Schematic Diagrams - Sony SCD-XB770 Service Manual

5-6. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• Main board is multi-layer printed board.
However, the patterns of intermediate-layer have not been
included in diagram.
• Indication of transistor
C
Q These are omitted.
B E
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in and 1 / W or less unless otherwise
4
specified.
• : internal component.
f
• 5 : fusible resistor.
• C : panel designation.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : SACD PLAY
( ) : CD PLAY
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J : SACD PLAY
c : CD PLAY (ANALOG OUT)
I : CD PLAY (DIGITAL OUT)
• Circuit Boards Location
TRANS board
AC SW board
HP board
KEY board
DISPLAY board
31 31
POWER board
RF board
AUDIO board
LOADING board MAIN board
SCD-XB770