6.8.7 Mobile unit faulty due to humidity
Note: Due to some measures in order to reduce humidity damages (coating on the
board (keypad side), keypad optimised...) the scrap criteria for humidity damages
- Boards with oxidation on the keypad side do not have to be scrapped any more
because a coating on the board prevents that humidity gets to the other layer.
- Boards with humidity damages on the component side still have to be scrapped.
Look at all electronic components on the back side. Do not open the RF-Part.
Remaining flux on the component side could look similar to a humidity damage (white
deposits) but it will disappear when heating it up with a hot air blower.
When you are not sure whether deposit is humidity or flux, heat the area concerned
with a hot air blower and scrap the unit only when deposit doesn't disappear.
ICM D CC ST