Specifications; Table 3. Technical Specifications - Dell PowerEdge R630 Technical Manual

Feature PowerEdge R620
Support for internal Yes (available through CFI or field upgrade
GPU only)
Power efficiency Titanium, Platinum+, Platinum
Hot-plug drives
Hot-plug redundant cooling
Availability
Hot-plug redundant power supply units
Internal dual SD module support
1
GB means 1 billion bytes and TB equals 1 trillion bytes; actual capacity varies with preloaded material and operating
environment and will be less.
2
750W mixed mode PSU available only in China.

Specifications

Table 3 summarizes the specifications for the PowerEdge R630 features. For the latest information
on supported features for the PowerEdge R630, visit the R630 page on Dell.com.
Feature
Form factor
Processors
Processor sockets
Internal
interconnect
Cache
Chipset
1
Memory
I/O slots
RAID controller
Disk drives
10 PowerEdge R630 Technical Guide
Table 3. Technical specifications
PowerEdge R630 technical specification
1U rack
Intel Xeon processor E5-2600 v3 product family
2 sockets
2 Intel Quick Path Interconnect (QPI) links: up to 9.6GT/s
2.5MB per core; core options: 4, 6, 8, 10, 12, 16, 18
Intel C610 series chipset
Up to 768GB (24 DIMM slots): 4GB/8GB/16GB/32GB DDR4 up to 2133MT/s
Up to 3 x PCIe 3.0 slots plus dedicated PERC slot
Internal controllers: PERC S130 (SW RAID), PERC H330, PERC H730, PERC H730P
External HBAs (RAID): PERC H830
External HBAs (non-RAID): 12Gb/s SAS HBA
Internal hard drive bay and hot-plug backplane:
Up to 24 x 1.8" SATA SSD
Up to 10 x 2.5" HDD: SAS, SATA, nearline SAS SSD: SAS, SATA, Up to 4 NVMe PCIe
Up to 8 x 2.5" HDD: SAS, SATA, nearline SAS SSD: SAS, SATA
PowerEdge R630
Not supported
Titanium, Platinum+, Platinum
Hot-plug drives
Hot-plug redundant cooling
Hot-plug redundant power supply units
Internal dual SD module support (next
generation)