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Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 Screwdriver
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Disassemble main battery
2.
Disassemble ram door & hdd door
3.
Dis-fasten BASE screw*25(M2.5*3,M2.5*5,M2.5*6.5)
4.
Pull out hdd cable
5.
Dis-fasten hdd screw*3(M2.5*5)
6.
Disassemble HDD ASSY
7.
Dis-fasten hdd bracket screw*4(M3*3.5)
8.
Remove HDD
9.
Pull out WLAN cables
10. Dis-fasten WLAN module screw*1(M2*3)
11. Remove WLAN module
12. Remove RAM module from Mainboard
13. Remove ODD ASSY
14. Remove ODD from ODD ASSY
15. Pull out Keyboard membrane
16. Remove Keyboard
17. Dis-fasten TOP screw*1(M2.5*5)
18. Pull out speaker cable
19. Pull out power FFC, Touchpad FFC & TP button FFC
20. Disassemble TOP ASSY
21. Dis-fasten speaker screw*2(M2.5*3)
22. Disassemble speaker
23. Pull out LCD cable, MIC cable, CCD cable, Bluetooth cable, ODD cable, Modem cable,DC cable & USB FFC
24. Dis-fasten Modem screw*2(M2*3)
25. Remove Modem module
26. Dis-fasten LCD ASSY screw*4(M2.5*6.5)
27. Disassemble LCD ASSY
28. Dis-fasten Mainboard & FAN module screw*3(M2.5*4)
29. Disassemble Mainboard
EL-MF877-00
Template Revision B
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
PSG instructions for this template are available at
EL-MF877-01
0
0
0
0
Tool Size (if
applicable)
Page 2
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