Table Of Contents - Sony HCD-BX9 Service Manual

Compact disc deck receiver
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MODEL IDENTIFICATION
- BACK PANEL -
MODEL
BX9, DX9: MX models
DX9: E, AR, SP, MY, EA, AUS models
• Abbreviation
AUS : Australian model
EA
: Saudi Arabia model
MY
: Malaysia model
SP
: Singapore model
MX
: Mexican model
AR
: Argentina model
PARTS No.
PARTS No.
4-225-041-4s
4-225-041-5s

TABLE OF CONTENTS

······························································· 4
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···································································· 12
7-1. Circuit Board Location ····················································· 21
7-2. Block Diagrams ································································ 22
7-3. Printed Wiring Board - BD Section - ······························ 24
7-4. Schematic Diagram - BD Section - ································· 25
7-5. Printed Wiring Board - Main Section - ··························· 26
7-6. Schematic Diagram - Main (1/3) Section - ····················· 27
7-7. Schematic Diagram - Main (2/3) Section - ····················· 28
7-8. Schematic Diagram - Main (3/3) Section - ····················· 29
(BX9 model) ····································································· 30
(BX9 model) ····································································· 31
(DX9 model) ····································································· 32
(DX9 model) ····································································· 33
7-13. Printed Wiring Board - Panel Section - ··························· 34
7-14. Schematic Diagram - Panel Section - ····························· 35
7-15. Printed Wiring Board - Leaf SW Section - ···················· 36
7-16. Schematic Diagram - Leaf SW Section - ························ 37
7-17. Printed Wiring Board - Driver Section - ························· 38
7-18. Schematic Diagram - Driver Section - ···························· 39
(BX9 model) ····································································· 40
(BX9 model) ····································································· 41
(DX9 model) ····································································· 42
(DX9 model) ····································································· 43
7-23. IC Pin Function Description ············································· 44
7-24. IC Block Diagrams ··························································· 46
8-1. Main Section ····································································· 49
8-2. Panel Section ···································································· 50
8-3. Main Board Section ·························································· 51
8-4. Tape Mechanism Deck Section-1 ····································· 52
8-5. Tape Mechanism Deck Section-2 ····································· 53
8-7. Base Unit Section (BU-K2BD38) ···································· 55
Ver 1.2 2001.08
····························· 16
······························· 16
······································· 56
3

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