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Safety Information, General Notes & Lead Free Requirements - Philips DVP3320X/78 Service Manual

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EN 6
2.
Safety Information, General Notes & Lead Free Requirements
4
4
DVP20
DVP20
3139 785 3093x
EN 6
2.
Video Plus
"Video Plus+" and "PlusCode" are registered trademarks of
Due to lead-free technology some rules have to be respected by the
the Gemstar Development Corporation. The "Video Plus+"
workshop during a repair:
Video Plus
system is manufactured under licence from the Gemstar
Vídeo Plus
"Video Plus+" and "PlusCode" are registered trademarks of
Development Corporation.
"Video Plus+" e "Plus Code" são marcas registradas do Gemstar
the Gemstar Development Corporation. The "Video Plus+"
Development Corporation. O sistema "Video Plus+" é fabricado
system is manufactured under licence from the Gemstar
sob a licença da Gemstar Development Corporation.
Development Corporation.
Figura 2-
Figure 2-5
Microvision
Macrovision
Este produto incorpora tecnológia de proteção de cópia que é
This product incorporates copyright protection technology that
o metódo de proteção exigido da certificado U.S de patentes e
is protected by method claims of certain U.S. patents and
Macrovision
outros proprietários intelectuais da própria Macrovision Corpora-
other intellectual property rights owned by Macrovision
This product incorporates copyright protection technology that
tion.
Corporation and other rights owners.
is protected by method claims of certain U.S. patents and
O uso desta tecnologia de proteção de cópia deve ser autorizada
Use of this copyright protection technology must be
other intellectual property rights owned by Macrovision
pela Macrovision Corporation e é permitido para casas e outros
authorized by Macrovision Corporation, and is intended for
Corporation and other rights owners.
limites somente com autorização da Macrovision Corporation. A
home and other limited viewing uses only unless otherwise
Use of this copyright protection technology must be
desmontagem é proíbida.
authorized by Macrovision Corporation. Reverse engineering
authorized by Macrovision Corporation, and is intended for
or disassembly is prohibited.
home and other limited viewing uses only unless otherwise
2. Solda sem chumbo
authorized by Macrovision Corporation. Reverse engineering
2.3
Lead Free Requirement
or disassembly is prohibited.
A Philips CE está produzindo aparelhos sem chumbo (PBF) de
1.1.2005 para frente.
Information about Lead-free produced sets
2.3
Lead Free Requirement
Identificação: A etiqueta de modelo tem um número de série de 14
Philips CE is starting production of lead-free sets from
dígitos. Os dígitos 5 e 6 referem-se ao ano de produção, os dígitos
Information about Lead-free produced sets
1.1.2005 onwards.
7 e 8 referem-se à semana de produção (no exemplo abaixo, é
1991 na semana 18).
Philips CE is starting production of lead-free sets from
INDENTIFICATION:
1.1.2005 onwards.
Regardless of special logo (not always indicated)
INDENTIFICATION:
One must treat all sets from 1 Jan 2005 onwards, according
Regardless of special logo (not always indicated)
next rules.
Apesar do logo especial sem chumbo (que nem sempre é
indicado),todos os aparelhos desta data pra frente de acordo com
One must treat all sets from 1 Jan 2005 onwards, according
Example S/N:
as regras descritas abaixo.
next rules.
Example S/N:
Com a tecnologia sem chumbo, algumas regras devem ser respei-
Bottom line of typeplate gives a 14-digit S/N. Digit 5&6 is the year, digit 7&8 is
tadas pelo posto autorizado durante o reparo:
the week number, so in this case 1991 wk 18
Use apenas ferramentas de solda sem chumbo Philips SAC305
com o código de pedido 0622 149 00106. Se a pasta de solda sem
So from 0501 onwards = from 1 Jan 2005 onwards
Bottom line of typeplate gives a 14-digit S/N. Digit 5&6 is the year, digit 7&8 is
chumbo for necessária, por favor contate o fabricante do equi-
the week number, so in this case 1991 wk 18
pamento de solda. No geral, o uso de pasta de solda em postos
For additional questions please contact your local repair-helpdesk.
So from 0501 onwards = from 1 Jan 2005 onwards
deve ser evitada pois a pasta não é facilmente manuseada nem
Important note: In fact also products of year 2004 must be treated in this way as long as you
avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher
armazenada.
temperatures belong to this.
Use apenas ferramentas de solda aplicáveis para ferramenta de
Important note: In fact also products of year 2004 must be treated in this way as long as you
solda sem chumbo. A ferramenta de solda deve:
avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher
-
Alcançar na ponta da ferramenta a temperatura de pelo menos
temperatures belong to this.
400
o
-
Estabilizar o ajuste de temperatura na ponta da solda.
