Intel 80386 Reference Manual page 12

TABLE OF CONTENTS
9.5.4 MUL TIBUS® I Power Failure Handling ....................................................... .
9.6 iLBX™ Bus Expansion .................................................................................. .
9.7 Dual-Port RAM with MUL TIBUS® I ............................................................... .
9.7.1 Avoiding Deadlock with Dual-Port RAM
CHAPTER 10
MUL TIBUS® II AND 80386
10.1 MUL TIBUS® II Standard
10.2 Parallel System Bus (iPSB) ......................................................................... .
10.2.1 iPSB Interface ......................................................................................... .
10.2.1.1 BAC Signals ......................................................................................... .
10.2.1.2 MIC Signals .......................................................................................... .
10.3 Local Bus Extension (iLBXTM II) ................................................................... .
10.4 Serial System Bus (iSSB) ........................................................................... .
CHAPTER 11
PHYSICAL DESIGN AND DEBUGGING
Page
9-17
9-18
9-19
9-20
10-1
10-1
10-2
10-4
10-6
10-7
10-7
11.1 Power and Ground Requirements ........................ .................................. ..... 11-1
11 .1.1 Power and Ground Planes ........................................... ..................... ....... 11-1
11 .1.2 Decoupling Capacitors ................................................ ..................... ........ 11-2
11.2 High-Frequency Design Considerations .................... .......................... ........ 11-3
11 .2.1 Line Termination ................................................................ ............ ........... 11-4
11.2.2 Interference ....... ..... .................. .............. .................................................. 11-5
11.2.3 Latchup .................................................................................................... 11-7
11.3 Clock Distribution and Termination ............................... ............. ........ ......... 11-7
11.4 Thermal Characteristics ............................................................................... 11-7
11.5 Debugging Considerations .............................................. ............................ 11-10
11.5.1 Hardware Debugging Features ................................................................ 11-10
11.5.2 Bus Interface ......... ................... ................................................................ 11-11
11.5.3 Simplest Diagnostic Program ......... .......................................................... 11-11
11.5.4 Building and Debugging a System Incrementally...................................... 11-12
11.5.5 Other Simple Diagnostic Software ........................................................... 11-14
11.5.6 Debugging Hints ........... ..... ....................................................................... 11-14
CHAPTER
12
TEST CAPABILITIES
12.1 Internal Tests ............................................................................................. .
12.1.1 Automatic Self-Test ................................................................................ ..
12.1.2 Translation Lookaside Buffer Tests ........................................................ ..
12.2 Board-Level Tests
ix
12-1
12-1
12-2
12-5