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HPE ProLiant DL80 Gen9 Server Maintenance and Service Guide Abstract This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardware components and software. This guide is for an experienced service technician. Hewlett Packard Enterprise assumes that you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.
Customer self repair Hewlett Packard Enterprise products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period Hewlett Packard Enterprise (or Hewlett Packard Enterprise service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, Hewlett Packard Enterprise will ship that part directly to you for replacement.
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• Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à Hewlett Packard Enterprise de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. • Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
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NOTA: alcuni componenti Hewlett Packard Enterprise non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, Hewlett Packard Enterprise richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.
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Support Center anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien von Hewlett Packard Enterprise, die mit einem CSR-Ersatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an Hewlett Packard Enterprise zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an Hewlett Packard Enterprise zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen.
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deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no enviara el componente defectuoso requerido, Hewlett Packard Enterprise podrá cobrarle por el de sustitución.
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Enterprise u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt Hewlett Packard Enterprise alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest Hewlett Packard Enterprise zelf welke koerier/transportonderneming hiervoor wordt gebruikt. Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van Hewlett Packard Enterprise.
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Para obter mais informações sobre o programa de reparo feito pelo cliente da Hewlett Packard Enterprise, entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da Hewlett Packard Enterprise (http://www.hpe.com/support/selfrepair). Serviço de garantia apenas para peças A garantia limitada da Hewlett Packard Enterprise pode incluir um serviço de garantia apenas para peças.
Illustrated parts catalog Mechanical components Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported parts information, see the Hewlett Packard Enterprise PartSurfer website (http://www.hpe.com/info/partssurfer). Item Description Spare part Customer self repair number (on page 6) Access panel 790526-001 Mandatory...
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Obligatoire—Pièces pour lesquelles le client doit procéder lui-même aux réparations. Si vous demandez à Hewlett Packard Enterprise de procéder au remplacement de ces pièces, les frais de transport et de main d’œuvre pour ce service vous seront facturés. Facultatif—Pièces pour lesquelles une réparation par le client est facultative. Ces pièces sont également conçues pour que le client puisse procéder lui-même aux réparations.
Não—Algumas peças da Hewlett Packard Enterprise não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a Hewlett Packard Enterprise exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca "No" (Não), no catálogo de peças ilustrado. System components Hewlett Packard Enterprise continually improves and changes product parts.
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Item Description Spare part Customer self repair number (on page 6) GPU riser board 790525-001 Optional Two-slot PCIe riser board 790524-001 Optional System battery 319603-001 Mandatory FlexibleLOM riser board 790523-001 Optional SATA M.2 SSD single module enablement kit 797907-001 Optional a) M.2 SSD enablement board —...
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Spare part Customer self repair Item Description number (on page 6) b) AC/240V DC RPS backplane assembly* 830022-001 Optional Hot-plug power input modules — — a) HPE 800 W/900 W Gold AC Power Input Module 754376-001 Mandatory b) HPE 900 W AC/ 240 V DC Gold Power Input 830219-001 Mandatory Module*...
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Zwingend—Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den Austausch dieser Teile von Hewlett Packard Enterprisevornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service berechnet. Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer Self Repair ausgelegt.
Removal and replacement procedures Required tools You need the following items for some procedures: • T-25 Torx screwdriver (to loosen the shipping screws located inside the server quick-release latch rack ears) • T-10/T-15 Torx screwdriver • Flathead screwdriver (for replacing the system battery) •...
This symbol on an RJ-45 receptacle indicates a network interface connection. WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors into this receptacle. This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists.
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that: • The leveling jacks are extended to the floor. • The full weight of the rack rests on the leveling jacks. • The stabilizing feet are attached to the rack if it is a single-rack installation. •...
Remove the security bezel (optional) To access the front panel components, unlock and then remove the security bezel. The security bezel is only supported in servers that are using the quick-release latch rack ears. Power down the server Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data and programs.
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Power down the server (on page 27). Disconnect all peripheral cables from the server. Disconnect each power cord from the server. In a server that uses thumbscrew rack ears, loosen the captive thumbscrews that secure the server faceplate to the front of the rack, and then slide the server out of the rack. In a server that uses quick-release latch rack ears: Open the latches on both sides of the server.
