Attaching The Non-F Model Processor Carrier Assembly To The Heatsink To Form The Processor Heatsink Module (Phm) - Supermicro X11SPW-CTF User Manual

Attaching the Non-F Model Processor Carrier Assembly to the
Heatsink to Form the Processor Heatsink Module (PHM)
After you have made a processor carrier assembly by following the instructions on the
previous page, please follow the steps below to mount the processor carrier assembly onto
the heatsink to create the Processor Heatsink Module (PHM):
1. Locate "1" on the heatsink label and the triangular corner next to it on the heatsink.
With your index finger pressing against the screw at this triangular corner, carefully hold
and turn the heatsink upside down with the thermal-grease side facing up. Remove the
protective thermal film if present, and apply the proper amount of the thermal grease
as needed. (Skip this step if you have a new heatsink because the necessary thermal
grease is pre-applied in the factory.)
2. Holding the processor carrier assembly at the center edge, turn it upside down. With
the thermal-grease side facing up, locate the hollow triangle located at the corner of the
processor carrier assembly ("a" in the graphic). Note a larger hole and plastic mounting
clicks located next to the hollow triangle. Also locate another set of mounting clicks and
a larger hole at the diagonal corner
of the same (reverse) side of the
processor carrier assembly ("b" in
the graphic).
3. With the back of the heatsink and
the reverse side of the processor
carrier assembly facing up, align the
triangular corner on the heatsink
("A" in the graphic) against the
mounting clips next to the hollow
triangle ("a") on the processor
carrier assembly.
4. Also align the triangular corner ("B")
at the diagonal side of the heatsink
with the corresponding clips on the
processor carrier assembly ("b").
5. Once the mounting clips on
the processor carrier assembly
are properly aligned with the
corresponding holes on the back
of the heatsink, securely attach the
heatsink to the processor carrier
assembly by snapping the mounting
clips at the proper places on the
heatsink to create the processor
heatsink module (PHM).
Non-Fabric CPU and Processor Clip
(Upside Down)
Triangle on the CPU
d
D
Triangle on the
Processor Clip
Heatsink
(Upside Down)
D
On Locations (A, B), the notches
snap onto the heatsink's sides
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Chapter 2: Installation
b
c
B
a
C
A
On Locations of (C, D), the notches
snap onto the heat sink's
B
mounting holes
C
A
Make sure Mounting
Notches snap into place