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2.
Remove the heat sink (2).
3.
Thoroughly clean the thermal material from the surfaces of the heat sink and the system board
components each time the heat sink is removed. Replacement thermal material is included with the heat
sink and system board spare part kits.
Thermal paste is used on the integrated system board processor (1) and the heat sink (2).
Reverse this procedure to reassemble and install the heat sink assembly.
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Chapter 5 Removal and replacement procedures for authorized service provider parts
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