Septum Purge - HP 5890 Series II Plus Reference Manual

Hewlett-packard reference manual
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Inlet Systems
Packed column inlet
Figure 6-4
Bottom of Sep-
tum
10
20
30
40
Syringe Tip
50
60
70
80
90
Base of Injection
Port
Thermal Profiles
This optimized thermal profile allows very reproducible results and
virtually eliminates injection port discrimination against high boiling
point components. When combined with fast automated injection,
excellent quantitative accuracy is possible.

Septum purge

Best results are obtained by running a very low septum purge flow (1 to
2 ml/min. of purge flow is recommended•never more than 10% of column
flow rate). Once the purge flow has been set, it will remain constant,
regardless of changes in column head pressure or column flow rate. An
alternate septum nut is provided which allows operation without purge
flow if desired.
35
C
Ove
n
50
100
150
Temperature in Gas Stream — C
Injection Port Setpoint
Temperature 350 C
150 C
300
Oven
C
Oven
200
250
300
350
400
105

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5890 series ii5890 ii series5890 ii plus series

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