Table of Contents
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Repair and Maintenance Guidelines
ESD Precautions
Soldering Printed
Circuit Boards
Post-Repair Safety
Checks
84 Service
This section provides guidelines for repairing and maintaining the
HP E1340A AFG, including:
•
ESD precautions
•
Soldering printed circuit boards
•
Post-repair safety checks
Electrostatic discharge (ESD) may damage static sensitive devices in the
HP E1340A AFG. This damage can range from slight parameter
degradation to catastrophic failure. When handling AFG assemblies,
follow these guidelines to avoid damaging AFG components:
•
Always use a static-free work station with a pad of
conductive rubber or similar material when handling
AFG components.
•
If a device requires soldering, be sure the assembly is
placed on a pad of conductive material. Also, be sure that
you, the pad, and the soldering iron tip are grounded to
the assembly.
The etched circuit boards in the AFG have plated through-holes that allow a
solder path to both sides of the insulating material. Soldering can be done
from either side of the board with equally good results. When soldering to
any circuit board, keep in mind the following guidelines:
•
Avoid unnecessary component unsoldering and
soldering. Excessive replacement can result in damage to
the circuit board and/or adjacent components.
•
Do not use a high power soldering iron on etched circuit
boards, as excessive heat may lift a conductor or damage
the board.
•
Use a suction device or wooden toothpick to remove
solder from component mounting holes. When using a
suction device, be sure that the equipment is properly
grounded.
After making repairs to the HP E1340A AFG, inspect the AFG for any
signs of abnormal internally generated heat, such as discolored printed
circuit boards or components, damaged insulation, or evidence of arcing.
Determine and correct the cause of the condition. Then perform the
Self-Test described in Chapter 2 to verify that the AFG is functional.
Chapter 5
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