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Intel LGA771 Design Manual

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LGA771 Socket
Mechanical Design Guide
November, 2006
Reference Number: 313871-002

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Summary of Contents for Intel LGA771

  • Page 1 LGA771 Socket Mechanical Design Guide November, 2006 Reference Number: 313871-002...
  • Page 2 Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, Xeon and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

  • Page 3: Table Of Contents

    Contents Introduction......................... 7 Document Goals and Scope .................. 7 1.1.1 LGA771 Socket Overview ................7 1.1.2 Document Goals..................7 1.1.3 Important Remarks .................. 7 Terminology ....................... 8 Reference Documents ..................8 Assembled Component and Package Description ............... 9 Mechanical Requirements .................... 11 Attachment ......................
  • Page 4 LGA771 Socket Motherboard Footprint (Sheet 4 of 7..........33 LGA771 Socket Motherboard Footprint (Sheet 5 of 7) ..........34 A-10 LGA771 Socket Motherboard Footprint (Sheet 6 of 7) ..........35 A-11 LGA 771 Socket Motherboard Footprint (Sheet 7 of 7) ..........36 A-12 LGA 771 Socket Footprint (Sheet 1 of 2) ..............37 A-13 LGA 771 Socket Footprint (Sheet 2 of 2) ..............38...
  • Page 5 Revision History Revision Description Date • Initial release of the document. June 2006 • Updated Dual-Core 5000 & 5100 Series stackup heights • Added Quad-Core 5300 Series stackup height November 2006 • Added Figure 3-1 • Removed Appendix B - Vendor Information §...
  • Page 6 LGA 771 Socket Mechanical Design Guide...

  • Page 7: Introduction

    A matching LGA package will be mated with the socket. For board layout, the land pattern for the LGA771 socket is 43 mils X 46 mils (X by Y), and the pad size is 18 mils. The component dimensions are defined in metric so there is a slight round-off error when converting to mils, but it is a negligible amount, relatively speaking, when compared to the size of the ball and pad.

  • Page 8: Terminology

    Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 313357 Quad-Core Intel® Xeon® Processor 5300 Series Datasheet 315569 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guide 315794 Note: Contact your Intel representative for the latest revisions of these documents. § LGA 771 Socket Mechanical Design Guide...

  • Page 9: Assembled Component And Package Description

    Assembled Component and Package Description The LGA771 Socket dimensions and characteristics must be compatible with that of the processor package and related assembly components. Processors using Flip-Chip Land Grid Array package technology are targeted to be used with the LGA771 socket.
  • Page 10 Assembled Component and Package Description LGA 771 Socket Mechanical Design Guide...

  • Page 11: Mechanical Requirements

    Solder ball tensile stress is created by inserting a processor into the socket and actuating the LGA771 socket load plate. In addition, solder joint shear stress is caused by coefficient of thermal expansion (CTE) mismatch induced shear loading. The solder joint compressive axial force induced by the heatsink static compressive load helps to reduce the combined joint tensile and shear stress.
  • Page 12 3.2.1.4.1 Name LGA771 (Font type is Helvetica Bold – minimum 6 point (or 2.125 mm)). This mark shall be stamped or Laser Marked into the sidewall of the stiffener plate on the actuation lever side when eutectic solder is used.

  • Page 13: Socket Actuation Mechanism

    • Eutectic Solder — Sn63 Pb37 (± 0.5% Sn). — Socket marking will be LGA771 for sockets comprised of eutectic solder. • Lead-free Solder — Composition must be lead free and have a melting point temperature in the range of 217-220°C (for example: Sn Ag 3.0 Cu 0.5).

  • Page 14: Pick And Place Cover

    The pick and place cover is a dual purpose removable component common to the LGA771 socket. The cover’s primary purpose is to provide a planar surface at least 20 mm in diameter and compatible with SMT placement systems. As such, the cover retention must be sufficient to support the socket weight during lifting, translation, and placement.

  • Page 15: Package/Socket Stackup Height

    Preliminary Guidance. This data is provided for information only, and should be derived from: (a) the height of the socket seating plane above the motherboard after reflow, given in the LGA771 Socket Mechanical Design Guide with its tolerances; (b) the height of the package, from the package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that are given in the corresponding processor datasheet.
  • Page 16 Refer to the processor Thermal Mechanical Design Guide for information on heatsink clip load metrology. R is defined as the radial distance from the center of the LGA771 socket ball array to the center of the heatsink load reaction point closest to the socket, as demonstrated in Figure 3-2.

  • Page 17: Definition Of R

    Mechanical Requirements Figure 3-2. Definition of R § LGA 771 Socket Mechanical Design Guide...
  • Page 18 Mechanical Requirements LGA 771 Socket Mechanical Design Guide...

