HP 11t-f000 Maintenance And Service Manual page 30

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9.
Remove the keyboard/top cover (5).
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink
and the system board components each time the keyboard/top cover is removed. Thermal paste is used
on the processor (1) and the heat sink section (2) that services it.
22
Chapter 5 Removal and replacement procedures

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