Samsung NP-R20 Series Service Manual
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Samsung NP-R20 Series Service Manual

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SERVICE
SAMSUNG R20
*The items marked with this symbol are optional items
that are supported depending on the computer model
SAMSUNG
R20/R21
NP-R20xxxx/xxx
NP-R21xxxx/xxx
Manual
FEATURES
1. High Performance Notebook Computer
-. Intel Core™2 Duo processor, ntel Core™
Duo/Solo Processor . DDR II Memory
-. wireless LAN,Bluetooth
-. 14.1'' WXGA LCD
-. Windows Vista/XP Premium Supportable.
2. Easy-To-Use
Play AVStation and AVStation Now
(optional)are provided to easily play various
multimedia files.
3.Sophisticated Design for increased Usability
-. AV Now and various shortcut keys on the
keyboard
-. Multi card slot
-. Luxurious design with increased usability

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Summary of Contents for Samsung NP-R20 Series

  • Page 1 SAMSUNG R20/R21 NP-R20xxxx/xxx NP-R21xxxx/xxx SERVICE Manual FEATURES SAMSUNG R20 1. High Performance Notebook Computer -. Intel Core™2 Duo processor, ntel Core™ Duo/Solo Processor . DDR II Memory -. wireless LAN,Bluetooth -. 14.1'' WXGA LCD -. Windows Vista/XP Premium Supportable. 2. Easy-To-Use...

  • Page 2: Table Of Contents

    - This Document can not be used without Samsung's authorization - CONTENTS 1. Precautions 1) General After-Sales Service Precautions....................1-1 2) Safety Precautions...........................1-2 3) Ground..............................1-3 2. Introduction and Specification 1) Introduction...............................2-1 2) Specification.............................2-2 3) Wireless LAN Specification........................2-8 4) Option list...............................2-10 3. Function 1) Construction of System...........................3-1...
  • Page 3 - This Document can not be used without Samsung's authorization - CONTENTS 8. System Block Diagram 1) Block diagram............................8-1 9. System Wire Diagram 1) R20 Top..............................9-1. 2) R20 Bottom.............................9-1 3) LCD.................................9-2 10. Part list 1) SYSTEM..............................10-1 11. References 1) Model Numbering Rule.........................11-1.

  • Page 4: Introduction

    - This Document can not be used without Samsung's authorization - 2. Introduction and Specification Introduction 14.1" Mainstream 2 Spindle Note PC with High Performance ® ® Intel Core™ Duo Processor and Intel Core™ Solo Processor with 667MHz FSB ATI RS600ME&SB600 DDR2 533/667MHz Dual Channel 14.1"...

  • Page 5: Specification

    - This Document can not be used without Samsung's authorization - 2. Introduction and Specification Specification Processor and Motherboard Intel® Core™ 2 Duo Processor Intel® Core™ Duo Processor Intel® Pentium Dual Core™ Processor Intel® Celeron®M Processor Intel® Core™ 2 Duo Processor T5200(1.6GHz) ~ T7400(2.16GHz)
  • Page 6 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification Graphics Controller ATI RS600ME Chipset Integrated Graphic Processor (IGP) 　 ATI® Radeon Xpress 1250M Video Memory 64MB / 128MB with UMA Max.Resolution for LFP LVDS 1280 x 800 x 32Bits color (WXGA) Max.Resolution for External...
  • Page 7 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification DVD 110ms Typ., CD 90ms Typ. Average Access Time 190g or less Weight Cyberlink DVD Solution S/W supplied RPC-II Regional Encoding Security Super Multi Dual Layer 1 Factory Option Fixed 12.7mm Slim...
  • Page 8 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 6 in 1 card slot Memory card slot Memory Stick / Memory Stick Pro / SD / XD/MMC/MMC Plus Express Card Slots PCI Express Card Slot (54mm Type)
  • Page 9 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 14.8Vdc Voltage 5200mAh Battery Capacity 14.8V / 5200mAh (76.96Wh) Battery Rating AD-6019 (GM Model) AC Adapter 60Watts Output Power 107.9 X 46.5 X 28 mm...
  • Page 10 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification Key Feature Hainan2 (R20) Hainan-C Feature Form Factor (LCD) Glare / Non-Glare LCD 14.1” WXGA Glare / Non-Glare LCD 14.1" WXGA Platform (Chipset) ATI chipsets(RS600ME&SB600)

