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LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant. This manual provides the information necessary to install, program, operate and maintain the KE820/KG99. - 3 -...
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the KE820/KG99 or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
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1. INTRODUCTION E. Notice of Radiated Emissions The KE820/KG99 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
1. INTRODUCTION 1.3 ABBREVIATION For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current - Constant Voltage Cigar Lighter Adapter Digital to Analog Converter Digital Communication System dB relative to 1 milli-watt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory...
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1. INTRODUCTION Light Emitting Diode LG Electronics OPLL Offset Phase Locked Loop Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock...
2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Features Item Feature Comment Standard Battery Li-ion, 750mAh AVG TCVR Current 270mA typ @PL5 Standby Current 2.5 mA typ @PP9 Talk time 3 hours (GSM TX Level 7) Standby time 300 hours (Paging Period:9, RSSI: -85dBm) Charging time Under 3 hours -105dBm↓, DCS/PCS : -105dBm ↓...
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2. PERFORMANCE Item Description Specification DCS1800/PCS1900 Offset from Carrier (kHz). Max. (dBm) Output RF Spectrum (due to switching transient) 1,200 1,800 Spurious Emissions Conduction, Emission Status EGSM BER (Class II) < 2.439% @-102dBm Bit Error Ratio DCS1800/PCS1900 BER (Class II) < 2.439% @-100dBm Rx Level Report accuracy 3 dB 8 3 dB...
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2. PERFORMANCE Item Description Specification STMR 13 5 dB Stability Margin > 6 dB dB to ARL (dB) Level Ratio (dB) 17.5 22.5 30.7 Distortion 33.3 33.7 31.7 25.5 Side Tone Distortion Three stage distortion < 10% <Change> System frequency 2.5ppm (26 MHz) tolerance <Change>32.768KHz tolerance...
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2. PERFORMANCE Item Description Specification Battery Bar Number Voltage( 0.05V) 3.86V~4.2V Battery Indicator 3.75V~3.85V 3.75V~3.69V 3.69V~3.62V 3.62V~ 3.62V↓ 0.05V (Call) Low Voltage Warning 3.50V↓ 0.05V (Standby) Forced shut down Voltage 3.35 0.05 V Li-ion Battery Standard Voltage = 3.7 V Battery Type Battery full charge voltage = 4.2 V Capacity: 750mAh...
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2. PERFORMANCE * EDGE RF Specification (Option: KG99 is not serviced for ”EDGE mode”) Item Description Specification RMS EVM Peak EVM Percentile EVM ≥ Origin Offset Suppression 30dB GSM900/EGSM Level Power Toler. Level Power Toler. 27dBm 17dBm 27dBm 15dBm 27dBm 13dBm 27dBm 11dBm...
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2. PERFORMANCE Item Description Specification Output RF Spectrum DCS1800, PCS1900 (due to modulation) Offset from carrier(kHz) Max. dBc +0.5 600~<1,200 1,200~<1,800 1,800~<3,000 3,000~<6,000 6,000 Output RF Spectrum GSM900/EGSM (due to switching transient) Offset from carrier(kHz) Max. dBm 1,200 1,800 --30 DCS1800, PCS1900 Offset from carrier(kHz) Max.
3. TECHNICAL BRIEF 3. TECHNICAL BRIEF Baseband circuit 3.1 KE820 / KG99 Component Block diagram. Figure 1 KE820/KG99 Hardware architecture KE820/KG99 is composed with 3 different PCB part such as main PCB, sub PCB and FPCB. - 19 -...
3. TECHNICAL BRIEF 3.2 Baseband Processor (BBP) Introduction Figure 3. Top level block diagram of the S-GOLD2 (PMB8876) 3.2.1 General Description S-GOLD2 is a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital functionality of a cellular radio. Additionally S-GOLD2 Provides multimedia extensions such as camera, software MIDI, MP3 sound.
3. TECHNICAL BRIEF 3.2.2 General Description • Processing core ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and the Jazelle Java extension for Java acceleration. - TEAKLite DSP core • ARM-Memory - 32k Byte Boot ROM on the AHB - 96k Byte SRAM on the AHB, flexibly usable as program or data RAM - 16k Byte Cache for Program (internal) - 8k Byte tightly coupled memory for Program(internal)
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3. TECHNICAL BRIEF - Advanced static and dynamic power management features including TDMA-Frame synchronous low power mode and enhanced CPU modes(idle and sleep modes) - Pulse Number Modulation output for Automatic Frequency Correction(AFC) - Serial RF Control interface: support of direct conversion RF - A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial data transmission - 1 Serial Synchronous SPI compatible interfaces in the controller domain...
