Product Specifications - Foxconn H61MXV Series User Manual

1-1 Product Specifications

CPU
Chipset
Memory
Expansion Slots
Storage
LAN
Audio
USB
Back Panel
Connectors
Internal Connectors
Support LGA1155 socket Intel
For the latest CPU information, please visit：
http://www.foxconnsupport.com/cpusupportlist.aspx
Intel H61 (H61MXV)
®
Intel H67 (H67MXV)
®
2 x 240-pin DDR3 DIMMs
Support up to 8GB of system memory
D ual channel DDR3 1800(oc*)/1600(oc*)/1333/1066MHz architecture
(oc*: overclocking)
1 x PCI Express x16 slot
2 x PCI Express x1 slots
4 x SATA 2.0 connectors (H61MXV)
2 x SATA 2.0 connectors, 2 x SATA 3.0 connectors (H67MXV)
SATA 2.0 connectors support up to 300MB/s data transfer rate
SATA 3.0 connectors support up to 600MB/s data transfer rate
Support RAID 0, 1, 5 and 10 (H67MXV)
Support hot plug and NCQ (Native Command Queuing )
Realtek RTL8111E Gigabit LAN chip
(Co-lay Realtek RTL8105E 10/100Mb/s LAN chip)
Realtek ALC662 (Co-lay ALC888S) audio chip:
- High Definition Audio
- 2/4/5.1-channel audio ports (7.1-channel audio ports for option)
- Support for S/PDIF Out
- Support Jack-Sensing function
H61/H67 chipset:
- Support up to 10 x USB 2.0 ports (6 rear panel ports, 2 onboard USB
headers supporting 4 extra ports)
- Support USB 2.0 protocol up to 480Mb/s
- Support hot plug
1 x PS/2 mouse port
1 x PS/2 keyboard port
1 x VGA port
1 x Serial port
1 x DVI-D port
6 x USB 2.0 ports
1 x RJ-45 LAN port
5.1-channel Audio ports (7.1-channel audio ports for option)
1 x 24-pin ATX main power connector
1 x 4-pin ATX 12V power connector
4 x SATA 2.0 connectors (H61MXV)
(Continued on the next page)
CPU, Max processor power up to 95W
®
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