  • Page 11: Wireless Lan Specification

    WPA and CCX, certificates or PROSet may be required depending on the network settings. For driver update, visit www.samsung.com and for information on the PROSet installation, refer to 'Wireless Network Setup Using the Wireless LAN Setup Program'. For more information, ask your network administrator.
  • Page 12 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification Radio Specifications RF Band 2.4GHz, 5GHz Support Channels Channels allowed per country. Device Transceiver Standard Output Power 5 mW 11b mode: DSSS Transmission Method 11g mode: OFDM 11b mode: 11, 5.5, 2, and 1...
  • Page 13 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification Optional Parts List Interface Capacity Speed SEC Code Vendor Product ID MHV2100BH SATA 60GB 5400rpm BA59-01671A Fujutsu BA59-02038A Samsung HM060HI BA59-01950A Samsung SAMSUNG- HM060II BA59-01999A...
  • Page 14 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification SEC Code Type Product ID BA96-03193F DVD-Combo TS-L462D BA96-02848J DVD-Combo DW-224E-R BA96-03084C DVD-supermulti DV-W28EC BA96-03084D DVD-supermulti TS-L632D SODIMM Memory Modules Frequency Capacity Vendor Product ID...
  • Page 15 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification LCD Panel SEC Code Vendor Product ID BA59-02059A CPT LCD CLAA141WB05A BA59-01880A SAMSUNG LCD LTN141W1-L03-G BA59-01958A SAMSUNG LCD LTN141W1-L03-0 Bluetooth Module SEC Code Vendor Product ID...
  • Page 16 - This Document can not be used without Samsung's authorization - 6. Exploded View and Part List SYSTEM T0010 I0006 T0001 I0001 M3005 G0011 W3007 X2000 T2004 I0009 M0001 M3004 G0003 I0002 B0001 B0013 I0005 D0001 B0003 B0150 B0100 NP-R20/R21...
  • Page 17 - This Document can not be used without Samsung's authorization - 6. Exploded View and Part List Assy LCD K0007 K0001 K3001 K4001 K1001 K3002 K4002 K0100 K1002 K0002 K1003 K0201 NP-R20/R21...
  • Page 18 - This Document can not be used without Samsung's authorization - 6. Exploded View and Part List Unit-Back K0006 K0004 K2002 Unit-Top W0005 W0005 T0101 T0301 NP-R20/R21...
  • Page 19 - This Document can not be used without Samsung's authorization - 6. Exploded View and Part List Unit-Bottom B0001 B0501 B0302 T2004 T2001 B0303 B0501 RUDMB B0009 B0403 B0402 B0009 NP-R20/R21...
  • Page 20 - This Document can not be used without Samsung's authorization - 6. Exploded View and Part List Unit-ODD D0001 D2000 D1002 D3000 NP-R20/R21...
  • Page 21 - This Document can not be used without Samsung's authorization - 6. Exploded View and Part List NP-R20K004/CHN Location Code Part Number Parts Name & Specification Q'ty SA/SNA A0010 3903-000131 CBF-POWER CORD;DT,CN,EP2,IEC320 C7,250/2 A1001 BA46-03755A S/W CD;RCD,NP/DT,WINXPH SP2 OSCD,1.0,CHS A1001 BA46-05698A S/W CD;UTILITY,Hainan2,WINXP H/P,1.0,EXP...
  • Page 22 - This Document can not be used without Samsung's authorization - 6. Exploded View and Part List NP-R20K004/CHN Location Code Part Number Parts Name & Specification Q'ty SA/SNA I0009 BA43-00158A BATTERY;4UR18650F-SDN,Hainan,Li-Ion,1P4S K0001 BA75-01870B UNIT-HOUSING_LCD-BACK;HAINAN2,DOMESTIC,P K0002 BA75-01869A UNIT-HOUSING-LCD_FRONT;HAINAN2,DOMESTIC, K0004 BA81-03399A LATCH-LCD;HAINAN2,DOMESTIC,PC/ABS,L145*W...
  • Page 23 - This Document can not be used without Samsung's authorization - 6. Exploded View and Part List NP-R20K004/CHN Location Code Part Number Parts Name & Specification Q'ty SA/SNA M1018 0505-001883 FET-SILICON;RHU002N06,N,60V,200MA,3.3OHM M1024 0801-002195 IC-CMOS LOGIC;7S08,AND GATE,SOT-25,5P,63 M1024 0801-002252 IC-CMOS LOGIC;7S14,INVERTER,SOT-25,5P,63...
  • Page 24 - This Document can not be used without Samsung's authorization - 6. Exploded View and Part List NP-R20K004/CHN Location Code Part Number Parts Name & Specification Q'ty SA/SNA M9999 0904-002230 IC-I/O CONTROLLER;SB600,FcBGA,549P,23x23 M9999 1103-001244 IC-EEPROM;93LC46B,1Kbit,64x16Bit,SOP,8P, M9999 1107-001646 IC-FLASH MEMORY;MX25L8005,8Mbit,8Mx1,SOP M9999 1203-002546 IC-POSI.FIXED REG.;MIC5258,SOT-23-5,5P,6...
  • Page 25 - This Document can not be used without Samsung's authorization - 06. Exploded View and Part List NP-R20K004/CHN Location Code Part Number Parts Name & Specification Q'ty SA/SNA M9999 3709-001466 CONNECTOR-CARD EDGE;26,0.35mm,SMD-A,AU,T M9999 3710-002130 SOCKET-BOARD TO CABLE;30P,1R,0.5mm,SMD-S M9999 3710-002133 SOCKET-BOARD TO BOARD;12P,2R,0.8mm,SMD-A...
  • Page 26 - This Document can not be used without Samsung's authorization - 6. Exploded View and Part List NP-R20K004/CHN Location Code Part Number Parts Name & Specification Q'ty SA/SNA WAR01 BA68-03159A LABEL SERVICE-WARRANT;AQUILLA-SO,DOM,PAP Z8999 2603-000048 TRANS-MATCHING;-,1:1,0mA,6P:6P,11.81x8.6 NP-R20/R21 6-11...

  • Page 27: Disassembly And Reassembling

    - This document cannot be used without Samsung's authorization - 4. Disassembly and Reassembly 4-1. Disassembly and Reassembly of R20 Part Figure Description 1. Make sure to separate the AC adapter and battery before disassembling the system. 2. Slide the knob all the way to the end...
  • Page 28 - This document cannot be used without the authorization of Samsung - 4. Disassembly and Reassembly Part Figure Description 7. When removing the HDD compartment cover, you will find the HDD. Separate the HDD cable and lift up the HDD at an angle of 70º as shown in the figure.
  • Page 29 - This document cannot be used without the authorization of Samsung - 4. Disassembly and Reassembly Part Figure Description Name 11. Lift up the keyboard, then the Connector Lock and separate the FPC. 1) Remove the 3 PCS screws. 2) Separate Cap-Top at the middle area...
  • Page 30 - This document cannot be used without the authorization of Samsung - 4. Disassembly and Reassembly Part Figure Description 15. Hold and pull the black and white cable in figure through guideline. 16. Lift up the Assy LCD slightly and separate it by pulling it in the direction of the arrow.
  • Page 31 - This document cannot be used without the authorization of Samsung - 4. Disassembly and Reassembly Part Figure Description Name 19. Lift up the Cable in figure and separate LCD from system. 20. (1) Remove the screw. (2)Separate the FFC-touchpad from MBD.
  • Page 32 - This document cannot be used without the authorization of Samsung- 4. Disassembly and Reassembly Part Figure Description 24.Remove the screws fixed up the Speaker. 25.Remove the Speaker from bottom. 26. Remove the memory as picture. Main System 27.Remove the screws fixed up the FAN.
  • Page 33 - This document cannot be used without the authorization of Samsung - 4. Disassembly and Reassembly Part Figure Description Name 30. Remove the Thermal as picture. 31.Turn the screw on the CPU socket 180 degrees in the direction of the arrow with a (-) screwdriver.
  • Page 34 - This document cannot be used without the authorization of Samsung - 4. Disassembly and Reassembly Part Figure Description Name 1. Remove the Rubber Foot from the positions indicated by the arrows in the figure, then remove the screws. 2. Insert your finger between the LCD Panel and the LCD Front, then separate the lower part of the LCD Front.
  • Page 35 - This document cannot be used without the authorization of Samsung - 4. Disassembly and Reassembly Part Figure Description 7.Separate the inventor board connector as the figure shows. 8.Lift up LCD module. Ass'y 9.Lift up the spring 10.Remove the screws fixed up latch and back.
  • Page 36 - This document cannot be used without the authorization of Samsung- 4. Disassembly and Reassembly Part Figure Description 14. Remove thetapes in circles 1 and 2. Ass'y 15. Pull out the LCD cable in circle 1 in the direction of the arrow.
  • Page 37 - This document cannot be used without the authorization of Samsung- 4. Disassembly and Reassembly Part Figure Description 1.Remove the screws fixed up Brkt- touchpad and TOP. 2.Disconnect FFC-touchpad as the figure shows and remove the bracket-touchpad. Ass'y 3.Remove the Touchpad-BD from TOP as the figure shows.