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3. TECHNICAL BRIEF 3.2.5. USART Interface KE820/KG99 have two UART Drivers as follow : - USART1 : Hardware Flow Control / SW upgrade / Calibration - USART2 : SW debug trace. Table 3 USART Interface Spec. USART_0(USART1) Resource Name Remark...
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3. TECHNICAL BRIEF 3.2.7. GPIO map Over a hundred allowable resources, KE820/KG99 is using as follows except dedicated to SIM and Memory. KE820/KG99 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table. Table 5 S-Gold2 GPIO pin Map...
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3. TECHNICAL BRIEF MEMORY &CLK GPIO_20 F_DPD For INTEL Memory CLK32K CLK32K For FM Radio & BLUETOOTH GPIO_22 Not Use CAMERA I/F CIF_D0 CIF_D(0) Camera DATA[0] CIF_D1 CIF_D(1) Camera DATA[1] CIF_D2 CIF_D(2) Camera DATA[2] CIF_D3 CIF_D(3) Camera DATA[3] CIF_D4 CIF_D(4) Camera DATA[4] CIF_D5 CIF_D(5)
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3. TECHNICAL BRIEF GPIO_99 CHG_LED_CTRL Charging indicator LED control GPIO_100 TF_PWR_EN TransFlash card power enable(active High) DIF_RESET1_GPIO DIF_RESET1 LCD Reset EINT6 REMOTE_INT For Remote Control Headset I2C_SCL For SM-Power, FM Radio, Audio AMP I2C_SDA " PM_INT (EINT) PM_INT SM-Power interrupt SIM CARD CC_IO SIM_IO SIM CARD I/O...
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3. TECHNICAL BRIEF I2S1_RX I2S1_RX For Bluetooth I2S1_TX I2S1_TX " I2S1_WA0 I2S1_WA0 " MMCI_DAT[1] TF_DAT1 For T-Flash MMCI_DAT[2] TF_DAT2 " MMCI_DAT[3] TF_DAT3 " AUDIO I/F EPN1 RCV_N For Receiver EPP1 RCV_P " EPPA1 BBP_SND_L For Speaker EPPA2 BBP_SND_R For Speaker MICN1 MIC1_N For Mic...
3. TECHNICAL BRIEF 3.3 Power management IC 3.3.1. General Description SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has been specially designed for usage with S-Gold2. Although optimized for usage with the Infineon S- GOLD baseband device it is suitable for the S-GOLDlite and the E-GOLD+ baseband devices as well.
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3. TECHNICAL BRIEF Figure 4 Top level block diagram of the SM-Power(PMB6812) SM-POWER is a further step on the successful E-Power product line with enhanced and optimized functionality. SM-POWER features a baseband supply concept with a DC/DC step-down converter (SDBB) cascaded by two linear regulators (LBB1/2) - SM-POWER’s DC/DC converter makes up to 40 % reduction of battery current for smart phone functions (e.g.
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3. TECHNICAL BRIEF SM-POWER supports the standby power-down concept of S-GOLD by temporarily switching off the linear regulator LBB1 for the DSP during mobile standby whenever this subsystem is not used. In this phase the ARM controller and most peripherals including parts of the on-chip SRAM are kept powered-up with power being supplied by the other linear regulator LBB2.
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3V3_AUDIO 1V8_MEM I2C BUS INTERFACE PMB8753 2V65_BT RF Transceiver PWRON 1V5_CORE PMB6272 Charge VBAT CONTROL _RESET 1V8_MEM Control 2V85_RF PM_INT 2V72_IO 1V5_RF 2V7_VCXO Audio LED/3 RF3158 1V5_CORE VSUPPLY VSUPPLY Figure 5 Power domain block diagram of KE820/KG99 - 36 -...
