Table Of Contents - Sony MZ-E33 Service Manual

Mass
Approx. 113 g (4.0 oz.) the player only
Approx. 155 g (5.5 oz.) incl. a premastered MD and a Sony
alkaline LR6 (SG) battery
Supplied accessories
AC power adaptor AC-MZR55 (1)
R-6 sized Ni-MH rechargeable battery NH-MDAA (1)
Rechargeable battery carrying case (1)
Headphones with a remote control
MDR-A34SP + RM-MZE33 (1) (US model)
MDR-E805SP + RM-MZE33 (1) (Canadian, AEP, E model)
MDR-E838SP + RM-MZE33 (1) (Hong Kong model)
Carrying pouch (1)
Design and specifications are subject to change without notice.
IN NO EVENT SHALL SELLER BE
LIABLE FOR ANY DIRECT,
INCIDENTAL OR CONSEQUENTIAL
DAMAGES OF ANY NATURE, OR
LOSSES OR EXPENSES RESULTING
FROM ANY DEFECTIVE PRODUCT
OR THE USE OF ANY PRODUCT.
"MD WALKMAN" is a trademark of Sony
Corporation.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE
WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
This MiniDisc player is classi-
fied as a CLASS 1 LASER
product.
The CLASS 1 LASER
PRODUCT label is located on
the bottom exterior.

TABLE OF CONTENTS

1. SERVICING NOTE
2. GENERAL
....................................................................... 4
3. DISASSEMBLY
3-1. Bottom Panel Assy .............................................................. 5
3-2. Upper Panel Assy ................................................................ 5
3-3. Main Board ......................................................................... 6
3-4. MD Assy ............................................................................. 6
3-5. OP Service Assy .................................................................. 6
4. TEST MODE
................................................................... 7
5. ELECTRICAL ADJUSTMENTS
6. DIAGRAMS
6-1. IC Pin Description ............................................................. 13
6-2. Block Diagram .................................................................. 15
6-3. Printed Wiring Board ........................................................ 18
6-4. Schematic Diagram ........................................................... 21
7. EXPLODED VIEWS
7-1. Panel Section ..................................................................... 29
7-2. Main Board Section .......................................................... 30
7-3. Mechanism Deck Section .................................................. 31
8. ELECTRICAL PARTS LIST
ATTENTION AU COMPOSANT AYANT RAPPORT
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE ! SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
- 2 -
....................................................... 3
............................ 11
.................................... 32
À LA SÉCURITÉ!!