  • Page 38: Troubleshooting 1) General

    - This Document can not be used without Samsung's authorization - 5. Troubleshooting 1) General (1) Tools used for repairing the product System Diagnostics Disk MS-DOS Booting Disk System Diagnostics Card Screwdrivers ( ┼ , ━ ) Tweezers Multi-meter Oscilloscope...

  • Page 39: Debugging Flow Chart

    - This Document can not be used without Samsung's authorization - 5. Troubleshooting 2) Debugging Flow Chart S t a r t P o w e r o n N o p r o b le m N o p r o b le m...
  • Page 40 - This Document can not be used without Samsung's authorization - 5. Troubleshooting N o p r o b l e m N o p r o b l e m C h e c k s p e a k e r...

  • Page 41: System Diagnosis

    - This Document can not be used without Samsung's authorization - 5. Troubleshooting 3) System Diagnosis (1) System Diagnostics Card The Diagnostics Card shows the system operations during the POST (Power On Self Test) in a 2 digit hexadecimal number by connecting the cable to the 10 pin connector below the PCMCIA slot after separating the Top part.
  • Page 42 - This Document can not be used without Samsung's authorization - 5. Troubleshooting Shadow system BIOS ROM Auto size cache Advanced configuration of chipset registers Load alternate registers with CMOS values Initialize interrupt vectors POST device initialization 2-1-2-3 Check the ROM copyright notice...
  • Page 43 - This Document can not be used without Samsung's authorization - 5. Troubleshooting Test and initialize PS/2 mouse Initialize floppy controller Determine number of ATA drives (optional) Initialize hard-disk controllers Initialize local-bus hard-disk controllers Jump to UserPatch2 Build MPTABLE for multi-processor boards...
  • Page 44 - This Document can not be used without Samsung's authorization - 5. Troubleshooting (3) Use of Debug card -. Like upper picture, debug card is connected to DEBUG connector(as following) in Main board. -. Debug code is shown at the viewer in red line.

  • Page 45: Hardware Troubleshooting

    - This Document can not be used without Samsung's authorization - 5. Troubleshooting 4) Hardware Troubleshooting For the procedures to disassemble each part, refer to the descriptions of Chapter 4, “Disassembly and Reassembly”. ◆ LCD Related Troubles 1. The screen is dark or the colors of the screen are distorted.
  • Page 46 - This Document can not be used without Samsung's authorization - 5. Troubleshooting ◆ Main System Troubles 5. The system is not turned off. → Check if the AC adapter LED is lit and if the adapter is properly connected to the system.
  • Page 47 - This Document can not be used without Samsung's authorization - 5. Troubleshooting → Replace the main board. 7. The Express card is not inserted or the Eject button does not work. → This may occur when the insulator within the Express card slot is enwrapped.
  • Page 48 - This Document can not be used without Samsung's authorization - 5. Troubleshooting → Replace the 9. I cannot hear sound through the headphones. → Check if the sound is muted in Windows. → Turn the volume up. → Replace the main board 10.
  • Page 49 - This Document can not be used without Samsung's authorization - 5. Troubleshooting → If the 'Operating system not found' message appears during the booting process even though the HDD is recognized by CMOS, the operating system of the HDD may be corrupted or the HDD is out of order.
  • Page 50 - This Document can not be used without Samsung's authorization - 5. Troubleshooting → Check if the battery is defective. → Replace the main board. 14. The LAN function does not work. → Check if the LAN cable is properly connected.
  • Page 51 - This Document can not be used without Samsung's authorization - 5. Troubleshooting FAN Control Table (for CPU (for GMCH Voltage Address temperature) temperature) Noise GMCH (Volt) (Hexa) Sensor(on/o sensor(on/off) 　 　 23dBA 2500 rpm 27dBA 50/45 60/55 3000 rpm...
  • Page 52 - This Document can not be used without Samsung's authorization - 5. Troubleshooting → Press <F2> to enter the BIOS SETUP. → Check if the date and time are correct in the BIOS SETUP. → Save the settings and restart the system.
  • Page 53 - This Document can not be used without Samsung's authorization - 5. Troubleshooting 25. No picture is displayed on the external monitor. → Press the Switch LCD/CRT Monitor function key and check if the screen output is output to another display device.

  • Page 54: Device Settings Related Software Diagnosis

    - This Document can not be used without Samsung's authorization - 5. Troubleshooting 5) Device Settings Related Software Diagnosis (1) Check if the drivers of each of the devices are properly installed. That is, check if there are any yellow exclamation marks in the Device Manager.
  • Page 55 - This Document can not be used without Samsung's authorization - 5. Troubleshooting (3) Check if the program is properly installed. Click on the Realtek Control Panel in the Control Panel and check if the function works normally. If all audio drivers and programs are properly installed, the following window will appear.
  • Page 56 - This Document can not be used without Samsung's authorization - 5. Troubleshooting If there is an improperly installed driver or program the following warning message appears. (4) HDD and ODD Related Problems For an HDD, check if the HDD operates in Ultra DMA Mode 5 by selecting the Primary IDE Channel in the Control Panel as follows.
  • Page 57 - This Document can not be used without Samsung's authorization - 5. Troubleshooting For an ODD, check if it operates in Ultra DMA Mode 2. If it does not, check if the disc inserted into the ODD is clean. If the disc is contaminated, the access speed may slows down. If the disc is clean, check the BIOS SETUP, reinstall the operating system or ODD, if necessary.
  • Page 58 - This Document can not be used without Samsung's authorization - 5. Troubleshooting The drivers and application software are listed in the following table. Drivers PV-R (XP Pro,ENG) Chipset/Graphic Driver 8.321.0.0 8.321.0.0 Wireless LAN Driver(Askey) 4.2.2.14 (XP 32) 4.2.2.14 (XP 32) Sound Driver 5.10.0.5324LogoEDS...
  • Page 59 - This Document can not be used without Samsung's authorization - 5. Troubleshooting Magic Doctor 4.005 4.005 CyberLink DVD Solution Adobe Reader(RUS) 　 　 Adobe Reader(Others) 7.0.8.218 7.0.8.218 chinese revision destetude McAfee Anti-Virus 13.3.0.132 Norton Anti-virus (need compalibility) Screen Saver 1.0.0.0...

  • Page 60: Battery Use Time

    - This Document can not be used without Samsung's authorization - 5. Troubleshooting 6) Battery Use Time Check the following check lists for systems where the battery use time is too short to diagnose problems. (1) Check the battery Check if the battery is out of order referring to the Battery check program distributed to Service Centers and the 'Battery Check Manual' included in the 'Note-PC A/S Guide'.
  • Page 61 - This Document can not be used without Samsung's authorization - 5. Troubleshooting 5-24...
  • Page 62 - This Document can not be used without Samsung's authorization - 5. Troubleshooting 5-25...
  • Page 63 - This Document can not be used without Samsung's authorization - 5. Troubleshooting 3. Battery Capacity Table 4. Battery Check Program 5-26...

