HP Compaq 6735b Maintenance And Service Manual page 80

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70 Chapter 4 Removal and replacement procedures
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Lift the right side of the heat sink (1) until it releases from the system board components.
NOTE: Due to the adhesive quality of the thermal material located between the heat sink and
system board components, it may be necessary to move the heat sink from side to side to detach
it.
Remove the heat sink (2) by sliding it to the right.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Thermal pads are used on the
Northbridge chip (1) and the section of the heat sink (1) that services it. Thermal paste is used on
the processor (2) and the section of the heat sink (2) that services it. Replacement thermal material
is included with all heat sink, system board, and processor spare part kits.
NOTE: Steps 5 through 8 apply only to HP Compaq 6735b computer models. See steps 1 through
4 for removing the heat sink on HP Compaq 6730b computer models.
Remove the two Phillips PM2.0×4.0 screws (1) that secure the heat sink clips to the heat sink.
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