3 7 63 1515 0
NOTES ON HANDLING THE OPTICAL PICK-
UP BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static breakdown because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also
use the procedure in the printed matter which is included in the
The flexible board is easily damaged and should be handled with
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
If the optical pick-up block is defective, please replace the whole
optical pick-up block.
Never turn the semi-fixed resistor located at the side of optical
The CLASS 1 LASER PRODUCT label is
located on the rear exterior.
LASER RADIATION WHEN OPEN
DO NOT STARE INTO BEAM OR
VIEW DIRECTLY WITH OPTICAL INSTRUMENTS
This label is located on the drive unit's internal chassis.
When replacing the chassis (U.S) sub assy of mechanism deck
which have the "CAUTION LABEL" attached, please be sure to
put a new CAUTION LABEL (3-223-913-11) to the chassis (U.S)
DISC MAGAZINE GETTING OUT PROCEDURE
ON THE POWER SUPPLY IS OFF
Remove the COVER (LOWER.T) ass'y beforehand
1) Press the lever (ML.S) to arrow direction.
2) Removal the magazine assy.
Note: Take out the magazine only when the tray is completely within the
magazine. If the disk or tray is sticking out, turn on the power and
eject the magazine.
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COM-
POSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.