Siemens C75 Service Repair Documentation page 20

Company Confidential
Copyright 2005© Siemens AG
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Interfaces and Features
• Keypad Interface for scanning keypads up to 6 rows and 4 columns
• Pulse Number Modulation output for Automatic Frequency Correction (AFC)
• Serial RF Control Interface; support of direct conversion RF
• 2 USARTs with autobaud detection and hardware flow control
• IrDA Controller integrated in USART0 (with IrDA support up to 115.2 kbps)
• 1 Serial Synchronous SPI compatible interfaces in the controller domain
• 1 Serial Synchronous SPI compatible interface in the TEAKLite domain
• I2C-bus interface (e.g. connection to S/M-Power)
• 2 bidirectional and one unidirectional I2S interface accessible from the TEAKLite
• USB V1.1 mini host interface for full speed devices with up to 5 interfaces and 10
endpoints configurable supporting also USB on-the-go functionality
• ISO 7816 compatible SIM card interface
• Enhanced digital (phase linearity, adj/ co-channel interference) baseband filters,
including analog prefilters and high resolution analog-to-digital converters.
• Separate analog-to-digital converter for various general purpose measurements like
battery voltage, battery, VCXO and environmental temperature, battery technology,
transmission power, offset, onchip temperature, etc.
• Ringer support for highly oversampled PDM/PWM input signals for more versatility in
ringer tone generation
• RF power ramping functions
• DAI Interface according to GSM 11.10 is implemented via dedicated I2S mode
• 26 MHz master clock input
• External memory interface:
– 1.8V interface
– Data bus: 16 bit non-multiplexed and multiplexed, 32 bit multiplexed
– Supports synchronous devices (SDRAMs and Flash Memory) up to 62.4 MHz
– For each of the 4 address regions 128 MByte with 32-bit access or 64 MByte with a
16-bit access are addressable
– Supports asynchronous devices (i.e. SRAM, display) including write buffer for
cache line write
• Port logic for external port signals
• Comprehensive static and dynamic Power Management
– Various frequency options during operation mode
– 32 kHz clock in standby mode
– Sleep control in standby mode
– RAMs and ROMs in power save mode during standby mode
– Additional leakage current reduction in standby mode possible by switching off the
power for the TEAKLite subsystem.
Service Repair Documentation
Level 2.5e – C75
Page of
20 37
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Release 1.0