HCD-RG222
5-17. PRINTED WIRING DIAGRAM – AMP SECTION (EXCEPT AEP, UK, RU) –
1
2
A
B
C
D
1
MAIN
BOARD
CN307
(Page 29)
E
13
F
G
• See page 21 for Circuit Boards Location.
3
4
(EXCEPT AEP, UK, RU)
SPEAKER
(IMPEDANCE USE 6–16 )
R
L
(CHASSIS)
E
E
E
3
1
TRANS
(CHASSIS)
BOARD
CN905
(Page 38)
•
: Uses unleaded solder.
5
6
7
IC441
E
E
E
40
40
8
9
10
• Semiconductor
Location
Ref. No. Location
D401
D441
D442
D443
D481
D482
D483
IC441
Q441
Q442
Q481
Q482
Q483
Q484
Q485
Q486
Q487
Q488
Q489
E
E
E
E
(CHASSIS)
F-3
D-6
D-6
D-2
D-6
D-4
C-9
B-7
D-6
D-6
D-9
D-8
D-8
D-8
C-4
C-4
C-4
C-5
C-9