3.
Remove the fan and heat sink (3).
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board each time the heat sink is removed.
Thermal material is used on the processor (1) and the heat sink section (2) that services it. Thermal material
is also used on the graphics subsystem component (3) and the heat sink section (4) that services it.
Reverse this procedure to install the heat sink.
Component replacement procedures
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