-
Troque a ponta de solda para diferentes aplicações.
Ajuste sua ferramenta de solda para que a temperatura de 360
- 380
seja alcançada e estabilizada na junção da solda. O tempo
o
de aquecimento da junção da solda não deve exceder ~ 4s. Evite
temperaturas acima de 400
irá aumentar drasticamente e o fluxo- fluido será destruído. Para
evitar "wear-out" de pontas, desligue o equipamento quando não
usado ou reduza a temperatura.
Misturar parte/ ferramenta de solda sem chumbo com partes/
ferramentas de solda com chumbo é possível mas a PHILIPS
recomenda que se evite isso. Se não puder ser evitado, cuidado-
samente limpe a solda da antiga ferramenta e re-solde com uma
nova ferramenta.
Use apenas peças originais listadas no Manual de Serviço. Mate-
riais padrão não listados (comodities) devem ser comprados em
3139 785 3093x
Safety Information, General Notes & Lead Free Requirements
Use only lead-free solder alloy Philips SAC305 with order
code 0622 149 00106. If lead-free solder-pate is required,
please contact the manufacturer of your solder-equipment.
In general use of solder-paste within workshops should be
avoided because paste is not easy to store and to handle.
Use only adequate solder tools applicable for lead-free
solder alloy. The solder tool must be able
o To reach at least a solder-temperature of 400°C,
Figure 2-5
o To stabilize the adjusted temperature at the solder-tip
o To exchange solder-tips for different applications.
Adjust your solder tool so that a temperature around 360°C
– 380°C is reached and stabilized at the solder joint.
Heating-time of the solder-joint should not exceed ~ 4 sec.
Avoid temperatures above 400°C otherwise wear-out of tips
will rise drastically and  ux- uid will be destroyed. To avoid
wear-out of tips switch off un-used equipment, or reduce
heat.
Mix of lead-free solder alloy / parts with leaded solder alloy
/ parts is possible but PHILIPS recommends strongly to
avoid mixed solder alloy types (leaded and lead-free).
If one cannot avoid or does not know whether product is
lead-free, clean carefully the solder-joint from old solder
alloy and re-solder with new solder alloy (SAC305).
Use only original spare-parts listed in the Service-Manuals.
Not listed standard-material (commodities) has to be
purchased at external companies.
Special information for BGA-ICs:
- always use the 12nc-recognizable soldering temperature
pro le of the speci c BGA (for de-soldering always use the
lead-free temperature pro le, in case of doubt)
- lead free BGA-ICs will be delivered in so-called 'dry-
packaging' (sealed pack including a silica gel pack) to
protect the IC against moisture. After opening, dependent
of MSL-level seen on indicator-label in the bag, the
BGA-IC possibly still has to be baked dry. (MSL=Moisture
Sensitivity Level). This will be communicated via AYS-
website.
Do not re-use BGAs at all.
For sets produced before 1.1.2005 (except products of
2004), containing leaded solder-alloy and components,
all needed spare-parts will be available till the end of the
service-period. For repair of such sets nothing changes.
On our website www.atyourservice.ce.Philips.com you
 nd more information to:
BGA-de-/soldering (+ baking instructions)
Heating-pro les of BGAs and other ICs used in Philips-sets
You will  nd this and more technical information within the
"magazine", chapter "workshop news".
, ou então "wear-out" das pontas
o
Safety Information, General Notes & Lead Free Requirements
Due to lead-free technology some rules have to be respected by the
workshop during a repair:
Due to lead-free technology some rules have to be respected by the
Use only lead-free solder alloy Philips SAC305 with order
workshop during a repair:
companhias externas.
code 0622 149 00106. If lead-free solder-pate is required,
Informações especiais para ICs BGA sem chumbo: estes ICs
please contact the manufacturer of your solder-equipment.
serão entregues no chamado "pacote a seco" para proteger o IC
Use only lead-free solder alloy Philips SAC305 with order
In general use of solder-paste within workshops should be
contra umidade. Este pacote só pode ser aberto pouco antes de
code 0622 149 00106. If lead-free solder-pate is required,
avoided because paste is not easy to store and to handle.
ser usado (soldado). Ou então o corpo do IC fica "molhado" dentro
please contact the manufacturer of your solder-equipment.
Use only adequate solder tools applicable for lead-free
e durante o tempo de aquecimento a estrutura do IC será destru-
In general use of solder-paste within workshops should be
solder alloy. The solder tool must be able
ída por causa da alta temperatura dentro do corpo. Se o pacote for
avoided because paste is not easy to store and to handle.
o To reach at least a solder-temperature of 400°C,
aberto antes do uso, o IC deve ser esquentado por algumas horas
Use only adequate solder tools applicable for lead-free
o To stabilize the adjusted temperature at the solder-tip
(em torno de 90
solder alloy. The solder tool must be able
o To exchange solder-tips for different applications.