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3. TECHNICAL BRIEF 3.3.2. Charging SM-POWER provides together with an external p-channel FET Siliconix Si3455 an external AC- adapter a complete charge control function for charging of Li-Ion or Li-Ion-Polymer batteries. Either a 1-cell Li-Ion or Li-Ion-Polymer battery with 4.1, 4.2 or 4.4 Volts may be used. 4.2V~3.85V 3.85V~3.75V 3.75V~3.69V...
To support Remote power on function for factory mass production, applied an analog switch as following figure. As monitoring the RPWRON(GPIO_110) and Key matrix KP_OUT(1) & KP_IN(5), KE820/KG99 system recognize whether remote power on or End-key pushed - 39 -...
Figure9 Remote power on and End-key power on circuit 3.5. SIM interface KE820/KG99 supports 1.8V & 3V plug in SIM, SIM interface scheme is shown in (Figure 10). SIM_IO, SIM_CLK, SIM_RST ports are used to communicate with BBP(S-Gold2) and the SIM power supply enabled by BBP (_SIM_EN).
3. TECHNICAL BRIEF 3.6. Memory 256Mbit Flash & 128Mbit SDRAM employed on KE820/KG99 with 16 bit parallel data bus thru ADD(0)~ ADD(24). The 256Mbit Sibley Wireless Flash memory with LPSDRAM stacked device family offers multiple high-performance solutions. The Sibley flash die is manufactured on 90 nm process technology.
3. TECHNICAL BRIEF 3.8. Keypad Switching & Scanning The keypad interface is a peripheral which can be used for scanning keypads up to 8 rows (outputs from Port Control Logic) and 8 columns (inputs to PCL). The number of rows and columns depend on settings of the PCL.
There are 7 snow white color LEDs on the sub PCB for keypad illumination. Keypad Back-light is controlled by SM-Power LED port which has constant current control function. The whole configuration of the SM-POWER LED drivers is shown in below Figure16. ( SLED1, SLED2 port are not used in the KE820.KG99) - 44 -...
3. TECHNICAL BRIEF 3.10. LCD back light illumination Employed the AAT2805 is a dual charge pump designed to support both the white LED backlight and flash applications for systems operating with lithium-ion/polymer batteries. The backlight charge pump is capable of driving up to four LEDs at a total of 80mA. The current sinks may be operated individually or in parallel for driving higher current LEDs.
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3. TECHNICAL BRIEF Figure 18 EN/SET port control method - 47 -...
3. TECHNICAL BRIEF 3.11 Battery current consumption monitor KE820/KG99 use a current monitoring function to calculate the battery capacity and the remaining time, as monitoring current flow from the battery thru 47mohm resistor. VSUPPLY VBAT U201 R204 LOAD CN201 47mohm...
3. TECHNICAL BRIEF In case of KE820/KG99 mass production, the JTAG & ETM interface connector will not be mount on board. That is only for developing and software debugging purpose.( It will not be mounted on mass production PCB) 3.13. Audio KE820/KG99 Audio signal flow diagram as following diagram.
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3. TECHNICAL BRIEF 3.13.1. Audio amplifier sub system IC with 3D effect Audio amplifier sub system IC is an audio power amplifier capable of delivering 500mW of continuous average power into a mono 8Ω load, 25mW per channel of continuous average power into stereo 32Ω...
3. TECHNICAL BRIEF 3.13.2. Microphone with gain switching circuit As controlling the MIC_GAIN_SEL, Microphone sensitivity can be selected both -42dB (MIC_GAIN_SEL set low) and -30dB(MIC_GAIN_SEL set high) L104 C114 MIC1_P 0.1u 100nH C115 MIC100 100p L105 C116 MIC1_N 0.1u 100nH R120 VMICP R122...
3. TECHNICAL BRIEF 3.15. USB charging circuit The USB charging circuit is a fully integrated USB VBUS voltage single-cell Li-ion battery charger circuit. The charger uses a CC/CV charge profile required by Li-ion batteries. CC charging current and End of charging current is programmable I &...
3. TECHNICAL BRIEF 3.16 FM radio with RDS function The FM receiver uses a digital low-IF architecture which allows for the elimination of external components and factory adjustments. The receive (RX) section integrates a low noise amplifier (LNA) supporting the worldwide FM broadcast band (87.5 to 108 MHz). An automatic gain control (AGC) circuit controls the gain of the LNA to optimize sensitivity and rejection of strong interferers.
