LG -E405 Service Manual page 179

Level LocationNo.
IC,Acceleration
6 U6000
Sensor
6 U5000 IC,Sub PMIC
6 U1003 IC,Power Amplifier
6 U4000 IC,Mini ABB
6 U1002 IC,Power Amplifier
IC,Digital
6 U2000 Baseband
Processor,3G
6 6 U9001 U9001 IC,WiFi IC WiFi
6 U1001 Module,Tx Module
Oscillator
6 X2000
VCTCXO
C9018 Capacitor
6
C9025 Ceramic,Chip
Capacitor
6 C1105
Ceramic,Chip
LGE Internal Use Only
13. EXPLODED VIEW & REPLACEMENT PART LIST
Description PartNumber
EAN62222201
EAN62334401
EAN62336501
EAN62339701
EAN62352401
EAN62405901
EAN62416201 EAN62416201
EAT61673301
EAW61543601
ECCH0000110
ECCH0000113
Spec
BMC050 Accelerometer with Geomagnetic Sensor
3X3X1 QFN R/TP 16P Accelerometer with
Geomagnetic Sensor BOSCH SENSORTEC
GMBH
BU61800GWL 2.7 to 5.5V adj 0W CSP R/TP 25P -
ROHM Semiconductor KOREA CORPORATION
ACPM-5508-TR1 3.2V to 4.2V 0 0 0W 0W 0 1 SMD
R/TP 10P ACPM-5508-TR1, Band8, 2mode, with
CPL, 3*3*0.9mm AVAGO TECHNOLOGIES
INTERNATIONAL SALES PTE. LIMITED
LP8727- B MUIC with Charger IC CSP R/TP 25P
TEXAS INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.
ACPM-5501-TR1 3.2V to 4.2V 0 0 0W 0W 0 1 SMD
R/TP 10P Band1, 2mode, with CPL, 3*3*0.9size
AVAGO TECHNOLOGIES INTERNATIONAL
SALES PTE. LIMITED
MSM7225A-1-AA
576NSP,ARMv7(800MHz),HSDPA(DL7.2Mbps
only), HVGA LCD, VGA30fps,5M,MIPI CSI_DSI
NSP R/TP 576P QUALCOMM INCORPORATED.
WCN1314-0-87WLNSP-TR-0D WCN1314 Revision
version, WiFi(11bgn) signle band, 3.95x4.16x0.63, , ( g ) g
0.4pitch, 65nm, WLCSP R/TP 87P QUALCOMM
INCORPORATED.
RF3242 0DBM 0DB 0% 0A 0A 0DB 0DBM 0DBM
22P 6.63x5.24x0.975MM WGPRS Quad Tx Dual
Rx, SP6T, Dual WCDMA Port, 22pin,
6.63*5.24*0.975 RF MICRO DEVICES INC
X1G003581002700 19.2MHZ 2PPM 2.8V
2.5x2.0x0.8MM ; SMD R/TP EPSON TOYOCOM
CORP
MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C
1005 R/TP - ROHM Semiconductor KOREA
CORPORATION
MCH155A180J 18pF 5% 50V NP0 -55TO+125C
1005 R/TP - ROHM Semiconductor KOREA
CORPORATION
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