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TABLE OF CONTENTS
Specifications ........................................................................... 1
1. GENERAL
Identifying the Parts ............................................................. 3
Checking the Package Contents ........................................... 4
Setting Up the Base Phone ................................................... 4
Preparing the Battery Pack ................................................... 5
Entering the Area Code ........................................................ 5
Making Calls ........................................................................ 6
Receiving Calls . ................................................................... 8
Speed Dialing ....................................................................... 8
Phone Directory ................................................................... 9
Setting the Ringer Type ...................................................... 10
Switching the Phones During a Call .................................... 11
Talking Between the Phones (Intercom) ............................. 11
Transferring a Call ............................................................... 11
Setting Up the Answering Machine .................................... 12
Playing Back Messages ...................................................... 14
Selecting the Announcement Only Mode ........................... 14
Screening Calls ................................................................... 14
Recording a Memo Message .............................................. 15
Operating From an Outside Phone ..................................... 15
Understanding the Caller ID Service .................................. 15
Looking at the Caller ID List ............................................. 16
Using the Caller ID List ..................................................... 16
Using "Caller ID with Call Waiting" Service ..................... 17
2-1. H/S Rear .................................................................... 18
2-2. "RF Unit ASSY, Hand", Hand Main Board ............... 18
2-3. Base Bottom ............................................................. 19
2-4. Base Main Board ...................................................... 19
2-5. RF Unit ASSY, Base .................................................. 20
2-6. Base Key Board, LCD Board .................................... 20
Base Unit ............................................................................ 21
Handset .............................................................................. 23
4-1. Block Diagram - Base Unit Section - ....................... 25
4-2. Block Diagram- Handset Section - ........................... 27
4-3. Schematic Diagram - Base Main Board (1/2) - ....... 29
4-4. Schematic Diagram - Base Main Board (2/2) - ....... 31
4-5. Printed Wiring Board- Base Main Board (1/2) - ..... 33
4-6. Printed Wiring Board- Base Main Board (2/2) - ..... 35
4-7. Printed Wiring Board- Base Key Board (1/2) - ....... 37
4-8. Printed Wiring Board- Base Key Board (2/2) - ....... 39
4-9. Schematic Diagram - Base Key Board - ................. 41
4-10. Printed Wiring Board - Hand Main Board - ............. 43
4-11. Schematic Diagram - Hand Main Board (1/2) - ...... 45
4-12. Schematic Diagram - Hand Main Board (2/2) - ...... 47
5. EXPLODED VIEWS
5-1. Handset Section ......................................................... 49
5-2. Base Unit Section ...................................................... 50
.................................... 51
- 2 -
Note for Replacement of the ASIC Board
The ID is written in the ASIC board.
When replacing the ASIC board, the U3003 on BASE MAIN board
and U1001 on HAND MAIN board should be replaced together as
a pair.
NOTE FOR REPLACEMENT OF THE EEPROM
When replacing the EEPROM, U3007 on the BASE MAIN
board and U1006 on HAND MAIN board should be replaced
together as a pair.
- BASE MAIN BOARD (SIDE A) -
- HAND MAIN BOARD (SIDE B) -
U1001
U1006
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH
MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
U3007
U3003
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