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HP Compaq nx6310 Quickspecs page 30

Hewlett-packard notebook pc quickspecs
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QuickSpecs
Technical Specifications
Material Usage
DA - 12432 Worldwide QuickSpecs — Version 8 — 6.6.2006
Eliminate the use of heavy metals such as lead, chromium,
mercury and cadmium in packaging materials.
Eliminate the use of ozone-depleting substances (ODS) in
packaging materials.
Design packaging materials for ease of disassembly.
Maximize the use of post-consumer recycled content materials in
packaging materials.
Use readily recyclable packaging materials such as paper and
corrugated materials.
Reduce size and weight of packages to improve transportation
fuel efficiency.
Plastic packaging materials are marked according to ISO 11469
and DIN 6120 standards.
This product does not contain any of the following substances in excess
of regulatory limits (for reference of these limits please refer to the HP
General Specification of the Environment
(http://www.hp.com/hpinfo/globalcitizenship/environment/
supplychain/gen_specifications.html):
Asbestos
Certain Azo Colorants
Certain Brominated Flame Retardants – may not be used as
flame retardants in plastics
Cadmium
Chlorinated Hydrocarbons
Chlorinated Paraffins
Formaldehyde
Halogenated Diphenyl Methanes
Lead carbonates and sulfates
Lead and Lead compounds
Mercuric Oxide Batteries
Nickel - finishes must not be used on the external surface
designed to be frequently handled or carried by the user.
Ozone Depleting Substances
Polybrominated Biphenyls (PBBs)
Polybrominated Biphenyl Ethers (PBBEs)
Polybrominated Biphenyl Oxides (PBBOs)
Polychlorinated Biphenyl (PCB)
Polychlorinated Terphenyls (PCT)
Polyvinyl Chloride (PVC) – except for wires and cables, and
certain retail packaging has been voluntarily removed from most
applications.
Radioactive Substances
Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
HP Compaq nx6310 Notebook PC
Page 30

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