  • Page 64: System

    - This Document can not be used without Samsung's authorization - 5. Troubleshooting (2) Check the battery use environment 1. Generally, the battery usage time in advertisements by notebook manufacturers refers to the maximum battery use time. Since the system specifications and the usage environment may differ, the user's battery usage time may differ from the advertisement even if there is no problem with the system.

  • Page 65: System Block Diagram

    - This Document can not be used without Samsung's authorization - 8. System Block Diagram 8-1 Operation Block Diagram...
  • Page 66 - This Document can not be used without Samsung's authorization - 8. System Block Diagram 8-2 Power Diagram...
  • Page 67 - This Document can not be used without Samsung's authorization - 8. System Block Diagram 8-3 Power Sequence...
  • Page 68 - This Document can not be used without Samsung's authorization - 8. System Block Diagram 8-4 Power Rails Analysis...
  • Page 69 - This Document can not be used without Samsung's authorization - 8. System Block Diagram 8-5 Clock Distribution...
  • Page 70 - This Document can not be used without Samsung's authorization - 8. System Block Diagram 8-6 Board Information...

  • Page 71: System Wire Diagram

    - This Document can not be used without Samsung's authorization - 9. System Wire Diagram 9-1. R20 Top LCD cable Wireless lan cable Touchpad FFC Touchpad BD 9-2. R20 Main-BD/Bottom LCD connector DC connector DMB cable Speaker connector T/P connector...

  • Page 72: R20 Bottom

    - This Document can not be used without Samsung's authorization - 9. System Wire Diagram 9-3. R20 Bottom DMB cable Speaker connector MDC cable 9-4. R20 LCD WLAN cable 9- 2...

