Remove M/B from chassis EL-MF877-00 Page 12 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 13 7. Remove WLAN card 1. Unfix 1screw and remove WLAN card 2. Remove WLAN card Photo2 EL-MF877-00 Page 13 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 14 8. Remove Memory 1. Release memory socket 2. Remove Memory 9. Remove Heat Sink 1. Unfix 4 screws from Heat Sink 2. Remove Heat Sink EL-MF877-00 Page 14 Template Revision B PSG instructions for this template are available at EL-MF877-01...