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<REAR CIRCUIT BOARD>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
<02>REAR
LYB10353-001A
FOIL SIDE(B)
LYA
10353
<JACK CIRCUIT BOARD>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
<03>JACK
LYB10353-001A
CAUTION :
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH SAME TYPE AND RATED FUSE(S).
!
ATTENTION :
POUR UNE PROTECTION PERMANENTE CONTRE LES RISQUE D'INCENDE,
REMPLACER LES FUSIBLES PAR UNAAUTRE DE MEME TYPE ET DE MEME TENSION.
+
C611
TL904
TL903
R901
TL901
TL902
-01A3
J601
FOIL SIDE(B)
COMPONENT SIDE(A)
LYA10353-01A1
CN201
COMPONENT SIDE(A)
F602
C601
L603
D613
PbF
PbF
0
3
AOI
PCB
JACK PWB ASS'Y
CN203
D611
D612
F601
F601
Q601
UL MARK
PbF
PbF
AOI
PCB
L602
C3A
0
2
16
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