  • Page 73: System

    Material Desc Location 0902-002102 IC-MICROPROCESSOR;LF80537GF0282M,1.66GHz T5500 1 PC 1105-001683 IC-DRAM MODULE;M470T6554CZ3,-,512MByte,6 SEC_512MB*2 (667MHz 2 PC 3903-000025 CBF-POWER CORD;DT,KR,CP2(LP-57),IEC320 C POWER-CORD 1 PC 6001-001570 SCREW-MACHINE;CH,+,-,M2,L4,ZPC(BLK),SWRC CASE_BT+MBD 1 PC 6001-001570 SCREW-MACHINE;CH,+,-,M2,L4,ZPC(BLK),SWRC THERMAL+ PCB 6 PC 6001-001650 SCREW-MACHINE;BH,+,-,M2,L3,NI PLT,SWRCH1 MINICARDCARD+PCB 1 PC BA31-00043A FAN;-,HAINAN2,Plastic,-,Leadfree,SUNON 1 PC BA39-00570A CBF HARNESS-BLUETOOTH;TORINO,WIRE,UL1571 BLUET-HARN(TEYA)
  • Page 74 Material Desc Location BA92-04518A ASSY MOTHER BD-TOP;HAINAN2,Core 2 DUO,51 MAIN BD 1 PC 3709-001466 CONNECTOR-CARD EDGE;26,0.35mm,SMD-A,AU,T J507 1 PC 6001-001420 SCREW-INCH MACH;CH,+,UNC4-40,L4,NI PLT,S VGA+SHIELD-VGA 2 PC 6001-001650 SCREW-MACHINE;BH,+,-,M2,L3,NI PLT,SWRCH1 MDC+MBD 2 PC BA39-00431A WIRE HARNESS;RTC battery assy.,-,UL 1061 RTC_BATTERY 1 PC BA39-00534A WIRE HARNESS;TC05D37,AWG28,UL 1061,2PIN, RTC_BATTERY 1 PC...
  • Page 75 Material Desc Location 0505-001883 FET-SILICON;RHU002N06,N,60V,200MA,3.3OHM Q501 1 PC 0505-001883 FET-SILICON;RHU002N06,N,60V,200MA,3.3OHM Q507 1 PC 0505-001883 FET-SILICON;RHU002N06,N,60V,200MA,3.3OHM Q508 1 PC 0505-001883 FET-SILICON;RHU002N06,N,60V,200MA,3.3OHM Q516 1 PC 0505-001883 FET-SILICON;RHU002N06,N,60V,200MA,3.3OHM Q520 1 PC 0505-001883 FET-SILICON;RHU002N06,N,60V,200MA,3.3OHM Q521 1 PC 0505-001883 FET-SILICON;RHU002N06,N,60V,200MA,3.3OHM Q523 1 PC 0505-001883 FET-SILICON;RHU002N06,N,60V,200MA,3.3OHM Q524 1 PC 0505-001883 FET-SILICON;RHU002N06,N,60V,200MA,3.3OHM...
  • Page 76 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 R668 1 PC 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 R669 1 PC 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 R692 1 PC 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 R693 1 PC 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 R697 1 PC 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 R703 1 PC 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 R715 1 PC 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 R516 1 PC 2007-000129 R-CHIP;27Kohm,5%,1/10W,TP,1608 R518 1 PC...
  • Page 77 Material Desc Location 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 R616 1 PC 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 R655 1 PC 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 R656 1 PC 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 R657 1 PC 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 R660 1 PC 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 R662 1 PC 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 R671 1 PC 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 R677 1 PC 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005...
  • Page 78 Material Desc Location 2007-007107 R-CHIP;100Kohm,1%,1/16W,TP,1005 R664 1 PC 2007-007107 R-CHIP;100Kohm,1%,1/16W,TP,1005 R689 1 PC 2007-007108 R-CHIP;43.2Kohm,1%,1/16W,TP,1005 R507 1 PC 2007-007108 R-CHIP;43.2Kohm,1%,1/16W,TP,1005 2007-007108 R-CHIP;43.2Kohm,1%,1/16W,TP,1005 2007-007142 R-CHIP;10Kohm,1%,1/16W,TP,1005 R503 1 PC 2007-007142 R-CHIP;10Kohm,1%,1/16W,TP,1005 R517 1 PC 2007-007142 R-CHIP;10Kohm,1%,1/16W,TP,1005 R521 1 PC 2007-007142 R-CHIP;10Kohm,1%,1/16W,TP,1005 R525 1 PC 2007-007142 R-CHIP;10Kohm,1%,1/16W,TP,1005 R598...
  • Page 79 Material Desc Location 2007-007318 R-CHIP;1Kohm,1%,1/16W,TP,1005 R593 1 PC 2007-007318 R-CHIP;1Kohm,1%,1/16W,TP,1005 R617 1 PC 2007-007318 R-CHIP;1Kohm,1%,1/16W,TP,1005 R649 1 PC 2007-007318 R-CHIP;1Kohm,1%,1/16W,TP,1005 R650 1 PC 2007-007318 R-CHIP;1Kohm,1%,1/16W,TP,1005 R714 1 PC 2007-007334 R-CHIP;200Kohm,1%,1/16W,TP,1005 R500 1 PC 2007-007334 R-CHIP;200Kohm,1%,1/16W,TP,1005 R505 1 PC 2007-007334 R-CHIP;200Kohm,1%,1/16W,TP,1005 R711 1 PC 2007-007382 R-CHIP;20Mohm,5%,1/10W,TP,1608...
  • Page 80 Material Desc Location 2007-008314 R-CHIP;54.9ohm,1%,1/16W,TP,1005 R540 1 PC 2007-008314 R-CHIP;54.9ohm,1%,1/16W,TP,1005 R542 1 PC 2007-008373 R-CHIP;1.47kohm,1%,1/10W,TP,1608 R630 1 PC 2007-008438 R-CHIP;715ohm,1%,1/16W,TP,1005 R603 1 PC 2007-008535 R-CHIP;127ohm,1%,1/16W,TP,1005 R583 1 PC 2007-008708 R-CHIP;40.2ohm,1%,1/16W,TP,1005 R599 1 PC 2007-008708 R-CHIP;40.2ohm,1%,1/16W,TP,1005 R600 1 PC 2007-008714 R-CHIP;0.01ohm,1%,1W,TP,6432 R508 1 PC 2007-008714 R-CHIP;0.01ohm,1%,1W,TP,6432...
  • Page 81 Material Desc Location 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,1005 C547 1 PC 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,1005 C689 1 PC 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,1005 C696 1 PC 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,1005 C697 1 PC 2203-000257 C-CER,CHIP;10nF,10%,50V,X7R,1608 C835 1 PC 2203-000278 C-CER,CHIP;0.01nF,0.5pF,50V,C0G,1005 C674 1 PC 2203-000278 C-CER,CHIP;0.01nF,0.5pF,50V,C0G,1005 C678 1 PC 2203-000278 C-CER,CHIP;0.01nF,0.5pF,50V,C0G,1005 C694 1 PC 2203-000278 C-CER,CHIP;0.01nF,0.5pF,50V,C0G,1005...
  • Page 82 Material Desc Location 2203-000489 C-CER,CHIP;2.2nF,10%,50V,X7R,1005 C533 1 PC 2203-000489 C-CER,CHIP;2.2nF,10%,50V,X7R,1005 C534 1 PC 2203-000585 C-CER,CHIP;0.22nF,10%,50V,X7R,1005 C611 1 PC 2203-000627 C-CER,CHIP;0.022nF,5%,50V,C0G,1005 C640 1 PC 2203-000627 C-CER,CHIP;0.022nF,5%,50V,C0G,1005 C642 1 PC 2203-000627 C-CER,CHIP;0.022nF,5%,50V,C0G,1005 C801 1 PC 2203-000627 C-CER,CHIP;0.022nF,5%,50V,C0G,1005 C809 1 PC 2203-000812 C-CER,CHIP;.033nF,5%,50V,C0G,-,1005 C766 1 PC 2203-000940 C-CER,CHIP;0.47nF,10%,50V,X7R,1005...
  • Page 83 Material Desc Location 2203-002709 C-CER,CHIP;100nF,+80-20%,16V,Y5V,1005 C827 1 PC 2203-002709 C-CER,CHIP;100nF,+80-20%,16V,Y5V,1005 C833 1 PC 2203-002709 C-CER,CHIP;100nF,+80-20%,16V,Y5V,1005 C834 1 PC 2203-002711 C-CER,CHIP;100nF,10%,25V,X7R,1608 C503 1 PC 2203-002711 C-CER,CHIP;100nF,10%,25V,X7R,1608 C507 1 PC 2203-002711 C-CER,CHIP;100nF,10%,25V,X7R,1608 C509 1 PC 2203-002711 C-CER,CHIP;100nF,10%,25V,X7R,1608 C519 1 PC 2203-002711 C-CER,CHIP;100nF,10%,25V,X7R,1608 C522 1 PC 2203-002711 C-CER,CHIP;100nF,10%,25V,X7R,1608...