3. TECHNICAL BRIEF 3.17. BLUETOOTH Figure 29 BLUETOOTH Functional block diagram. 3.17.1. General Features • Single Chip Bluetooth device for cellular applications integrating radio, baseband and memory • Fabricated in advanced low power 0.13µm CMOS technology • Very low component count (6 external components) •...
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3. TECHNICAL BRIEF • Autonomous power down scenarios of Bluetooth and cellular system supported • Packages: - P-VQFN-48 package - P-WFLGA-56 package • Temperature range from -40°C up to 85°C • Boundary scan for interface lines via JTAG 3.17.2 Micro-Controller-Section •...
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HCI Three-Wire UART transport layer two interface lines (UARTTXD and UARTRXD) are needed. The hardware flow control lines (UARTRTS and UARTCTS) are supported but the use is optional. In KE820/KG99 used three-wire UART communication. The UART interface has its own supply voltage (VDDUART) to ensure compatibility with the I/O voltages used by the S-Gold2.
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3. TECHNICAL BRIEF Table 9 Micro SD memory pad assign. SD mode Pin No. Name Type Description DAT2 Data bit [2] CD/DAT3 Data bit [3] Command response Power Power supply Clock Ground Power ground DAT0 Data bit [0] DAT1 Data bit [1] Figure 33 Micro SD memory card detection scheme Table 10 Micro SD memory card detect truth table.
DUMMY1 DUMMY2 1000p Figure 34 Micro SD socket circuit with power control 3.19. 18pin Multi Media Interface connector Table 11 Multi media interface pin assign KE820/KG99 MMI Pin Function Description FM_ANT FM radio antenna / Audio ground HS_MIC Headset microphone signal...
3. TECHNICAL BRIEF RF circuit Figure 36 RF Block Diagram 3.20. General Description The RF transceiver (PMB 6272 SMARTi-PM) is an integrated single chip, quad-band transceiver for GSM850/GSM900/GSM1800/GSM1900 designed for voice and data transfer applications. The transceiver provides an analog I/Q baseband interface and consists of a direct conversion receiver and a quad-band polar transmitter for GSM and EDGE with integrated PGA functionality.
3. TECHNICAL BRIEF The constant gain direct conversion receiver contains all active circuits for a complete receiver chain for GSM/GPRS/EDGE (see Figure 39). The GSM850/900/DCS1800/ PCS1900 LNAs with balanced inputs are fully integrated. No inter-stage filtering is needed. The orthogonal LO signals are generated by a divider-by-four for GSM850/900 band and a divider-by-two for the DCS1800/PCS1900 band.
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3. TECHNICAL BRIEF Figure 39 Transmitter part block diagram control pin VBIAS for efficiency enhancement. In GMSK mode, the PA is in saturated high efficiency mode and is controlled via its VAPC pin directly by the baseband ramping DAC. In this way both up- / down-ramping and output power level are set.
3. TECHNICAL BRIEF 3.23. RF synthesizer The transceiver contains a fractional-N sigma-delta synthesizer for the frequency synthesis in the RX operation mode. For TX operation mode the fractional-N sigma-delta synthesizer is used as Sigma- Delta modulation loop to process the phase/frequency signal. The 26MHz reference signal is provided by the internal crystal oscillator.
3. TECHNICAL BRIEF 3.25. Front End Module control Implemented in the S-Gold2 (U102) are three outputs which are ANT_SW1, ANT_SW2 and ANT_SW3 for direct control of front end modules with three logic input pins to select RX and TX mode as well as low and high band operation.
3. TECHNICAL BRIEF Function Description HB_RFIN RF input to the High-band PA BAND_SEL Logic low=low band, Logic high=high band select TX_EN PA Enable VBATT Main supply VMODE Logic low=GMSK mode, Logic high=8PSK mode select VRAMP Ramped burst pin LB_RFIN RF input to the Low-band PA 8,9,10,11 Ground LB_RFOUT...
4. PCB layout 4. PCB layout 4.1 Main & Sub PCB component placement Figure 43 Main PCB top Figure 44 Main PCB top placement - 69 -...
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4. PCB layout Figure 45 Main PCB bottom Figure 46 Main PCB bottom placement - 70 -...
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4. PCB layout Figure 47 Sub PCB top Figure 48 Sub PCB top placement - 71 -...