USE BGAs de modo algum!
o To reach at least a solder-temperature of 400°C,
Adjust your solder tool so that a temperature around 360°C
Para produtos produzidos ante de 1.1.2005, contendo ferramenta
o To stabilize the adjusted temperature at the solder-tip
– 380°C is reached and stabilized at the solder joint.
de solda com chumbo e componentes, toda a lista de peças será
o To exchange solder-tips for different applications.
Heating-time of the solder-joint should not exceed ~ 4 sec.
avaliada até o fim do período de serviço. Para reparo destes
Adjust your solder tool so that a temperature around 360°C
Avoid temperatures above 400°C otherwise wear-out of tips
aparelhos, nada muda.
– 380°C is reached and stabilized at the solder joint.
will rise drastically and  ux- uid will be destroyed. To avoid
No website
Heating-time of the solder-joint should not exceed ~ 4 sec.
www. atyourservice.ce.Philips.com
wear-out of tips switch off un-used equipment, or reduce
informações sobe:
Avoid temperatures above 400°C otherwise wear-out of tips
heat.
(De) Solda BGA (+ instruções de operação).
will rise drastically and  ux- uid will be destroyed. To avoid
Mix of lead-free solder alloy / parts with leaded solder alloy
Perfis de aquecimento dos BGAs e outros ICs usados em apare-
wear-out of tips switch off un-used equipment, or reduce
/ parts is possible but PHILIPS recommends strongly to
lhos Philips.
heat.
avoid mixed solder alloy types (leaded and lead-free).
Mix of lead-free solder alloy / parts with leaded solder alloy
If one cannot avoid or does not know whether product is
Você encontra estas e mais informações técnicas em "magazine",
/ parts is possible but PHILIPS recommends strongly to
lead-free, clean carefully the solder-joint from old solder
capítulo "workshop news".
avoid mixed solder alloy types (leaded and lead-free).
alloy and re-solder with new solder alloy (SAC305).
If one cannot avoid or does not know whether product is
Use only original spare-parts listed in the Service-Manuals.
Para questões adicionais, por favor, contate o help desk local.
lead-free, clean carefully the solder-joint from old solder
Not listed standard-material (commodities) has to be
alloy and re-solder with new solder alloy (SAC305).
purchased at external companies.
Use only original spare-parts listed in the Service-Manuals.
Special information for BGA-ICs:
. Instrução de Uso
Not listed standard-material (commodities) has to be
- always use the 12nc-recognizable soldering temperature
purchased at external companies.
pro le of the speci c BGA (for de-soldering always use the
Veja o Manual no GIP.
Special information for BGA-ICs:
lead-free temperature pro le, in case of doubt)
- always use the 12nc-recognizable soldering temperature
- lead free BGA-ICs will be delivered in so-called 'dry-
pro le of the speci c BGA (for de-soldering always use the
packaging' (sealed pack including a silica gel pack) to
lead-free temperature pro le, in case of doubt)
protect the IC against moisture. After opening, dependent
- lead free BGA-ICs will be delivered in so-called 'dry-
of MSL-level seen on indicator-label in the bag, the
packaging' (sealed pack including a silica gel pack) to
BGA-IC possibly still has to be baked dry. (MSL=Moisture
protect the IC against moisture. After opening, dependent
Sensitivity Level). This will be communicated via AYS-
of MSL-level seen on indicator-label in the bag, the
website.
BGA-IC possibly still has to be baked dry. (MSL=Moisture
Do not re-use BGAs at all.
Sensitivity Level). This will be communicated via AYS-
website.
For sets produced before 1.1.2005 (except products of
Do not re-use BGAs at all.
2004), containing leaded solder-alloy and components,
all needed spare-parts will be available till the end of the
For sets produced before 1.1.2005 (except products of
service-period. For repair of such sets nothing changes.
2004), containing leaded solder-alloy and components,
all needed spare-parts will be available till the end of the
On our website www.atyourservice.ce.Philips.com you
service-period. For repair of such sets nothing changes.
 nd more information to:
On our website www.atyourservice.ce.Philips.com you
BGA-de-/soldering (+ baking instructions)
 nd more information to:
Heating-pro les of BGAs and other ICs used in Philips-sets
BGA-de-/soldering (+ baking instructions)
You will  nd this and more technical information within the
Heating-pro les of BGAs and other ICs used in Philips-sets
"magazine", chapter "workshop news".
You will  nd this and more technical information within the
"magazine", chapter "workshop news".
For additional questions please contact your local repair-helpdesk.
For additional questions please contact your local repair-helpdesk.
o
) Para secar (pense na proteção ESD!). NÃO RE-
o
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