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20 HOW TO REPLACE FLAT
PACKAGE IC
20.1. Preparation
SOLDER
Sparkle Solder 115A-1, 115B-1 or Almit Solder KR-19, KR-
19RMA
Soldering iron
Recommended power consumption will be between 30 W
to 40 W.
Temperature of Copper Rod 662 ± 50°F (350 ± 10°C)
(An expert may handle between 60 W to 80 W iron, but
beginner might damage foil by overheating.)
Flux
HI115 Specific gravity 0.863.
(Original flux will be replaced daily.)
20.2. Procedure
1. Temporary fix FLAT PACKAGE IC by soldering on two
marked 2 pins.
*Most important matter is accurate setting
of IC to the corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder employing specified solder to direction of arrow, as
sliding the soldering iron.
KX-TC1205RUB / KX-TC1205R UW / KX-TC1205R US / KX-TC1205RUF
20.3. Modification Procedure of
Bridge
1. Re-solder slightly on bridged portion.
2. Remove remained solder along pins employing soldering
iron as shown in below figure.
49
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