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4. PCB layout Figure 49 Sub PCB bottom Figure 50 Sub PCB bottom placement - 72 -...
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4. PCB layout Battery contact Charging block 80pin socket PMIC Jog key Sleep crystal Power inductor Memor y Mobile SW Power on block Antenna feeding LCD connector SIM socket FPCB connector Audio Amp RF PAM 26MHz Main clock LCD backlight RF transceiver ETM JTAG I/F - 73 -...
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4. PCB layout Key light LED Mic. hole 80pin plug FM Radio 18pin MMI Bluetooth Micro SD socket USB charging IC Microphone BT antenna - 74 -...
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4. PCB layout Flash LED Speaker contact Camera connector Vibrator contact Volume up End / Power on Volume down AF trig / Shutter 50pin Main I/F PRWRON USART TP TXD CTS - 75 -...
5. Trouble shooting 5. Trouble shooting 5.1 Trouble shooting test setup 4.000V 0.0000A Figure 51 Equipment setup Power on all of test equipment - Connect PIF-UNION JIG or dummy battery to the DUT for power up. - Connect mobile switch cable between Communication test set and DUT when you need to make a phone call.
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5. Trouble shooting START Connect power supply to the Check the "PWRON" RPWRON, signal replace U204 Check solder "_RESET" U206 or replace it signal Check solder Check the all U203 or replace it LDO's output Check solder Is the 26MHz X401, U402 clock From or replace it...
5. Trouble shooting 5.3 Charging trouble Check Points -Connection of TA (check TA voltage 4.8V) -Charging Current Path component voltage drop -Battery voltage • Charging method : CC-CV • Switch-off voltage : 3.35V • Charger detect voltage : about 4.0V •...
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5. Trouble shooting START 18pin Resolder the MMI(CN100) CN100 The TA can be Source pin broken of Q201= Change other TA Check solder Drain pin Q201 or replace it of Q201 = D201 voltage Replace it drop Waiting until Battery voltage battery is over 3.4V? Voltage goes up...
5. Trouble shooting START Check LCD connector combination then LCD test with New LCD Replace LCD Is LCD FPCB module normal? Check solder and Signal is repair normal on Damaged filter Assemble 5.5 Camera Trouble Check Points -Connectors combination -EMI filter soldering -FPCB status 2V85_IO2 2V8_AF...
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5. Trouble shooting Camera connect Check the connector combination Check signal flow via EMI filter 50pin main PCB connector - 84 -...
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5. Trouble shooting START Check camera connector, 50pin main PCB connector combination then Camera test FL301, FL302, Resolder FL303, Replace Replace New Replace New Main PCB Camera FPCB module Replace Camera module Replace FPCB module Assemble Assemble - 85 -...
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5. Trouble shooting START Check Speaker tension and Contacts are clear. R300,R301 Resolder or have low Replace LCD resistance? module Between R300, Replace FPCB R301 then retest resistance OK? Resolder or U208 is working Replace it properly? Replace Main PCB Assemble - 87 -...
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5. Trouble shooting START Check microphone sound hole Check mic. Bias Make a phone line call then Repair the damaged 80pin connector part combination Replace Signal comes microphone out from Assemble - 89 -...
5. Trouble shooting 5.8 Vibrator trouble Check Points -Vibrator contact -IC is working correct U207 SUY98005LT1G R221 VIBRATOR_EN L202 R222 MOTOR_N VOUT 100nH R223 C436 100K Check the driver Enable signal goes to high then vibration Check the contact is clear, if there is some obstacles then...
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5. Trouble shooting START Check Vibrator contact Check U207 or Pin1 of U207 is replace it high ? Check U207 or Pin3 of U207 is low? replace it Replace Vibrator Assemble - 91 -...
5. Trouble shooting 5.10 SIM card trouble Check Points -Power control FET is working -Socket soldering -Proper SIM is used 2V85_SIM _SIM_EN SI1305-E3 Q301 J301 R320 4.7K SIM_RST SIM_IO SIM_CLK C308 C309 C310 Check soldering all pin of socket - 94 -...
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5. Trouble shooting START Check All of SIM card voltage KE820/KG99 support 1 8V & 3V SIM l 6 pins are Repair it soldered well? Q301 is Replace the working? damaged Assemble - 95 -...
