Vibration And Shock - IBM C1B 1.12 Brick On Sled Carrier 128-pin HPC Specification Sheet

O E M FUNCTIONAL SPECIFICATION ULTRASTAR XP (DFHC) SSA MODELS 1.12/2.25 GB - 1.0" H I G H
Notes: 1) Center thermocouple on the top surface of the module.
2) If copper tape is used to attach temperature sensors, it should be no
larger than 6 mm square.
3) Dimensions are in millimeters.
4) The connector (on the left edge) does not represent SSA connector.
Figure 23. Temperature Measurement Points for all Models (bottom view)

7.2 Vibration and Shock

The operating vibration and shock limits in this specification are verified in two mount configurations for
CxC models:
1. By mounting with the 6-32 bottom holes with the drive on 2 mm clearance as required by 4.1.2,
"Clearances" on page 51
2. By mounting on any two opposing pairs of the 6-32 side mount holes.
CxB models are mounted rigidly to the test fixture using the carrier guides, connector, and latch mechanism.
The test fixture is then mounted to the vibration table (the test fixture must not have any resonance within
the frequencies tested).
Other mount configurations may result in different operating vibration and shock performance.
Source filename=OPLIMITS
USER RESPONSIBLE F O R VERIFYING VERSION A N D COMPLETENESS
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