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After performing the installation or maintenance procedure, slide the server back into the rack, and then press the server firmly into the rack to secure it in place. Do one of the following: In a server that uses thumbscrew rack ears, tighten the captive thumbscrews. In a server that uses quick-release latch rack ears, if necessary, tighten the shipping screws.
Access the product rear panel Opening the cable management arm To access the server rear panel: Release the cable management arm. Open the cable management arm. The cable management arm can be right-mounted or left-mounted. Remove the server from the rack Removal and replacement procedures 30...
WARNING: This server is very heavy. To reduce the risk of personal injury or damage to the equipment: • Observe local occupational health and safety requirements and guidelines for manual material handling. • Get help to lift and stabilize the product during installation or removal, especially when the product is not fastened to the rails.
Grasp the PCI riser cage at the touch points and lift it out of the chassis. If you are removing the FlexibleLOM riser cage from the secondary PCIe riser location, do the following: Disconnect all cables connected to existing expansion boards. Loosen the captive thumbscrew on the front end of the PCI riser cage, and then remove the screw from its rear end.
Disconnect each power cord from the power source. Disconnect each power cord from the server. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27). Remove the drive carrier. To replace the component, slide the component into the bay until it clicks. Non-hot-plug drive CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.
Remove the drive from the carrier. To replace the component, reverse the removal procedure. Hot-plug drive blank CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: If installed, remove the security bezel ("Remove the security bezel...
Remove the hot-plug drive. To replace the component, reverse the removal procedure. Access panel WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.
Lift and remove the access panel. To replace the component, reverse the removal procedure. Air baffle CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open.
Remove the air baffle. To replace the component, reverse the removal procedure. 4-bay LFF non-hot-plug drive backplane WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.
Remove the drive backplane. To replace the component, reverse the removal procedure. 4-bay LFF hot-plug drive backplane WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.
Remove the drive backplane. To replace the component, reverse the removal procedure. Smart Storage Battery WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.
Push the Smart Storage Battery retainer backward to release the battery, and then remove the battery from the chassis. To replace the component, reverse the removal procedure. Smart Storage Battery retainer WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
Using your hand or a small plier, pull the retainer pin up to disengage its bottom part from the chassis, and then slide the retainer forward to remove it from the chassis. To replace the component, reverse the removal procedure. FBWC module WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
CAUTION: When connecting or disconnecting the cache module cable, the connectors on the cache module and cable are susceptible to damage. Avoid excessive force and use caution to avoid damage to these connectors. Disconnect the cache module backup power cable from the cache module. Remove the cache module.
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Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 27). Remove the server from the rack (on page 30). Remove the access panel ("Access panel"...
M.2 SSD enablement board removal from the system board M.2 SSD enablement board removal from the FlexibleLOM riser cage To replace the component, reverse the removal procedure. Fan blank WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
To remove the component: Power down the server (on page 27). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 27). Remove the server from the rack (on page 30).
Extend the server from the rack (on page 27). Remove the server from the rack (on page 30). Remove the access panel ("Access panel" on page 35). Remove the air baffle ("Air baffle" on page 36). CAUTION: The fan does not have a fan guard. Special attention is needed when removing or installing the fan to prevent finger injury.
CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. Power down the server (on page 27). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server.
Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 27). Remove the server from the rack (on page 30). Remove the access panel ("Access panel" on page 35). Remove the air baffle ("Air baffle"...
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Completely loosen all screws in the same sequence. Remove the heatsink from the processor backplate. To replace the component: Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. Remove the thermal interface protective cover from the heatsink. Install the heatsink: Position the heatsink on the processor backplate.
Finish the installation by completely tightening the screws in the same sequence. Install the air baffle. Install the access panel. Do one of the following: Slide the server into the rack. Install the server into the rack. Connect each power cord to the server. Connect each power cord to the power source.
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IMPORTANT: Processor socket 1 must be populated at all times or the server does not function. To remove the component: Power down the server (on page 27). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 27).
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Remove the processor from the processor retaining bracket. To replace the component: Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
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Close the processor retaining bracket. When the processor is installed properly inside the processor retaining bracket, the processor retaining bracket clears the flange on the front of the socket. Press and hold the processor retaining bracket in place, and then close each processor locking lever.
Finish the installation by completely tightening the screws in the same sequence. Install the air baffle. Install the access panel. Do one of the following: Slide the server into the rack. Install the server into the rack. Connect each power cord to the server. Connect each power cord to the power source.