5. Trouble shooting 5.11 MicroSD trouble Check Points -Power control FET is working -Socket soldering -Card detect is working 2V85_CARD 2V72_IO NTJD4105CT1G R130 100K R132 2 G1 TF_PWR_EN 100K R133 R134 R135 R136 R137 S100 100K 100K 100K 100K 100K SCHA1B0102 DAT2_RSV TF_DAT2...
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5. Trouble shooting START Check the Card detect signal if it operate as above picture TF_DETECT pins Repair it are soldered well? Replace the Q1 is working damaged properly? part Assemble - 97 -...
5. Trouble shooting 5.12.2 Trouble Shooting of Receiver Part Checking Flow Checking Points START Setup Test Equipment Cell Power : -7 4dBm EGSM CH30 DCS CH699 Check point VCTCXO Figure 2. Main PCB Check point PLL Control Check point Mobile SW & Check point Figure 3.
5. Trouble shooting 5.12.3 Checking VCTCXO Circuit Checking Points Checking Flow Pin : 2.7V Is the waveform Replace X401 of Pin3 similar to X401 Checking U203 Is the waveform (PMIC) of Pin4 similar to VCTCXO Circuit is OK. See next page to check Pin 3: 26 MHz PLL Circuit.
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5. Trouble shooting 5.12.4 Checking PLL Control signals Checking Points Checking Flow R419 (RF_EN) R426 (RF_CLK) EN Signal is Check U402 OK ? DA(Data) is Check U402 U402 Normal CLK(Clock) is Check U402 Normal R427 (RF_DATA) Figure 7. Transceiver Control Signal is OK. See next page to check Mobile SW &...
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5. Trouble shooting 5.12.5 Checking Mobile SW & FEM Circuit Diagram 2V85_RF C437 0.1u SW401 KMS-506 GND11 C404 C462 GND10 R406 GND9 GND8 100p GND7 L408 2.7nH Figure 10. Mobile SW & FEM Circuit Checking Points SW40 FL30 R441 R403 R405 Figure 11 Mobile SW &...
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5. Trouble shooting Checking Flow Check Pin 1, 2 of SW401 with RF Cable Replace Mobile SW Signal is OK? (SW401) Check Pin 20, 21, 22 of FL308? Control Signal is Check PMB8876 (U102) Pin 16, 17 or 14, Replace FEM (FL308) Mobile SW &...
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5. Trouble shooting 5.12.6 Checking RX I/Q Signals Checking Flow Check RX I/Q Signals R426 RF_CLK R427 RF_DA Replace R428 Signals are Transceiver Normal ? C432 C433 PMB6272(U402) R429 R430 RX Part is OK. C434 C435 Check Base Band Circuit R431 Re Download S/W and Cal Figure 14.
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5. Trouble shooting 5.12.7 Trouble Shooting of Transmitter Part Checking Flow Checking Points Setup Test Equipment Cell Power : -7 4dBm EGSM CH30 DCS CH6 Check point VCTCXO Check point PLL Control Figure 17. Main PCB Top Check point TX I/Q Signal Check point Transceiver Figure 18.
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5. Trouble shooting 5.12.8 Checking VCTCXO Circuit See RX Part “1. Checking VCTCXO Circuit” 5.12.9 Checking PLL Control Signal See RX Part “2. Checking PLL Control Signal” - 106 -...
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5. Trouble shooting 5.12.10 Checking TX I/Q Signals Checking Flow Check TX I/Q Signals R426 RF_CLK R427 RF_DA Replace R428 Signals are Transceiver Normal ? C432 C433 PMB6272(U402) R429 R430 TX Part is OK. C434 C435 Check Base Band Circuit R431 Re Download S/W and Cal Figure 19.
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5. Trouble shooting Checking Flow Check Control Signals Check Signals are PMB8876(U102) Normal ? PAM Control Signal is See next page to check FEM & Mobile SW Circuit Figure 28. GSMK Control Signal Figure 29. 8PSK Control Signal - 111 -...
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5. Trouble shooting 5.12.13 Checking FEM & Mobile SW Circuit Diagram Mobile SW & FEM 2V85_RF C437 0.1u SW401 KMS-506 GND11 C404 C462 GND10 R406 GND9 GND8 100p GND7 L408 2.7nH Figure 30. Mobile SW & FEM Circuit Checking Points SW40 FL30 R441...
