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Item Description
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Screw Driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Remove Base screws.
2. Remove Hinge cap.
3. Remove Top cover.
4. Remove Batt. Cable, FFC, SPK. Cable, LCD Cable, CCD Cable, Antenna Cable, The WLAN Module Screw, 30PIN/40PIN FFC on
USB board and Power Cable on USB board.
5. Remove Screws on SPK, SPK Box, Batt, remove Batt bracket and SPK Box.
6. Remove Batt.
7. Remove Screws on M/B, USB board and disassemble M/B,USB board on C Deck.
8. Remove Screw of Hinge on C Deck and release LCD assy.
9. Remove Bezel from LCD assy.
10. Remove Screws which are fixed hinge and panel BKT, release panel.
11. Remove hinges, and CCD module.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained
in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Remove Base screws.
EL-MF877-00
Template Revision C
Last revalidation date 09-May-2018
Notes
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
HPI instructions for this template are available at
EL-MF877-01
Quantity of
items
included in
product
Tool Size (if
applicable)
#1
Page 2
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