Table Of Contents - LG -T300 Service Manual

1. INTRODUCTION ..................................................................5
1.1 Purpose ............................................................................................... 5
1.2 Regulatory Information ............................................................... 5
1. Abbreviations ................................................................................... 7
2. PERFORMANCE ...................................................................9
2.1 H/W Features .................................................................................... 9
2.2 Technical Specification ...............................................................11
3. TECHNICAL BRIEF .............................................................16
.1 Baseband Processor Introduction .........................................16
.2 Power Management ....................................................................21
. FEM with integrated Power Amplifier Module
(RF7161, U401) ...............................................................................
FEM with integrated Power Amplifier Module ........................4
.4 Crystal(26 MHz, X100) .................................................................5
.5 RF Subsystem of PMB8810 (U102).........................................6
.6 MEMORY(PF8F5066M0YDE, U101 ) .................................41
.7 BT module .......................................................................................4
.8 SIM Card Interface ........................................................................45
.9 LCD Interface ..................................................................................46
.10 Battery Charger Interface .......................................................49
.11 Keypad Interface ........................................................................50
.12 Audio Interface ...........................................................................52
.1 Camera Interface(2M Fixed Focus Camera) .....................58
.14 Touch Interface ...........................................................................60
.15 Vibrator Interface .......................................................................61
4. TROUBLE SHOOTING .......................................................63
4.1 RF Component...............................................................................6
4.2 RX Trouble .......................................................................................64
4. TX Trouble ........................................................................................68
4.4 Power On Trouble .........................................................................72
4.5 Charging Trouble ..........................................................................75
4.6 Vibrator Trouble .............................................................................77
4.7 LCD Trouble .....................................................................................80
4.8 Camera Trouble .............................................................................84
4.9 Speaker / Receiver Trouble .......................................................88
4.10 Earphone Trouble ......................................................................91
4.11 Microphone Trouble .................................................................94
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Table of Contents

4.12 SIM Card Interface Trouble .....................................................96
4.1 Micro SD (uSD) Trouble ............................................................98
4.14 Bluetooth Trouble ................................................................... 101
4.15 FM Radio Trouble .................................................................... 104
5. DOWNLOAD ................................................................... 110
6. BLOCK DIAGRAM ........................................................... 123
7. CIRCUIT DIAGRAM ........................................................ 125
8. BGA PIN MAP ................................................................. 129
9. PCB LAYOUT ................................................................... 131
10.ENGINEERING MODE ................................................... 133
11. STAND ALONE TEST .................................................... 134
11.1 Introduction .............................................................................. 14
11.2 Setting Method ........................................................................ 14
11. Tx Test ........................................................................................... 17
11.4 Rx Test .......................................................................................... 18
12.AUTO CALIBRATION ..................................................... 139
12.1 Overview .................................................................................... 19
12.2 Configuration of HotKimchi ............................................... 19
12. Description of Basic File ....................................................... 140
12.4 Procedure ................................................................................... 141
12.5 AGC ............................................................................................... 144
12.6 APC ............................................................................................... 144
12.7 ADC ............................................................................................... 144
12.8 Target Power ............................................................................. 144
13 EXPLODED VIEW & REPLACEMENT
PART LIST ...................................................................... 145
1.1 EXPLODED VIEW ...................................................................... 145
1.2 Replacement Parts.................................................................. 147
1. Accessory ................................................................................... 162
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