Product Description; Overview; Feature Summary - Intel DB85FL Specification

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Product Description

1.1

Overview

1.1.1

Feature Summary

Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
Processor
Graphics
Memory
Chipset
MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters])
th ®
• 4 generation Intel Core™ processor with up to 95 W TDP in an LGA1150
socket
― One PCI Express* x16 graphics interface
― Integrated memory controller with dual channel DDR3 memory support
― Integrated graphics processing
― External graphics interface controller
• Integrated graphics support for processors with Intel HD Graphics:
― High Definition Multimedia Interface* (HDMI*) v1.4a
― DVI-I v1.0
• Support for a PCI Express 3.0 x16 add-in graphics card
• Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1333 MHz to DDR3 1600 MHz DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 32 GB of system memory with four DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.5 V (standard voltage) and 1.35 V (low voltage) JEDEC memory
• Support for XMP memory
®
Intel B85 Express Chipset consisting of the Intel
Controller Hub (PCH)
®
B85 Express Platform
continued
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