Resin Coatings; Minimum Distance Between Sensor And Pcb - Bosch BME280 Mounting Instructions

Combined humidity and pressure sensor
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Bosch Sensortec | HSMI BME280

5.7. Resin coatings

Please avoid total and partial covering of the BME280 sensor with any protective material like for example
epoxy resin.
As shown in the above figure, please take care that the sensor is not covered and not in contact with any
(epoxy) resign material leading to an un-symmetric stress distribution over the sensor package.

5.8. Minimum distance between Sensor and PCB

The distance between the sensor and the PCB after the soldering process must be at least 50µm.
Document number BST-BME280-HS006-00 | May 2018
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.
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