  • Page 19: Electrical Requirements

    Electrical Requirements Electrical Requirements Table 4-1 provides the LGA771 Socket electrical requirements. Socket electrical requirements are measured from the socket-seating plane of the processor to the component side of the PCB to which it is attached. All specifications are maximum values (unless otherwise stated) for a single socket contact, but includes effects of adjacent contacts where indicated.
  • Page 20 Electrical Requirements LGA 771 Socket Mechanical Design Guide...

  • Page 21: Environmental Requirements

    A detailed description of this methodology can be found at: http://developer.intel.com/design/packtech/245162.htm. The use condition environment definitions provided in Table 5-1 are based on speculative use condition assumptions, and are provided as examples only.

  • Page 22: Use Conditions Environment

    Environmental Requirements Table 5-1. Use Conditions Environment Example Example Speculative Stress Example Use Environment 7 Year stress 10 Year stress Condition Use condition equivalent equivalent Slow small internal Temperature Cycle ΔT = 35 - 44°C 550-930 cycles 780-1345 cycles gradient changes due to (solder joint) Temp Cycle Q Temp Cycle Q...

  • Page 23: Solvent Resistance

    Environmental Requirements Solvent Resistance Requirement: No damage to ink markings if applicable. EIA 364-11A. Durability Use per EIA-364, test procedure 09. Measure contact resistance when mated in 1st and 30th cycles. The package should be removed at the end of each de-actuation cycle and reinserted into the socket.
  • Page 24 Environmental Requirements LGA 771 Socket Mechanical Design Guide...

  • Page 25: A Mechanical Drawings

    The following table lists the mechanical drawings included in this section. These drawings refer to the LGA771 socket. Note: Intel reserves the right to make changes and modifications to the design as necessary. Drawing Description Page Number LGA771 Socket Assembly Drawing...

  • Page 26: Lga Socket Assembly Drawing (Sheet 1 Of 4)

    Mechanical Drawings Figure A-1. LGA Socket Assembly Drawing (Sheet 1 of 4) LGA 771 Socket Mechanical Design Guide...

  • Page 27: Lga Socket Assembly Drawing (Sheet 2 Of 4)

    Mechanical Drawings Figure A-2. LGA Socket Assembly Drawing (Sheet 2 of 4) LGA 771 Socket Mechanical Design Guide...

  • Page 28: Lga Socket Assembly Drawing (Sheet 3 Of 4)

    Mechanical Drawings Figure A-3. LGA Socket Assembly Drawing (Sheet 3 of 4) LGA 771 Socket Mechanical Design Guide...

  • Page 29: Lga Socket Assembly Drawing (Sheet 4 Of 4)

    Mechanical Drawings Figure A-4. LGA Socket Assembly Drawing (Sheet 4 of 4) LGA 771 Socket Mechanical Design Guide...

  • Page 30: Lga771 Socket Motherboard Footprint (Sheet 1 Of 7)

    Mechanical Drawings Figure A-5. LGA771 Socket Motherboard Footprint (Sheet 1 of 7) LGA 771 Socket Mechanical Design Guide...

  • Page 31: Lga771 Socket Motherboard Footprint (Sheet 2 Of 7)

    Mechanical Drawings Figure A-6. LGA771 Socket Motherboard Footprint (Sheet 2 of 7) LGA 771 Socket Mechanical Design Guide...

  • Page 32: Lga771 Socket Motherboard Footprint (Sheet 3 Of 7)

    Mechanical Drawings Figure A-7. LGA771 Socket Motherboard Footprint (Sheet 3 of 7) LGA 771 Socket Mechanical Design Guide...

  • Page 33: Lga771 Socket Motherboard Footprint

    Mechanical Drawings Figure A-8. LGA771 Socket Motherboard Footprint (Sheet 4 of 7 LGA 771 Socket Mechanical Design Guide...

  • Page 34: Lga771 Socket Motherboard Footprint (Sheet 5 Of 7)

    Mechanical Drawings Figure A-9. LGA771 Socket Motherboard Footprint (Sheet 5 of 7) LGA 771 Socket Mechanical Design Guide...
  • Page 35 Mechanical Drawings Figure A-10. LGA771 Socket Motherboard Footprint (Sheet 6 of 7) LGA 771 Socket Mechanical Design Guide...

  • Page 36: Lga 771 Socket Motherboard Footprint (Sheet 7 Of 7)

    Mechanical Drawings Figure A-11. LGA 771 Socket Motherboard Footprint (Sheet 7 of 7) LGA 771 Socket Mechanical Design Guide...

  • Page 37: Lga 771 Socket Footprint (Sheet 1 Of 2)

    Mechanical Drawings Figure A-12. LGA 771 Socket Footprint (Sheet 1 of 2) LGA 771 Socket Mechanical Design Guide...

  • Page 38: Lga 771 Socket Footprint (Sheet 2 Of 2)

    Mechanical Drawings Figure A-13. LGA 771 Socket Footprint (Sheet 2 of 2) § LGA 771 Socket Mechanical Design Guide...

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