Heat Sink Assembly - HP Compaq Mini 110 Maintenance And Service Manual

Heat sink assembly

Description
Heat sink assembly (includes replacement thermal material)
Before removing the heat sink assembly, follow these steps:
1. Shut down the device. If you are unsure whether the device is off or in Hibernation, turn the device
on, and then shut it down through the operating system.
2. Disconnect all external devices connected to the device.
3. Disconnect the power from the device by first unplugging the power cord from the AC outlet and
then unplugging the AC adapter from the device.
4. Remove the battery (see
5. If your device has WWAN capability, remove the SIM (see
6. Remove the following components:
a.
b.
c.
d.
e.
Remove the heat sink assembly:
1. Remove the 4 Phillips SP1.5×1.05 screws (1) that secure the heat sink assembly to the system
board.
NOTE:
70 Chapter 4 Removal and replacement procedures
Battery on page
Keyboard (see Keyboard on page
Hard drive or solid-state drive (see
Top cover (see Top cover on page
WLAN module (see WLAN module on page
Fan (see Fan on page 68)
The screws are numbered 1 through 4. Follow this order when removing the screws.
44).
SIM on page
48)
Mass storage devices on page
57)
60)
Spare part number
537619-001
45).
54)