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Item Description
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Screw Driver
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1.
Remove Base Screw
2.
Remove Top
3.
Remove Bezel
4.
Remove Panel
5.
Remove Panel BKT, Hinge BKT, Cover
6.
Remove Camera Module, Antenna, LCD Cable, Camera Cable
7.
Remove TP Support BKT, TP Holder, KB Hook
8.
Remove Hinge L&R, Type C BKT L&R, MB, Wlan Card, DB, Battery, Speaker
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained
in the product that require selective treatment (with descriptions and arrows identifying locations).
3.21 Total part disassembly
EL-MF877-00
Template Revision C
Last revalidation date 09-May-2018
Notes
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
HPI instructions for this template are available at
EL-MF877-01
Quantity of
items
included in
product
Tool Size (if
applicable)
#1
Page 2
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