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Remove the server from the rack (on page 30). Remove the access panel ("Access panel" on page 35). If you are removing an expansion board installed in the primary PCI riser cage, remove the riser cage ("Remove the PCI riser cages"...
Low-profile expansion board removal from the FlexibleLOM riser cage FlexibleLOM adapter removal from the FlexibleLOM riser cage If you are removing a storage controller board with a cache module installed, remove the cache module. To replace the component, reverse the removal procedure. Primary PCI riser cage blank WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
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To remove the component: Power down the server (on page 27). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 27). Remove the server from the rack (on page 30).
Onboard low-profile PCI expansion slot cover CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.
To remove the component: Power down the server (on page 27). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 27). Remove the server from the rack (on page 30).
CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: Power down the server (on page 27). Remove all power: Disconnect each power cord from the power source.
Remove the primary PCI riser cage ("Remove the PCI riser cages" on page 31). Remove any existing expansion board from the riser board ("Expansion board" on page 54). Remove the PCIe riser board. To replace the component, reverse the removal procedure. FlexibleLOM riser board WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
Remove the FlexibleLOM riser board. To replace the component, reverse the removal procedure. System battery If the server no longer automatically displays the correct date and time, then replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack.
Use a small flat-bladed, nonconductive tool to carefully remove the battery from the socket. IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, use BIOS/Platform Configuration (RBSU) in the UEFI System Utilities ("HPE UEFI System Utilities"...
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Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 27). Remove the server from the rack (on page 30). Remove the access panel ("Access panel" on page 35). Remove the air baffle ("Air baffle"...
Remove the front I/O assembly. To replace the component, reverse the removal procedure. Thumbscrew rack ears To remove the component: Power down the server (on page 27). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Remove the server from the rack (on page 30).
Left thumbscrew rack ear To replace the component, reverse the removal procedure. Quick-release latch rack ear assembly WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.
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Detach the ambient thermal sensor cable from its clip. Disconnect the front I/O assembly cable. Remove the cable cover behind the right quick-release latch rack ear. Removal and replacement procedures 67...
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Release the front I/O cabling from the side chassis metal clip. Remove the right quick-release latch rack ear assembly. Removal and replacement procedures 68...
Remove the left quick-release latch rack ear. To replace the component, reverse the removal procedure. System board WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.
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Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws. Completely loosen all screws in the same sequence. Remove the heatsink from the processor backplate. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket.
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Remove the processor from the processor retaining bracket. Disconnect all cables connected to the system board. Remove the failed system board. Removal and replacement procedures 71...
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To replace the system board: Install the system board. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. Removal and replacement procedures 72...
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Remove the clear processor socket cover. Retain the processor socket cover for future use. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
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Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. Install the processor socket cover on the failed system board. Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuing.
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Finish the installation by completely tightening the screws in the same sequence. Install all components removed from the failed system board. Connect all cables disconnected from the failed system board. If removed, install the primary PCI riser cage. If removed, install the FlexibleLOM riser cage. Install the air baffle.
Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always match the Product ID located on the chassis. Enter the product ID and press the Enter key. Press the F10 key to confirm exiting System Utilities. The server automatically reboots. HPE 550 W Power Supply WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
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Remove the PCI air baffle. Disconnect the non-hot-plug power supply cables. Release the non-hot-plug power supply cables from the cable clip. Removal and replacement procedures 77...
Remove the non-hot-plug power supply. To replace the component, reverse the removal procedure. Redundant power supply components Power input module and RPS backplane characteristics • HPE 800 W/900 W Gold AC Power Input Module (744689-B21) This module is compatible with the AC RPS backplane (745813-B21). The module wattage rating changes depending on whether one or two power input modules are installed in the server: —...
Remove the power input module. To replace the component, reverse the removal procedure. RPS backplane WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.
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Remove the PCI air baffle. Disconnect the RPS backplane cables. Release the RPS backplane cables from the cable clips. Removal and replacement procedures 80...
Remove the RPS backplane. To replace the component, reverse the removal procedure. HP Trusted Platform Module The TPM is not a customer-removable part. CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data.
Troubleshooting Troubleshooting resources The HPE ProLiant Gen9 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: •...
Diagnostic tools Product QuickSpecs For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/info/qs). HPE iLO The iLO 4 subsystem is a standard component of ProLiant servers that simplifies initial server setup, server health monitoring, power and thermal optimization, and remote server administration.