  • Page 84 Material Desc Location 2203-005482 C-CER,CHIP;100nF,10%,10V,X5R,1005 C643 1 PC 2203-005482 C-CER,CHIP;100nF,10%,10V,X5R,1005 C644 1 PC 2203-005482 C-CER,CHIP;100nF,10%,10V,X5R,1005 C645 1 PC 2203-005482 C-CER,CHIP;100nF,10%,10V,X5R,1005 C646 1 PC 2203-005482 C-CER,CHIP;100nF,10%,10V,X5R,1005 C647 1 PC 2203-005482 C-CER,CHIP;100nF,10%,10V,X5R,1005 C648 1 PC 2203-005482 C-CER,CHIP;100nF,10%,10V,X5R,1005 C649 1 PC 2203-005482 C-CER,CHIP;100nF,10%,10V,X5R,1005 C650 1 PC 2203-005482 C-CER,CHIP;100nF,10%,10V,X5R,1005...
  • Page 85 Material Desc Location 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C734 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C737 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C738 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C739 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C740 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C741 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C742 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C743 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005...
  • Page 86 Material Desc Location 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C790 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C791 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C792 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C793 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C794 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C797 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C799 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C803 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005...
  • Page 87 Material Desc Location 2203-006090 C-CER,CHIP;10000nF,10%,6.3V,X5R,2012 C594 1 PC 2203-006090 C-CER,CHIP;10000nF,10%,6.3V,X5R,2012 C595 1 PC 2203-006090 C-CER,CHIP;10000nF,10%,6.3V,X5R,2012 C596 1 PC 2203-006090 C-CER,CHIP;10000nF,10%,6.3V,X5R,2012 C597 1 PC 2203-006090 C-CER,CHIP;10000nF,10%,6.3V,X5R,2012 C598 1 PC 2203-006090 C-CER,CHIP;10000nF,10%,6.3V,X5R,2012 C629 1 PC 2203-006090 C-CER,CHIP;10000nF,10%,6.3V,X5R,2012 C635 1 PC 2203-006090 C-CER,CHIP;10000nF,10%,6.3V,X5R,2012 C638 1 PC 2203-006090 C-CER,CHIP;10000nF,10%,6.3V,X5R,2012...
  • Page 88 Material Desc Location 2203-006324 C-CER,CHIP;2200nF,10%,10V,X5R,1608 C665 1 PC 2203-006324 C-CER,CHIP;2200nF,10%,10V,X5R,1608 C666 1 PC 2203-006324 C-CER,CHIP;2200nF,10%,10V,X5R,1608 C675 1 PC 2203-006324 C-CER,CHIP;2200nF,10%,10V,X5R,1608 C683 1 PC 2203-006324 C-CER,CHIP;2200nF,10%,10V,X5R,1608 C684 1 PC 2203-006324 C-CER,CHIP;2200nF,10%,10V,X5R,1608 C752 1 PC 2203-006324 C-CER,CHIP;2200nF,10%,10V,X5R,1608 C767 1 PC 2203-006324 C-CER,CHIP;2200nF,10%,10V,X5R,1608 C769 1 PC 2203-006324 C-CER,CHIP;2200nF,10%,10V,X5R,1608...
  • Page 89 Material Desc Location 3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,- B501 1 PC 3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,- B502 1 PC 3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,- B503 1 PC 3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,- B504 1 PC 3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,- B505 1 PC 3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,- B506 1 PC 3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,- B507 1 PC 3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,- B508 1 PC 3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,-...
  • Page 90 Material Desc Location 3711-005947 HEADER-BOARD TO BOARD;BOX,8P,1R,1.0mm,SM J505 1 PC BA61-00784A SUPPORT-VIDEO_BD;ARGO,CU ALLOY,T3.5,W3.5 1 PC BA61-00784A SUPPORT-VIDEO_BD;ARGO,CU ALLOY,T3.5,W3.5 M500 1 PC BA61-00784A SUPPORT-VIDEO_BD;ARGO,CU ALLOY,T3.5,W3.5 M501 1 PC BA61-00784A SUPPORT-VIDEO_BD;ARGO,CU ALLOY,T3.5,W3.5 M502 1 PC BA81-02753A NUT-DMB;TORINO,DOMESTIC,STS,D3.5*L4.5*M1 M503 1 PC BA81-02753A NUT-DMB;TORINO,DOMESTIC,STS,D3.5*L4.5*M1 M504 1 PC BA81-02753A NUT-DMB;TORINO,DOMESTIC,STS,D3.5*L4.5*M1...
  • Page 91 Material Desc Location 0505-001883 FET-SILICON;RHU002N06,N,60V,200MA,3.3OHM 1 PC 0505-001920 FET-SILICON;HAT2195R,N,30V,18A,0.0084ohm 1 PC 0505-001920 FET-SILICON;HAT2195R,N,30V,18A,0.0084ohm 1 PC 0505-001920 FET-SILICON;HAT2195R,N,30V,18A,0.0084ohm 1 PC 0505-001920 FET-SILICON;HAT2195R,N,30V,18A,0.0084ohm 1 PC 0801-002195 IC-CMOS LOGIC;7S08,AND GATE,SOT-25,5P,63 1 PC 0801-002252 IC-CMOS LOGIC;7S14,INVERTER,SOT-25,5P,63 1 PC 0801-002981 IC-CMOS LOGIC;7SZ08,2-INPUT AND GATE,SC7 1 PC 0801-002998 IC-CMOS LOGIC;74AHCT1G125,Single buffer, 1 PC 0904-002207 IC-MEMORY CONT.;216MEP6CLA14FG,FCBGA,120...
  • Page 92 Material Desc Location 2007-000141 R-CHIP;2.2Kohm,5%,1/16W,TP,1005 1 PC 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,1005 R111 1 PC 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,1005 R243 1 PC 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,1005 R301 1 PC 2007-000146 R-CHIP;6.8Kohm,5%,1/16W,TP,1005 1 PC 2007-000147 R-CHIP;8.2Kohm,5%,1/16W,TP,1005 R195 1 PC 2007-000147 R-CHIP;8.2Kohm,5%,1/16W,TP,1005 R196 1 PC 2007-000147 R-CHIP;8.2Kohm,5%,1/16W,TP,1005 R197 1 PC 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 R129 1 PC...
  • Page 93 Material Desc Location 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 PC 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 R262 1 PC 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 R272 1 PC 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 R305 1 PC 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 PC 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 PC 2007-000173 R-CHIP;22ohm,5%,1/16W,TP,1005 R174 1 PC 2007-000173 R-CHIP;22ohm,5%,1/16W,TP,1005 R176 1 PC 2007-000173 R-CHIP;22ohm,5%,1/16W,TP,1005 R182 1 PC...
  • Page 94 Material Desc Location 2007-007107 R-CHIP;100Kohm,1%,1/16W,TP,1005 1 PC 2007-007107 R-CHIP;100Kohm,1%,1/16W,TP,1005 1 PC 2007-007107 R-CHIP;100Kohm,1%,1/16W,TP,1005 1 PC 2007-007108 R-CHIP;43.2Kohm,1%,1/16W,TP,1005 R144 1 PC 2007-007108 R-CHIP;43.2Kohm,1%,1/16W,TP,1005 1 PC 2007-007108 R-CHIP;43.2Kohm,1%,1/16W,TP,1005 2007-007142 R-CHIP;10Kohm,1%,1/16W,TP,1005 R100 1 PC 2007-007142 R-CHIP;10Kohm,1%,1/16W,TP,1005 R101 1 PC 2007-007142 R-CHIP;10Kohm,1%,1/16W,TP,1005 R106 1 PC 2007-007142 R-CHIP;10Kohm,1%,1/16W,TP,1005 R140 1 PC...
