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1
Introduction
Teledyne LeCroy's PXP500 PCI Express Test Platform x16 Link Width up to 32.0 GT/s provides a convenient, powerful and
flexible test platform for PCI Express devices at data rates up to 32.0 GT/s and link widths up to x16. The PXP500 Test
Platform allows the Summit Z5 Exercisers to act as a host system, enabling extensive protocol-level testing of PCIe
devices at Gen5 speeds on the left side of the test platform. For use as a host emulator, the Summit Z5 Exerciser is
plugged into any slot and connected to an external power source. The DUT is plugged into the remaining available slot, the
PXP500 PCI Express Test Platform provides the necessary power up to 75W per slot. In addition to using the PXP500 Test
Platform with the Teledyne LeCroy Summit Z5, the user can connect two of their own devices and use the Test Platform as
a PCIe backplane by adding an interposer that will allow an analyzer to capture protocol traffic between the devices. The
right side of the PXP500 Test Platform can be used as a backplane for GenZ applications.
2
Components
The package includes the following components:
•
PXP500 PCI Express Test Platform
•
Stabilization bracket for DUTs and 2 thumbscrews
•
Mounting bracket for Summit Z5 Controller module and
4 screws (optional installation)
PXP500 PCI Express
x16 Link Width up to 32.0 GT/s
User Manual and Quick Start Guide
Use this document for quick installation and setup. If you
experience problems or need more information, see the
Summit Z5 User Manual at the Teledyne LeCroy web site.
PXP500 PCI Express Test Platform
•
User Manual and Quick Start Guide (this document)
•
AC power cord
•
DUT bracket extension and 4 thumbscrews (optional
installation)
•
GenZ bracket support and thumbscrews (optional
installation)
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Test Platform
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Related Manuals for Teledyne Lecroy PXP500 PCI Express
Summary of Contents for Teledyne Lecroy PXP500 PCI Express
- Page 1 The DUT is plugged into the remaining available slot, the PXP500 PCI Express Test Platform provides the necessary power up to 75W per slot. In addition to using the PXP500 Test Platform with the Teledyne LeCroy Summit Z5, the user can connect two of their own devices and use the Test Platform as a PCIe backplane by adding an interposer that will allow an analyzer to capture protocol traffic between the devices.
- Page 2 Inspect the received shipping container for any damage. Unpack the container and account for each of the system components listed on the accompanying packing list. Visually inspect each component for absence of damage. In the event of damage, notify the shipper and Teledyne LeCroy. Retain all shipping materials for shipper’s inspection. Installation for PCIe Applications...
- Page 4 Summit Z5 Controller module Summit Z5 Exerciser plug in card PCIe DUT...
- Page 5 See note below Summit Z5 Controller cable Note: PCIe Device Support Bracket removed for clarity.
- Page 6 Installation of Bracket Extension Install the bracket extension according to the illustration below. Adjust the height according to the requirements of the DUT bracket.
- Page 7 Installation for GenZ Applications Follow the steps below when using the PXP500 Platform with GenZ devices applications. Install the bracket on the side of the platform where the GenZ connectors are.
- Page 8 Attach the GenZ bracket to the PXP500. This will allow to secure the GenZ DUT.
- Page 9 Switch Configuration and Connections Clock Source Diagram Table 1: 100MHz SSC Internal Clock Configuration SEL1 SEL0 Clock downspread amount (%) No SSC (Default setting) -0.1 (1000 ppm) -0.3 (3000 ppm) -0.5 (5000 ppm) Table 2: Z5 Slot / DUT Slot Clock Source Z5 Slot External Clock for Z5 Slot comes from Ref Clk In connector...
- Page 10 Table 4: Clock Input Specification Parameter Specification Peak to peak voltage level 300mV (Min), 500mV (Max) To drive the 100MHz clock input the following sources can be used: Input interface level accepted CML, HCSL, LVPECL and LVDS. You should feed only one of the differential pair signals to the input or they should convert the differential to single ended.
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Page 11: Environmental Conditions
Environmental Conditions • Temperature: Operating 41° F to 104° F (5° C to 40° C) • Temperature: Non-Operating -4° F to 140° F (-20° C to 60° C) • Humidity: Operating 5% to 80% RH (non-condensing) @ <= 86° F or <= 30° C •... -
Page 12: Trademarks And Service Marks
Teledyne LeCroy, Summit Z5 and PXP500 Test Platform are Product specifications are subject to change without notice. trademarks of Teledyne LeCroy. All other trademarks are property Teledyne LeCroy reserves the right to revise the information in this of their respective companies. document without notice or penalty.