• Rich configuration history • Health and service alerts • Easy export and upload to Service and Support The Active Health System monitors and records changes in the server hardware and system configuration. The Active Health System assists in diagnosing problems and delivering rapid resolution if server failures occur.
Integrated Management Log The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity. You can view recorded events in the IML in several ways, including the following: • From within HPE SIM •...
• Upon the first system power-up • After defaults have been restored Default configuration settings are sufficient for typical server operations; however, you can modify configuration settings as needed. The system prompts you for access to the UEFI System Utilities each time the system is powered up.
HPE Insight Diagnostics survey functionality HPE Insight Diagnostics (on page 86) provides survey functionality that gathers critical hardware and software information on ProLiant servers. This functionality supports operating systems that are supported by the server. For operating systems supported by the server, see the Hewlett Packard Enterprise website (http://www.hpe.com/info/supportos).
• Enabled—If Enabled, USB 3.0 capable devices operate at USB 3.0 speeds at all times (including the pre-boot environment) when in UEFI Boot Mode. This mode should not be used with operating systems that do not support USB 3.0. If operating in Legacy Boot BIOS Mode, the USB 3.0 ports cannot function in the pre-boot environment and are not bootable.
Front panel LEDs and buttons • Front panel LEDs and buttons in a 4-bay LFF chassis with thumbscrew rack ears • Front panel LEDs and buttons in an 8-bay LFF chassis with thumbscrew rack ears • Front panel LEDs and buttons in a 12-bay LFF chassis with quick-release lever rack ears Component identification 91...
Item Description Status UID button/LED Solid blue = Activated Flashing blue: • 1 flash per second = Remote management or firmware upgrade in progress • 4 flashes per second = iLO manual reboot sequence initiated • 8 flashes per second = iLO manual reboot sequence in progress Off = Deactivated Health LED Solid green = Normal...
Rear panel LEDs Item Description Status UID LED Solid blue = Activated Flashing blue: • 1 flash per second = Remote management or firmware upgrade in progress • 4 flashes per second = iLO manual reboot sequence initiated • 8 flashes per second = iLO manual reboot sequence in progress Off = Deactivated NIC link LED...
System board components Item Description PCIe3 x16 (16, 8, 4, 1) slot 1 for low-profile, standup expansion board or riser cage options (GPU riser cage or two-slot PCI riser cage) TPM connector System battery SATA connector 4 (for M.2 SSD 1) Storage backup power connector for a controller board installed in the two-slot PCI riser cage or in the onboard PCIe3 x8 slot 3...
Position Default Function Off = Set default boot mode to UEFI. On = Set default boot mode to legacy. — Reserved — Reserved — Reserved — Reserved — Reserved To access the redundant ROM, set S1, S5, and S6 to On. When the system maintenance S6 switch is set to the On position, the system will erase all system configuration settings from both CMOS and NVRAM on the next reboot.
Drive numbering The following images show the drive numbering for each of the supported drive configurations. For drive box numbering information, see "Front panel components (on page 89)." • 4-bay LFF non-hot-plug drive numbering • 8-bay LFF non-hot-plug drive numbering •...
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Item Status Definition Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update. Activity ring Rotating green Drive activity No drive activity Do not remove Solid white Do not remove the drive.
Cabling Cabling overview This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance. For information on cabling peripheral components, refer to the white paper on high-density deployment at the Hewlett Packard Enterprise website (http://www.hpe.com/info/servers). CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.
• Drives connected to a Smart Array Controller option Item Description Drive power cable Mini-SAS Y-cable 12-bay LFF hot-plug SAS/SATA drive cabling • Drives connected to an HBA option Item Description Box 1 drive power cable (BP1 connector of the GPU/BP1 power extension cable connected to the hot-plug power supply) Box 2 and 3 drive power cables (from the system board) Hot-plug power supply GPU/BP1 power cable...
• Drives connected to a Smart Array Controller option Item Description Box 1 drive power cable (BP1 connector of the GPU/BP1 power extension cable connected to the hot-plug power supply) Box 2 and 3 drive power cables (from the system board) Hot-plug power supply GPU/BP1 power cable Mini-SAS Y-cable for the box 1 and 2 drives Mini-SAS Y-cable for the box 3 drives...