  • Page 95 Material Desc Location 2007-007307 R-CHIP;150ohm,1%,1/16W,TP,1005 R324 1 PC 2007-007307 R-CHIP;150ohm,1%,1/16W,TP,1005 R325 1 PC 2007-007307 R-CHIP;150ohm,1%,1/16W,TP,1005 R326 1 PC 2007-007307 R-CHIP;150ohm,1%,1/16W,TP,1005 R327 1 PC 2007-007307 R-CHIP;150ohm,1%,1/16W,TP,1005 R328 1 PC 2007-007307 R-CHIP;150ohm,1%,1/16W,TP,1005 1 PC 2007-007312 R-CHIP;20Kohm,1%,1/16W,TP,1005 R288 1 PC 2007-007312 R-CHIP;20Kohm,1%,1/16W,TP,1005 R291 1 PC 2007-007312 R-CHIP;20Kohm,1%,1/16W,TP,1005 R293...
  • Page 96 Material Desc Location 2007-007942 R-CHIP;1Mohm,1%,1/16W,TP,1005 R303 1 PC 2007-007942 R-CHIP;1Mohm,1%,1/16W,TP,1005 R304 1 PC 2007-007942 R-CHIP;1Mohm,1%,1/16W,TP,1005 R330 1 PC 2007-008015 R-CHIP;75ohm,1%,1/16W,TP,1005 R231 1 PC 2007-008015 R-CHIP;75ohm,1%,1/16W,TP,1005 R232 1 PC 2007-008015 R-CHIP;75ohm,1%,1/16W,TP,1005 R233 1 PC 2007-008015 R-CHIP;75ohm,1%,1/16W,TP,1005 R234 1 PC 2007-008026 R-CHIP;56OHM,1%,1/16W,TP,1005 1 PC 2007-008223 R-CHIP;39.2Kohm,1%,1/10W,TP,1608 R296...
  • Page 97 Material Desc Location 2007-008298 R-CHIP;49.9ohm,1%,1/16W,TP,1005 R110 1 PC 2007-008298 R-CHIP;49.9ohm,1%,1/16W,TP,1005 R113 1 PC 2007-008298 R-CHIP;49.9ohm,1%,1/16W,TP,1005 R151 1 PC 2007-008298 R-CHIP;49.9ohm,1%,1/16W,TP,1005 R152 1 PC 2007-008298 R-CHIP;49.9ohm,1%,1/16W,TP,1005 R153 1 PC 2007-008298 R-CHIP;49.9ohm,1%,1/16W,TP,1005 R167 1 PC 2007-008298 R-CHIP;49.9ohm,1%,1/16W,TP,1005 R168 1 PC 2007-008298 R-CHIP;49.9ohm,1%,1/16W,TP,1005 R169 1 PC 2007-008298 R-CHIP;49.9ohm,1%,1/16W,TP,1005...
  • Page 98 Material Desc Location 2203-000438 C-CER,CHIP;1nF,10%,50V,X7R,1005 C211 1 PC 2203-000438 C-CER,CHIP;1nF,10%,50V,X7R,1005 C212 1 PC 2203-000438 C-CER,CHIP;1nF,10%,50V,X7R,1005 C214 1 PC 2203-000438 C-CER,CHIP;1nF,10%,50V,X7R,1005 C216 1 PC 2203-000438 C-CER,CHIP;1nF,10%,50V,X7R,1005 1 PC 2203-000438 C-CER,CHIP;1nF,10%,50V,X7R,1005 1 PC 2203-000438 C-CER,CHIP;1nF,10%,50V,X7R,1005 1 PC 2203-000438 C-CER,CHIP;1nF,10%,50V,X7R,1005 1 PC 2203-000438 C-CER,CHIP;1nF,10%,50V,X7R,1005 1 PC 2203-000489 C-CER,CHIP;2.2nF,10%,50V,X7R,1005 1 PC...
  • Page 99 Material Desc Location 2203-002720 C-CER,CHIP;10nF,10%,25V,X7R,1005 1 PC 2203-005384 C-CER,CHIP;4700nF,+80-20%,10V,Y5V,2012 C126 1 PC 2203-005384 C-CER,CHIP;4700nF,+80-20%,10V,Y5V,2012 C149 1 PC 2203-005384 C-CER,CHIP;4700nF,+80-20%,10V,Y5V,2012 C153 1 PC 2203-005482 C-CER,CHIP;100nF,10%,10V,X5R,1005 C100 1 PC 2203-005482 C-CER,CHIP;100nF,10%,10V,X5R,1005 C101 1 PC 2203-005482 C-CER,CHIP;100nF,10%,10V,X5R,1005 C102 1 PC 2203-005482 C-CER,CHIP;100nF,10%,10V,X5R,1005 C103 1 PC 2203-005482 C-CER,CHIP;100nF,10%,10V,X5R,1005 C104...
  • Page 100 Material Desc Location 2203-005482 C-CER,CHIP;100nF,10%,10V,X5R,1005 1 PC 2203-005482 C-CER,CHIP;100nF,10%,10V,X5R,1005 1 PC 2203-005482 C-CER,CHIP;100nF,10%,10V,X5R,1005 1 PC 2203-005482 C-CER,CHIP;100nF,10%,10V,X5R,1005 1 PC 2203-005482 C-CER,CHIP;100nF,10%,10V,X5R,1005 1 PC 2203-005482 C-CER,CHIP;100nF,10%,10V,X5R,1005 1 PC 2203-005918 C-CERAMIC,CHIP;1000NF,10%,6.3V,X7R,TP,16 C146 1 PC 2203-005918 C-CERAMIC,CHIP;1000NF,10%,6.3V,X7R,TP,16 C172 1 PC 2203-005918 C-CERAMIC,CHIP;1000NF,10%,6.3V,X7R,TP,16 C199 1 PC 2203-005918 C-CERAMIC,CHIP;1000NF,10%,6.3V,X7R,TP,16 1 PC...
  • Page 101 Material Desc Location 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C195 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C196 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C200 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C203 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C204 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C205 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 C207 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 1 PC 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 1 PC...
  • Page 102 Material Desc Location 2203-006093 C-CER,CHIP;1000nF,+80-20%,6.3V,Y5V,1005 1 PC 2203-006093 C-CER,CHIP;1000nF,+80-20%,6.3V,Y5V,1005 1 PC 2203-006143 C-CER,CHIP;22000nF,20%,6.3V,X5R,3216 C121 1 PC 2203-006166 C-CER,CHIP;100nF,10%,25V,X5R,1005 1 PC 2203-006166 C-CER,CHIP;100nF,10%,25V,X5R,1005 1 PC 2203-006260 C-CER,CHIP;220nF,10%,10V,X5R,-,1005 C209 1 PC 2203-006324 C-CER,CHIP;2200nF,10%,10V,X5R,1608 C181 1 PC 2203-006324 C-CER,CHIP;2200nF,10%,10V,X5R,1608 1 PC 2203-006361 C-CER,CHIP;10000nF,10%,10V,X5R,2012 C173 1 PC 2203-006361 C-CER,CHIP;10000nF,10%,10V,X5R,2012...
  • Page 103 Material Desc Location 2703-002996 INDUCTOR-SMD;3.9uH,20%,10x10mm 1 PC 2703-002996 INDUCTOR-SMD;3.9uH,20%,10x10mm 1 PC 2703-002996 INDUCTOR-SMD;3.9uH,20%,10x10mm 1 PC 2801-004203 CRYSTAL-SMD;25MHz,30ppm,-,15.0pF,50ohm,T 1 PC 2801-004517 CRYSTAL-SMD;25.0MHz,30ppm,-,10pF,50ohm,T 1 PC 2801-004547 CRYSTAL-SMD;25.0000MHz,50ppm,HCX-5FA,10p 1 PC 3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,- 1 PC 3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,- 1 PC 3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,- 1 PC 3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,- 1 PC 3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,- 1 PC...
  • Page 104 Material Desc Location BA61-00784A SUPPORT-VIDEO_BD;ARGO,CU ALLOY,T3.5,W3.5 1 PC BA61-00784A SUPPORT-VIDEO_BD;ARGO,CU ALLOY,T3.5,W3.5 1 PC BA61-00932A SUPPORT-FIRMWARE;VENICE,CU ALLOY,T1.5,W4 1 PC BA61-00932A SUPPORT-FIRMWARE;VENICE,CU ALLOY,T1.5,W4 1 PC BA68-10191W LABEL-BARCODE;Note PC ALL,-,ARTPAPER,-,W SMT_LABEL 1 PC BA68-40012N LABEL-LOCATION;NOTE PC,-,ART PAPER,-,W6. BIOS_REV 1 PC BA68-40012N LABEL-LOCATION;NOTE PC,-,ART PAPER,-,W6. MICOM_REV 1 PC BA70-00601A GASKET-EMI;EMISTOP,Be-Cu,T0.10,Au/gold c...
  • Page 105 6001-001570 SCREW-MACHINE;CH,+,-,M2,L4,ZPC(BLK),SWRC BRKT+(HINGE)+BACK 6 PC 6001-001570 SCREW-MACHINE;CH,+,-,M2,L4,ZPC(BLK),SWRC INVENTOR+BACK 2 PC 6001-001650 SCREW-MACHINE;BH,+,-,M2,L3,NI PLT,SWRCH1 LCD BRKT+PANEL 8 PC BA02-00002A TAPE-FILAMENT;3M 8915,-,T0.15,W18,L55000 TAPE-FILAMENT BA64-00716A LOGO-SAMSUNG;HAINAN2,DOMESTIC,T0.75,8.25 U/H-BACK 1 PC BA81-02706A PROTECTOR-FILM_LCD;HAINAN,PET,W325*L207* PROTECTOR-FILM_LCD 1 PC BA81-03401A BRACKET-LCD_L;HAINAN2,DOMESTIC,EGI,L229. BRACKET-LCD_L 1 PC BA81-03402A BRACKET-LCD_R;HAINAN2,DOMESTIC,EGI,L229. BRACKET-LCD_R 1 PC BA81-03434A HINGE-L;HAINAN2,DOMESTIC,Mg,W18*L13.7*H6...

