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Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 Screw Driver
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Remove Base Screw
2.
Remove Top
3.
Remove Bezel
4.
Remove Panel
5.
Remove Panel BKT, Hinge BKT, Cover
6.
Remove Camera Module, Antenna, LCD Cable, Camera Cable
7.
remove TP Support BKT, TP Holder, KB Hook
8.
remove Hinge L&R, Type C BKT L&R, MB, Wlan Card, DB, Battery, Speaker
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.21 Total part disassembly
3.22 Remove Base Screw,TOP
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
Tool Size (if
applicable)
#1
Page 2
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