HP 11 G4 Maintenance And Service Manual page 35

11. Remove the keyboard/top cover.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the keyboard/top cover is removed. Thermal paste is used on
the processor (1) and the heat sink section (2) that services it.
Reverse this procedure to install the keyboard/top cover.
Component replacement procedures 29