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5. Trouble shooting Checking Flow Check Pin 1, 2 of SW401 with RF Cable Replace Mobile SW Signal is OK? (SW401) Check Pin 20, 21, 22 of FL308? Control Signal is Check PMB8876 (U102) Pin 16, 17 or 14, Replace FEM (FL308) Mobile SW &...
9. RF Calibration 9. RF Calibration 9.1 Test Equipment Setup 4.00 V 0.000 A 9.2 Calibration Steps 9.2.1. Turn on the Phone. 9.2.2. Execute “HK_24.exe” - 129 -...
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9. RF Calibration 9.2.3. Click “SETTING” Menu 9.2.4. Setup “Ezlooks” menu such as the following figure - 130 -...
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9. RF Calibration 9.2.5. Setup “Line System” menu such as the following figure Adiust the number times. 9.2.6.Setup Logic operation such as the following figure. Operation Mode 1. By-Pass: not control by GPIB 2. Normal: control by GPIB Setup UART Port PWR: Power Supply CELL: Call-Test Equipment - 131 -...
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9. RF Calibration 9.2.10. Calibration data will be saved to the following folder. Saving format: year/month/day_PASS - 133 -...
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9. RF Calibration Notices: 1. The state of Phone is “ test mode “ during the CALIBRATION. 2. Calibration program automatically changes either “normal mode” or “ptest mode”. 3. RF Calibration steps as follow: TX Channel compensation: EGSM->DCS->PCS->EDGE EGSM->EDGE DCS->EDGE PCS RX Channel compensation: EGSM->DCS->PCS 4.
10. ENGINEERING MODE 10. ENGINEERING MODE Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. The key sequence for switching the engineering mode on is “2945#*#”Select. Pressing END will switch back to non-engineering mode operation. Use Up and Down key to select a menu and press ‘select’...
11. STANDALONE TEST 11. STANDALONE TEST 11.1 Test Program Setting 1 Set COM Port. 2 Check PC Baud rate. 3 Confirm EEPROM & Delta file prefix name. - 136 -...
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11. STANDALONE TEST 4 Click “Update Info” for communicating Phone and Test -Program. Connected - 137 -...
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11. STANDALONE TEST 5 For the purpose of the Standalone Test, Change the Phone to “ptest mode” and then Click the “Reset” bar. 6 Select “Non signaling” in the Quick Bar menu. Then Standalone Test setup is finished. Change "ptest mood" - 138 -...
11. STANDALONE TEST 11.2 Tx Test 1 Click “Non signaling mode” bar and then confirm “OK” text in the command line. 2 Put the number of TX Channel in the ARFCN. 3 Select “Tx” in the RF mode menu and “PCL” in the PA Level menu. 4 Finally, Click “...
11. STANDALONE TEST 11.3 Rx Test 1 Put the number of RX Channel in the ARFCN. 2 Sele ct “Rx” in the RF mode menu. 3 Finally, Click “ Write All” bar and try the efficiency test of Phone. 4 The Phone must be changed “normal mode” after finishing Test. 5 Change the Phone to “normal mode”...
AWAZ00 WINDOW ASSY AWAZ0008301 Black BFAA00 FILM,INMOLD BFAA0041301 MAIN WINDOW IN-MOLD FILM MWAC00 WINDOW,LCD MWAC0071101 KE820(IML) Black MBFF00 BRACKET,LCD MBFF0010601 MOLD, PC LUPOY GP-2100, , , , , MCJK00 COVER,FRONT MCJK0056901 MOLD, PC LUPOY SC-1004A, , , , , Black...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MCCZ02 MCCZ0021401 MOLD, Urethane Rubber S190A, , , , , Black MTAZ00 TAPE MTAZ0147201 COMPLEX, (empty), , , , , Transparent MFEZ00 FRAME MFEZ0010001 MOLD, PC LUPOY SC-1004A, , , , , Black MPBJ00 TAPE...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MDAG00 DECO ASSY ADBY0010601 KE820 Front Deco Black BFAA00 FILM,INMOLD BFAA0041401 DECO FRONT IN-MOLD FILM MDAG00 DECO,FRONT MDAG0018801 MLAK00 LABEL,MODEL MLAK0019102 EUROP & CIS MIDZ00...