Sony MEX-BT2707E Service Manual page 2

MEX-BT2700/BT2707E/BT2750
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Wireless Communication
Communication System:
Bluetooth Standard version 2.0
Output:
Bluetooth Standard Power Class 2
(Max. +4 dBm)
Maximum communication range:
1
Line of sight approx. 10 m (33 ft)*
Frequency band:
2.4 GHz band (2.4000 – 2.4835 GHz)
Modulation method: FHSS
2
Compatible Bluetooth Profiles* :
A2DP (Advanced Audio Distribution Profile)
AVRCP (Audio Video Remote Control Profile)
HFP (Handsfree Profile) 1.5
HSP (Headset Profile)
*1 The actual range will vary depending on factors
such as obstacles between devices, magnetic
fields around a microwave oven, static electricity,
reception sensitivity, antenna's perfomance,
operating system, software application, etc.
*2 Bluetooth standard profiles indicate the purpose
of Bluetooth communication between devices.
Power amplifier section
Output: Speaker outputs (sure seal connectors)
Speaker impedance: 4 – 8 ohms
Maximum power output: 52 W 4 (at 4 ohms)
General
Outputs:
Audio outputs terminal (front, sub/rear switchable)
Subwoofer output terminal (mono)
(BT2700/BT2707E only)
Power antenna (aerial) relay control terminal
Power amplifier control terminal
Inputs:
Remote controller input terminal
Antenna (aerial) input terminal
Telephone ATT control terminal
BUS control input terminal
BUS audio input terminal
AUX input jack (stereo mini jack)
Tone controls:
Low: ±10 dB at 60 Hz (XPLOD)
Mid: ±10 dB at 1 kHz (XPLOD)
High: ±10 dB at 10 kHz (XPLOD)
Power requirements: 12 V DC car battery
(negative ground (earth))
Dimensions: Approx. 178 50 179 mm
TE
L 13942296513
1 1
(7 / 2 7 / in) (w/h/d)
8 8
Mounting dimensions: Approx. 182 53 162 mm
1 1 1
(7 / 2 / 6 / in) (w/h/d)
4 8 2
Mass: Approx. 1.2 kg (2 lb 11 oz)
Supplied accessories:
Card remote commander: RM-X304
Parts for installation and connections (1 set)
Your dealer may not handle some of the above listed
accessories. Please ask the dealer for detailed
information.
Design and specifications are subject to change
without notice.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
www
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
repairing.
.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
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• US and Canadian models:
CAUTION
The use of optical instruments with this
product will increase eye hazard.
• Except US and Canadian models:
This label is located on the bottom of the
chassis.
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
co
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
.
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
9 4 2 8
0 5 8 2 9 9 4 2 8
WITH SONY PARTS
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