Table of Contents
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Contents
Contents
1.0
Product Description ................................................................................................... 7
1.1
Overview .......................................................................................................... 7
1.1.1
Feature Summary ................................................................................... 7
1.1.2
Board Layout .......................................................................................... 9
1.2
Processors........................................................................................................ 11
1.3
System Memory ................................................................................................ 11
1.3.1
DDR2-400 DIMM Slot Populations ............................................................. 11
1.3.2
DDR2 DIMM Ordering Overview................................................................ 13
®
1.4
3100 Chipset........................................................................................... 15
1.4.1
On-Board Peripherals .............................................................................. 15
1.4.2
On-Board I/O......................................................................................... 16
1.4.3
I/O Slots for Expansion Capabilities .......................................................... 18
1.4.4
Rear Panel I/O Connectors....................................................................... 19
1.4.5
Hardware Server Management Features .................................................... 20
1.5
Supported Operating Systems............................................................................. 21
1.6
Supported BIOS Features ................................................................................... 22
1.6.1
ACPI..................................................................................................... 22
1.7
Power Supply.................................................................................................... 23
1.8
Thermal and Mechanical Components................................................................... 23
1.8.1
Heatsinks .............................................................................................. 24
1.9
Physical and Mechanical Board Specifications ........................................................ 26
1.9.1
Mounting Holes ...................................................................................... 26
1.10
Debug Ports ..................................................................................................... 26
1.11
Real Time Clock (RTC), CMOS SRAM, and Battery .................................................. 26
2.0
Platform Setup ........................................................................................................ 27
2.1
Connecting the Wires ......................................................................................... 27
2.1.1
Connect SATA cables .............................................................................. 28
2.1.2
Plugging In Memory................................................................................ 28
2.1.3
Connecting the Processor ........................................................................ 29
2.1.4
Connecting Heatsinks and Fans ................................................................ 29
2.2
Connecting Other Peripherals .............................................................................. 31
2.2.1
Add-in Connectors .................................................................................. 31
2.2.2
Rear Panel Connectors ............................................................................ 32
2.2.3
Connecting a Floppy Drive ....................................................................... 33
2.2.4
Changing and/or Updating the BIOS Chip .................................................. 33
2.2.5
Changing the CMOS Battery and Clearing CMOS ......................................... 34
2.3
Connect Power .................................................................................................. 34
2.4
Turning On and Resetting the Board .................................................................... 37
3.0
Technical Reference ................................................................................................ 38
3.1
Memory Resources ............................................................................................ 38
3.2
DMA Channels .................................................................................................. 38
3.3
Fixed I/O Map ................................................................................................... 38
3.4
Interrupts ....................................................................................................... 38
3.5
PCI Conventional Interrupt Routing Map ............................................................... 39
3.6
Connectors ....................................................................................................... 40
3.6.1
Back Panel Connectors ............................................................................ 40
3.6.2
Component Side Connectors ................................................................... 40
3.7
Jumper Block .................................................................................................... 44
3.8
Mechanical Considerations .................................................................................. 47
3.8.1
Form Factor........................................................................................... 47
January 2007
Order Number: 315879-002
®
®
Xeon
Processor LV and Intel
D ua l-C o re In te l
®
3100 Chipset Development Kit
User's Manual
3
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