  • Page 106: References

    - This Document can not be used without Samsung's authorization - 11. References 1. ) Model Numbering Rule 1. CTO ( Computer Model Numbering System) 11-1...
  • Page 107 - This Document can not be used without Samsung's authorization - 11. References 11-2...
  • Page 108 - This Document can not be used without Samsung's authorization - 11. References 2. Non - CTO ( Computer Model Numbering System) 11-3...

  • Page 109: Cpu Code Table

    - This Document can not be used without Samsung's authorization - 11. References 2. CPU Code table Code name Samsung CODE L1 cache L2 cache clock speed 0902-002001 533MHz 32KB 1.73GHz Mcel-430 0902-002109 533MHz 32KB 1.86GHz Mcel-440 0902-002110 533MHz 32KB 2.00GHz...

  • Page 110: Glossary

    - This Document can not be used without Samsung's authorization - 11. References 3) Glossary Bad Sector An area on a hard disk or floppy disk that cannot be used to store data, because of a manufacturing defect or accidental damage. A floppy or hard disk saves data in units and the smallest unit of storage on a disk is a sector.
  • Page 111 - This Document can not be used without Samsung's authorization - 11. References Co-Processor A specialized processor that performs calculations very quickly under the control of the CPU. There are two types of co-processors, a numerical co-processor and a memory manager co-processor.
  • Page 112 - This Document can not be used without Samsung's authorization - 11. References DIMM Abbreviation for ‘Dual In-line Memory Module’. The memory capacity is doubled by installing DRAM chips on both sides of the memory module. This is similar to a combined 2 SIMM that uses only a single side.
  • Page 113 - This Document can not be used without Samsung's authorization - 11. References Flash Memory Since flash memory can be written or deleted electrically, you can delete data by blocks and reprogram the memory. Flash memory can continue to store information in the absence of a power source, can allow tens of thousands of reading and writing operations, and is expected as the next generation external storage device that can replace the floppy disk and magnetic disks.
  • Page 114 - This Document can not be used without Samsung's authorization - 11. References LVDS (Low Voltage Differential Signalling) LVDS is a digital signal transmission standard developed for the connection of laptop computers to their local LCD displays and can be run at very high speeds over cheap, twisted-pair copper cables.
  • Page 115 - This Document can not be used without Samsung's authorization - 11. References Bandwidth The number of bits that can be continuously transmitted or received per second. The higher the bandwidth the more efficient as data can be transferred in a shorter time.
  • Page 116 - This Document can not be used without Samsung's authorization - References ACPI (Advanced Configuration and Power Interface) This is an open industry power management specification co-developed by Intel and Microsoft to replace the APM (Advanced Power Management) specification. ACPI establishes industry-standard interfaces for OS-directed configurations and power management on laptops, desktops and servers.

  • Page 117: Hardware Upgrade

    - This Document can not be used without Samsung's authorization - 11. References 4) Hardware Upgrade All reassembly is done in the reverse order of disassembly. (1) Upgrading the ODD 1. Remove the screws at the bottom of the system.
  • Page 118 - This Document can not be used without Samsung's authorization - 11. References 3. ODD Types ODDs that can be used for the Q35/P50 include DVD-Combo, CD-ROM, DVD-ROM and Super Multi Drive (Dual Layer). - DVD-Combo Drive - Super Multi Drive (Dual Layer)
  • Page 119 - This Document can not be used without Samsung's authorization - 11. References (2) Upgrading the HDD. 1. Remove the HDD compartment cover. 2. Separate the HDD-FPC from the HDD connector on the main board. 3. Separate the HDD from the BRKT-HDD and replace the HDD. (The HDD type is PATA)
  • Page 120 - This Document can not be used without Samsung's authorization - 11. References (3) Replacing the Bluetooth 1.Remove the screws 2.Change the Bluetooth (4) Replacing the WLAN 1. Separate TOP from system as the figure shows. Disconnect speaker connector fromMBD.
  • Page 121 - This Document can not be used without Samsung's authorization - 11. References 2. Remove the WLAN (Lift the WLAN up sliding the WLAN hook left) (5) Upgrading Memory Removing the memory module Before removing/replacing the memory module,turn the system off completely and remove the battery.Do not replace the memory module when the system is in...
  • Page 122 - This Document can not be used without Samsung's authorization - 11. References 2. Push the memory module tabs outward to pop the memory module upwards. Carefully pull the module out at an angle of about 30 ˚. 11. References Adding a memory module 1.
  • Page 123 - This Document can not be used without Samsung's authorization - 11. References 11-18...
  • Page 124 - This Document cannot be used without the authorization of Samsung - 1. Precautions 1) General After-Sales Service Precautions (1) Do not let customers repair the product themselves. ☞ There is a danger of injury and the product life time may be shortened.
  • Page 125 - This Document cannot be used without the authorization of Samsung - 1. Precautions 2) Safety Precautions (1) EMI This device has been registered regarding EMI for residential use. It can be used in all areas. (2) Circuit Test (Logic Test) Precautions The LSI and MSI used in this product are semiconductor integrated circuits based on MOS-FET or CMOS.
  • Page 126 - This Document cannot be used without the authorization of Samsung - 1. Precautions 3) Ground The product must be grounded to protect it from static electricity and other dangers. When using a multitap, please use a multitap with a ground terminal only.

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