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Philips Semiconductors
Power stage 2 x 15 to 25 W class-D
audio amplifier
16 PACKAGE OUTLINES
RDBS17P: plastic rectangular-DIL-bent-SIL power package; 17 leads
(row spacing 2.54 mm)
1
Z
DIMENSIONS (mm are the original dimensions)
UNIT
A
A
2
4.6
0.75
mm
13.5
4.4
0.60
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT577-2
2004 May 06
D
d
e
1
b
p
e
(1)
b
c
D
d
D
p
h
0.48
24.0
20.0
10
0.38
23.6
19.6
IEC
JEDEC
non-concave
E h
j
17
w
M
0
5
10 mm
scale
(1)
E
e
e
e
1
2
12.2
2.54
1.27
2.54
11.8
REFERENCES
JEITA
19
D
h
x
view B: mounting base side
A
2
B
A
L
Q
c
e
2
v
M
L
1
E
j
L
L
Q
h
1
3.4
3.75
3.75
2.1
6
3.1
3.15
3.15
1.8
EUROPEAN
PROJECTION
Product specification
TDA8925
SOT577-2
E
(1)
v
w
x
Z
2.00
0.6
0.4
0.03
1.45
ISSUE DATE
01-01-05
03-03-12
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