• M.2 SSD cabling from the FlexibleLOM riser cage Item Description M.2 SSD 1 SATA cable M.2 SSD 2 SATA cable FBWC module backup power cabling The FBWC solution is a separately purchased option. This server only supports FBWC module installation when a Smart Array P-Series controller is installed.
• FBWC module backup power cabling from an Smart Array P84x Controller installed in the two-slot PCI riser cage Smart Storage Battery cabling Cabling 110...
Fan cabling Item Description Fan 1 cable Fan 2 cable Fan 3 cable Fan 4 cable Fan 5 cable Fan 6 cable GPU power cabling Item Description GPU power cable (GPU connector of the GPU/BP1 power extension cable) Cabling 111...
Item Description Hot-plug power supply GPU/BP1 power cable Power supply cabling HPE 550 W Power Supply cabling (non-hot-plug) Item Description 24-pin power supply cable 16-pin RPS cable HPE Redundant Power Supply cabling (hot-plug) Cabling 112...
Item Description GPU/BP1 power cable, requires the GPU/BP1 power extension cable 24-pin power supply cable 16-pin RPS cable Front panel cabling • Front panel cabling in a chassis with thumbscrew rack ears Item Description USB 2.0 connector cable Ambient temperature sensor cable Front I/O cable •...
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Item Description Front I/O cable USB 2.0 connector cable Ambient temperature sensor cable Cabling 114...
Specifications Environmental specifications Specification Value — Temperature range* 10°C to 35°C (50°F to 95°F) Operating -30°C to 60°C (-22°F to 140°F) Nonoperating — Relative humidity (noncondensing) Minimum to be the higher (more moisture) of Operating -12°C (10.4°F) dew point or 8% relative humidity Maximum to be 24°C (75.2°F) dew point or 90% relative humidity...
Power supply specifications Depending on the installed options and/or the regional location where the server was purchased, the server is configured with one of the following power supplies: • HPE 550 W Power Supply (PN 730941-B21) • HPE 800 W/900 W Gold AC Power Input Module (PN 744689-B21) •...
Acronyms and abbreviations ABEND abnormal end Advanced Memory Protection application program interface ASHRAE American Society of Heating, Refrigerating and Air-Conditioning Engineers Automatic Server Recovery backplane Customer Self Repair file allocation table FBWC flash-backed write cache graphics processing unit host bus adapter HPE SIM HPE Systems Insight Manager HPE SSA...
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Integrated Lights-Out Integrated Management Log large form factor Lights-Out Management NAND Not AND nonmaskable interrupt NVRAM nonvolatile memory PCIe Peripheral Component Interconnect Express POST Power-On Self Test QR code quick response code RBSU ROM-Based Setup Utility REST representational state transfer redundant power supply serial attached SCSI SATA...
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Secure Digital Systems Insight Manager Service Pack for ProLiant solid-state drive serial, USB, video Trusted Platform Module UEFI Unified Extensible Firmware Interface unit identification universal serial bus Acronyms and abbreviations 119...
Documentation feedback Hewlett Packard Enterprise is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback (mailto:docsfeedback@hpe.com). When submitting your feedback, include the document title, part number, edition, and publication date located on the front cover of the document. For online help content, include the product name, product version, help edition, and publication date located on the legal notices page.
Index access panel 35 electrostatic discharge 24 Active Health System 83 embedded UEFI diagnostics 86 air baffle 36 environmental specifications 114 ambient temperature 114 error messages 82 ambient temperature sensor cable 112 expansion board 54 Automatic Server Recovery (ASR) 88 external USB functionality 88 boot options 85, 86 fan blank 44...
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HPE ProLiant Pre-boot Health Summary 84 PCI riser board slot definitions 95 HPE SSA (HPE Smart Storage Administrator) 88 PCI riser cage, removing 31, 58, 59 HPE Systems Insight Manager (SIM) 85, 86 POST error messages 82 HPE UEFI System Utilities 85 power calculator 115 humidity 114 power fault 92...
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specifications, mechanical 114 specifications, power supply 115 specifications, server 114 SPP 86 static electricity 24 symbols on equipment 24 system battery 62 system board components 97 system board replacement 69 system components 18, 89 system configuration settings 98 system maintenance switch 98 technical support 6 temperature requirements 114 TPM, connector 97...