HP PAVILION DM3 Maintenance And Service Manual page 79

4. Remove the fan/heat sink assembly (7) by lifting straight up.
Reverse this procedure to install the fan/heat sink assembly.
The thermal material must be thoroughly cleaned from the surface of the fan/heat sink assembly (1),
(3) and the processor (2) and video components (4) each time the fan/heat sink assembly is
removed. Thermal pads and thermal paste must be installed on all surfaces before the fan/heat sink
assembly is reinstalled.
NOTE: Thermal pads and thermal paste are included with all fan/heat sink assembly, system board,
and processor spare part kits.
The following illustration shows the locations for thermal material on systems with UMA graphics
subsystems.
The thermal material must be thoroughly cleaned from the surface of the fan/heat sink assembly (1)
and (3), and the processor component (2), each time the fan/heat sink assembly is removed. Thermal
Component replacement procedures 71