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Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Remove Log Low
2.
Remove Battery pack
3.
Remove FAN & HEAT PIPE
4.
Remove Hinge up
5.
Remove Motherboard
6.
Remove IO PCB
7.
Remove Speaker module & K-lock bracket
8.
Remove LCD Cover
9.
Remove EDP cable / TS / Camera trans / G sensor PCB
10. Remove Antenna
11. Remove Hinge
12. Remove Hinge Cap
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
PSG instructions for this template are available at
EL-MF877-01
Tool Size (if
applicable)
Philip #1 /
TORX T
Philip #0 /
TORX T
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