Advertisement
Quick Links
Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP OMEN X by HP 15 Laptop
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking, please contact
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries, excluding Li-Ion batteries.
Li-Ion batteries. Include all Li-Ion batteries if more than
one is provided with the product (such as a detachable
notebook keyboard battery, RTC coin cell, etc.)
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater than
100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring greater
than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
EL-MF877-00
Template Revision C
Last revalidation date 09-May-2018
Notes
With a surface greater than 10 sq cm
All types including standard alkaline, coin or button style
batteries
Battery(ies) are attached to the product by (check all
that apply with an "x" inside the "[ ]"):
[x] screws
[
[
[
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps 15.6"
DC Cable for External Power Supply
HPI instructions for this template are available at
HP's Sustainability
Contact.
] snaps
] adhesive
] other. Explain
EL-MF877-01
Quantity of
items
included in
product
4
1
1
1
Page 1
Advertisement
Related Manuals for HP OMEN X 15
Summary of Contents for HP OMEN X 15
- Page 1 Marketing Name / Model [List multiple models if applicable.] HP OMEN X by HP 15 Laptop Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
- Page 2 Quantity of items Item Description Notes included in product Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above) Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent including liquids, semi-liquids (gel/paste) and toner chambers, and service stations.
- Page 3 21. Dis-fasten hinge bkt screw *6 22. Remove LVDS FPC/ Backlight module / Hinge BKT*2PCS /Camera module 23. Remove Antenna module and Backlight DB 24. END 3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).
- Page 4 3.24 Remove SSD*2 PCS and Ram*2PCS 3.25 Dis-fasten Battery and speaker screw*7 3.26 Remove Battery and Speaker EL-MF877-00 Page 4 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01...
- Page 5 3.27 Dis-fasten IO BKT and DC BKT screw*4 3.28 Remove IO BKT and DC BKT 3.29 Dis-fasten Thermal model Screw*6 and Relase Thermal modle screw*7 EL-MF877-00 Page 5 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01...
- Page 6 3.30 Remove Thernal module and DC in Cable 3.31 Dis-fasten PCB screw *7 and 2 panel DB screw*2 3.32 Release KB FPC/ 2 panel DB /Antenna connector /IR FFC / LVDS FPC /Power FFC and Remove MB PCB EL-MF877-00 Page 6 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at...
- Page 7 3.33 Dis-fasten Cu plate screw *1/ Power screw*1 and IR DB screw*2 3.34 Remove Cu Plate and KB FPC 3.35 Remove 2 DB with 2 Panel FPC / IR DB with IR FFC and Power DB EL-MF877-00 Page 7 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01...
- Page 8 3.36 TOP remove release, dis-fasten Hinge screw *6 and remove LCD part 3.37 Remove Bezel , dis-fasten hinge cap screw*2 and remove hing cap*2PCS 3.38 Dis-fasten Hinge screw*6 EL-MF877-00 Page 8 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01...
- Page 9 3.39 Remove Panel Easy pull Adhesive 3.40 Remove Panel and Hinge*2PCS 3.41 Dis-fasten hinge bkt screw *6 EL-MF877-00 Page 9 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01...
- Page 10 3.42 Remove LVDS FPC/ Backlight module / Hinge BKT*2PCS /Camera module 3.43 Remove Antenna module and Backlight DB 3.44 END EL-MF877-00 Page 10 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01...